
OCP EMEA SummitOCP EMEA Summit
OCP EMEA Summit Profile
The OCP EMEA Summit rotates among major global cities. It serves as a platform where global technology leaders convene to address regional challenges related to data center sustainability, energy efficiency, and waste heat recovery. The summit focuses on exploring how innovations from hyperscale data center operators can help tackle these challenges. It also highlights the deployment of OCP-validated data center equipment specifically tailored for the EMEA region.
Targeting global data center operators, hardware manufacturers, cloud service providers, and the open-source community, the OCP EMEA Summit drives the adoption and localization of the open hardware ecosystem across the EMEA region.
The OCP Future Technologies Workshop will once again focus on data center sustainability and innovations typically 5+ years out, ensuring long-term challenges are addressed while integrating the advancements of researchers, academia, and startups into the OCP ecosystem. In addition to a full exhibition hall showcasing the latest innovations to all attendees, the Innovation Village will host live technical demonstrations, allowing participants to experience these solutions firsthand.
Attendee Profile: Engineers (24%), Sales & Business Development (15%), Executives (10%), Technical Architects & Product Managers (9% each). Geographic Distribution: North America (77%), Asia-Pacific (17%), EMEA (5%).
The OCP EMEA Summit attracted 142 global exhibitors, representing an approximate 30% increase year-over-year. Alongside exhibitors from North America and the Taiwan region of China, enterprises from mainland China also made their presence felt. Overall, Chinese exhibitors primarily focused on high-performance servers and optical communications, signaling strong engagement with the international open computing ecosystem.
Exhibitor List
OCP EMEA Summit Product Range
Open Compute Hardware Design: Open hardware reference designs compliant with OCP standards, including servers, storage systems, and networking equipment.
Power & Cooling Systems: High-efficiency power architectures, liquid cooling technologies, and AI-optimized thermal management solutions.
AI & HPC Infrastructure: Examples include Arm AGI CPU dual-node reference servers, AI accelerators, and OCP-compatible AI cluster architectures.
Data Center Modularity & Edge Computing: Novel deployment models such as OCP DC-MHS (Data Center Modular Hardware Standard).
Open Firmware & System Management Tools: Open-source resources including diagnostic frameworks, debugging tools, and system validation platforms.
Sustainable Data Center Technologies: Solutions aligned with OCP sustainability goals, featuring energy-efficient designs, carbon footprint optimization, and green energy integration.
OCP EMEA Summit Booth Sales


OCP EMEA Summit Ticket Sales



OCP EMEA Summit Venue
OCP EMEA Summit Booth price

Standard booth Configuration

Blank booth Configuration
OCP EMEA Summit Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition





















