
OCP Global Summit (San Jose, USA)OCP Global Summit
OCP Global Summit (San Jose, USA) Profile
The OCP Global Summit (San Jose) is the premier event bringing together the most forward-thinking minds in open IT ecosystem development. The summit provides a unique platform for the global community to share insights, foster partnerships, and showcase the latest advancements in open hardware and software.
At the global summit, industry leaders, researchers, and pioneers from the open community will engage in dynamic dialogues, inspiring workshops, and interactive engineering sessions. These activities aim to deepen our understanding of the project's progress, as well as future challenges and pathways. Attendees will explore emerging trends, tackle complex challenges, and discover new opportunities driving global innovation. Through this collaborative spirit, we aim to accelerate the development of efficient, scalable, and sustainable open computing solutions to power the future of technology.
Initiated by Meta (formerly Facebook), the OCP Global Summit is the world's largest open-source hardware event. It not only defines the technological trajectory for future data centers, AI servers, high-speed cables, and connectors but also serves as a core stage for global tech giants (such as Meta, Google, Microsoft, NVIDIA, Intel, etc.) to announce their annual procurement requirements and technical standards.
The OCP Global Summit (San Jose) focuses on data center technological innovation and open collaboration in the AI era. This summit announced the establishment of the ESUN (Ethernet for Scale-Up Networking) working group, comprising twelve enterprises including AMD, Arista, ARM, Broadcom, Cisco, HPE Networking, Marvell, Meta, Microsoft, NVIDIA, OpenAI, and Oracle. The group is dedicated to addressing the fragmentation in the high-speed interconnect ecosystem for AI clusters through open Ethernet standards.
As the officially designated agency for this exhibition, Juzhan will continue to lead Chinese enterprises to attend the OCP Global Summit in the US, providing high-quality services to help them explore the Latin American market. The OCP Global Summit (San Jose) serves as a vital platform to seize opportunities in AI computing power, data centers, and high-speed interconnect industries, connect with top-tier global open computing resources, and expand market channels in North America.
Exhibitor List
OCP Global Summit (San Jose, USA) Product Range
AI Servers & Cluster Architecture: Showcases open hardware solutions ranging from single-node AI servers to full-rack AI clusters, such as MiTAC's OCP ORv3 liquid-cooled racks and EIA air-cooled racks.
Liquid Cooling & Thermal Management Solutions: SUNON exhibits three core products: open cold plates, CDU (Coolant Distribution Unit) liquid distribution devices, and closed-loop liquid cooling systems. CoolIT, MiTAC, and others showcase 200kW In-Rack CDU liquid cooling solutions supporting high-density GPU deployments.
High-Power Power Delivery & Interconnect Technologies: Features high-current solutions such as 800VDC power architectures (Delta, Lite-On), LVDC/HVDC distributed power delivery, and rear-door rack power distribution. TE Connectivity and Amphenol exhibit blind-mate busbar connectors, modular bus interfaces, and high-density optical/copper interconnects.
Networking & Switching Technologies: Broadcom unveils the Tomahawk Ultra switch and 3rd-generation CPO (Co-Packaged Optics) technology, supporting 1.6T optical transceivers. NVIDIA showcases Spectrum-X™ Ethernet Switches, supporting hyperscale AI data centers for Meta, Oracle, and others.
Open Platform Firmware & Management: MiTAC Live Demo showcases OpenBMC + Open Platform Firmware (OPF) to replace proprietary stacks with open-source firmware. Discussions cover security and transparent management mechanisms such as Redfish, SBOM, and NIST compliance.
Storage & SSD Innovations: Manufacturers like Dapustor exhibit NVMe SSDs supporting high-bandwidth, low-latency AI training scenarios. Solidigm and Micron showcase high-endurance NVMe E1.S/U.2 SSDs tailored for AI/HPC workloads.
Sustainability & Digital Twins: Explores the application of PUE optimization, heat recovery, and digital twins in data center operations. Multiple enterprises share design practices for "Green AI Factories," aligning with the theme "Leading the Future of AI".
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OCP Global Summit (San Jose, USA) Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition





















