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Embedded Systems Expo Osaka, Japan
Embedded Systems Expo Osaka
- Dates
- Show Hours:
- Venue
- Intex Osaka
- Highlights
- Japan’s most authoritative embedded systems exhibition in the western region


Group tour

Airport transferLocal receptionEntry badge4-star hotelBusiness mealsFull transportSightseeing
Embedded Systems Expo Osaka, Japan Same Period Exhibition
Exhibition Data
- 3/1
- Edition
- 16000㎡
- Exhibition area
- 325
- Exhibitors
- 19870
- Visitors
OSAKA Embedded Expo Details
- Organizer:
- Informa Markets
- Venue:
- Intex Osaka
- Address:
- 1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan
Profile
The Embedded Systems Expo Osaka (ESEC Osaka) is the most authoritative embedded systems exhibition in western Japan. It serves as the premier venue for showcasing everything required for embedded systems, ranging from software and components to system integration and development platforms.
At the last edition of ESEC Osaka, the total exhibition area reached 16,000 square meters, with 325 exhibiting companies hailing from China, Hong Kong, South Korea, Russia, Spain, Italy, Dubai, India, Malaysia, Australia, and other regions, attracting a total of 19,870 visitors.
The Embedded Systems Expo Osaka (ESEC Osaka)draws numerous system, hardware, and software designers, developers, and engineers eager to introduce innovative solutions into their businesses. A large number of architects and developers from sectors including automotive and transportation equipment, factory automation (FA) equipment, precision and medical devices, telecommunications and mobile devices, home appliances, and audiovisual products will attend and engage in lively business discussions with exhibitors.
Embedded Systems Expo Osaka, Japan tickets are e-tickets. Domestic and international visitors must complete online pre-registration with real-name passport verification. After purchase, the organizer verifies visitor identity. Visitors who do not meet entry requirements may need to submit additional documents. Once approved, you will receive email confirmation or a QR code. On site, present your original passport and confirmation letter to collect a paper badge, or scan the QR code to enter.
Partial exhibitor directory and exhibitor list for Embedded Systems Expo Osaka, Japan: ミーク 株式会社, 株式会社 BFT, ミカサ商事 株式会社, 株式会社 日立システムズ, 兼松エレクトロニクス 株式会社, 株式会社 デージーネット, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
Embedded Systems Expo Osaka Exhibitior List
Embedded Systems Expo Osaka, Japan Range
Is my product suitable?Microprocessor/DSP/Hardware
Software
EDA Design Tools/Systems
Development Support Tools
Booth Sales

Mr. WuGold-Medal PM
3 Years Booth Sales
2026 OSAKA Embedded Ticket Sales

Mr. HanGold-Medal PM
3 Years Booth Sales

Ms. LiuGold-Medal PM
3 Years Booth Sales
OSAKA Embedded Venue
Venue transport
- Metro / rail
It’s about a 5-minute walk from Nakafuto Station (Osaka Metro Nankō Port Town Line/New Tram).
It’s about an 8-minute walk from Trade Center-mae Station (Osaka Metro Nankō Port Town Line/New Tram). On rainy days, we recommend this station, as there is a covered route.
It’s about a 9-minute walk from Cosmosquare Station (Osaka Metro Chūō Line). This is the terminus of the Chūō Line; exit through Exit 3 or Exit 4 and follow the signage to reach the exhibition halls.
- Air
From Kansai International Airport: Take the Nankai Electric Railway Airport Express or the JR Kansai Airport Rapid Service to Namba Station, then transfer to the subway as directed above to reach the exhibition venue. The total travel time is approximately 50 minutes to 1 hour. There are no direct train services; a transfer is required.
From Osaka Itami Airport: A taxi ride takes about 45 minutes and costs approximately JPY 11,000. Alternatively, you can take the monorail followed by a subway connection, though this option involves multiple transfers and takes around 1 hour in total.
OSAKA Embedded Booth Price


Process
- 1.Submit the business license of the company
- 2.Submit product picture and name
- 3.Receive exhibition presentation documents and booth drawings
- 4.Submit booth application form/Sign booth contract
- 5.Pay the contract booth deposit
- 6.Prepare for exhibition




















