Bondexpo Stuttgart (International Trade Fair for Adhesive Bonding and Sealing Technology)

Bondexpo Stuttgart (Bondexpo) is the world's leading meeting place for industry professionals. Since its inception in 2007, the exhibition has become a global hub for the industry and its users. It covers the entire process chain from bonding, potting, sealing, and foam assembly to joining, providing solutions for practical applications and future industry challenges. In particular, the use of new adhesives is becoming increasingly important in lightweight construction, extending beyond the automotive sector to home appliances and equipment.

Furthermore, Bondexpo serves as a bridge between R&D and practical application. It is co-located with Motek, the world's leading trade fair for automated production and assembly.

JZhan has successfully organized numerous high-quality enterprises to exhibit multiple times! Bondexpo Stuttgart (Bondexpo) showcases new future pathways in adhesives, insulation, foaming, sealing, and encapsulation. Precision bonding, potting, sealing, and foaming are integral components of highly automated handling and robotic systems.

Additionally, Bondexpo Stuttgart (Bondexpo) will host an exhibitor forum where experts will present current adhesive technology topics and products to visitors and exhibitors. Consequently, it has evolved into a premier platform for information and knowledge, making it a pivotal event for the industry.

Bondexpo Stuttgart (International Trade Fair for Adhesive Bonding and Sealing Technology) tickets are e-tickets. Domestic and international visitors must complete online pre-registration with real-name passport verification. After purchase, the organizer verifies visitor identity. Visitors who do not meet entry requirements may need to submit additional documents. Once approved, you will receive email confirmation or a QR code. On site, present your original passport and confirmation letter to collect a paper badge, or scan the QR code to enter.

Partial exhibitor directory and exhibitor list for Bondexpo Stuttgart (International Trade Fair for Adhesive Bonding and Sealing Technology): 洛阳博盈轴承有限公司, Wolff Publishing, Inh. Andreas, VKS Visual Knowledge Share Ltd., ULMAN Dichtungstechnik GmbH, Kinemic GmbH, ISGATEC GmbH, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.