The Russia Moscow Transportation Packaging Expo (TRANSPACK) is a professional transportation packaging exhibition in the Russian region about warehousing and material handling equipment as well as warehouse automation. It provides numerous opportunities for manufacturers and suppliers, building a good reputation.

The packaging solutions provided by exhibitors at the Russian Moscow Transportation Packaging Exhibition (TRANSPACK) are aimed at solving the following issues: ensuring the safety of your products, optimizing storage convenience and security during transportation, and the ability to convert packaging and labeling according to your business needs. Depending on the task, transport packaging can be structurally adapted to the layout on shelves in the distribution network and the convenience of courier delivery.

The concurrent Russian Moscow Transportation Logistics Exhibition (CeMAT Russia) covers key areas of the industry, including the following sections: Transport and Industrial Packaging; Packaging Materials; Equipment; Marking. The exhibition will also host several industry seminars, where industry elites invited to the event will discuss the latest industry information together.

The Russian Moscow Transportation Packaging Exhibition (TRANSPACK) showcases various equipment, technologies, materials related to supply chain management, transportation, and packaging. They attract professionals in the industry through the display of innovative packaging solutions, logistics management technology, transportation equipment, etc., promoting technological innovation and business development in the supply chain.

Visitors can learn about the latest trends, technological innovations, and market prospects in the transportation, packaging, and logistics fields through visiting exhibitions, participating in seminars, listening to speeches by industry experts, etc. The Transpack exhibition also provides an opportunity for practitioners to communicate with suppliers, partners, and peers, promoting business cooperation and common growth.