IC & Sensor Packaging Technology Expo Tokyo

The IC & Sensor Packaging Technology Expo Tokyo is Japan's leading professional exhibition dedicated to packaging technologies. It specifically showcases packaging solutions for semiconductors, sensors, and other electronic devices.

Juzhan has repeatedly organized delegations of high-quality enterprises to participate! The IC & Sensor Packaging Technology Expo Tokyo serves as an excellent venue for business negotiations with engineers from the semiconductor, sensor, electronic equipment, and automotive industries.

The IC & Sensor Packaging Technology Expo Tokyo covered a total area of 16,000 square meters at its last edition, featuring 375 exhibitors from China, South Korea, Taiwan, India, Thailand, Malaysia, Singapore, Turkey, Germany, and other regions, with 18,240 attendees. Renowned for its high professionalism and strong trade outcomes, the event has attracted numerous high-tech equipment enthusiasts, end-users, and industry professionals.

IC & Sensor Packaging Technology Expo Tokyo tickets are e-tickets. Domestic and international visitors must complete online pre-registration with real-name passport verification. After purchase, the organizer verifies visitor identity. Visitors who do not meet entry requirements may need to submit additional documents. Once approved, you will receive email confirmation or a QR code. On site, present your original passport and confirmation letter to collect a paper badge, or scan the QR code to enter.

Partial exhibitor directory and exhibitor list for IC & Sensor Packaging Technology Expo Tokyo: DAIDO KOGYO CO., LTD., Tatsuta Electric Wire & Cable Co., Ltd., JMJ KOREA, Nikon Corporation, FUJI CORPORATION, SHANGHAI YKC CORPORATION, and others. The 2027 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.