China (Shenzhen) Intelligent Driving Vehicle Technology Exhibition Tickets

The China Electronics Fair—Shenzhen Intelligent Driving Vehicle Technology Exhibition serves as an authoritative platform for showcasing the latest technologies and products, as well as cutting-edge processes and concepts in the intelligent connected vehicle industry. The event not only highlights representative intelligent connected vehicles but also places a strong emphasis on core components such as sensors, control chips, in-vehicle communication systems, operating systems, and map‑navigatio

Six Compelling Reasons to Exhibit at the Shenzhen Intelligent Driving Expo

• A National-Level Platform with Strong Authority: Co-hosted by the Ministry of Industry and Information Technology and the Shenzhen Municipal People’s Government, this expo is one of the core specialized exhibitions within the China Electronic Information Expo (CITE). It fosters seamless connectivity across the entire electronic information industry chain, creating an expansive 100,000-square-meter exhibition platform.
• Comprehensive Industry Chain Coverage for One-Stop Resource Matching: The expo focuses on intelligent connected vehicles, covering complete vehicle systems as well as core components and system solutions. Exhibition categories span autonomous driving technologies, intelligent driver-assistance systems, active safety, sensors, vehicle-to-everything (V2X) connectivity, vehicle-road collaboration, testing and measurement, and in-vehicle electronics—encompassing the full industry spectrum. From high-precision sensors and control chips to complete vehicle manufacturing, upstream and downstream enterprises converge, enabling efficient procurement matchmaking.
• Strong Advantages in Automotive Semiconductors, Precisely Addressing Core Industry Needs: The per-vehicle value of semiconductor components in smart cars is 6–8 times that of traditional internal-combustion vehicles. With a strategic focus on automotive semiconductors, the expo has attracted renowned domestic and international chip manufacturers—including Infineon, NXP, Renesas, Horizon Robotics, Black Sesame Technologies, and ChipSea—providing a professional platform for companies to connect with core chip supply chains and capitalize on the “three transformations” trends shaping the automotive sector.
• A Leading Technology Benchmark, Pioneering Industry Frontiers: The expo highlights cutting-edge advancements such as ADAS algorithms (including map-free solutions), multi-sensor fusion (4D millimeter-wave radar and solid-state LiDAR), vehicle-road collaboration (V2X automotive-grade communication modules), and low-cost hardware mass production (L2-level chips priced around RMB 1,000). Emerging technologies like autonomous driving, driverless vehicles, and V2X connectivity are showcased, allowing exhibiting companies to promptly demonstrate their innovative capabilities to global buyers.
• A Gathering of Professional Buyers, Ensuring Tangible Results: The expo anticipates attracting over 80,000 professional visitors, including executives from vehicle manufacturers, component suppliers, research institutions, and investment firms. Concurrent technical forums and dedicated procurement matchmaking events will be held, with targeted invitations extended to automotive executives, Tier 1/2 supply-chain decision-makers, and senior engineers, providing robust support for exhibitors to achieve multiple objectives, including brand promotion, technological exchange, and business collaboration.
• Shenzhen’s Strategic Location, Connecting Global Resources: As a core city in the Guangdong–Hong Kong–Macao Greater Bay Area, Shenzhen serves as a major hub for China’s electronic information and intelligent connected vehicle industries. Exhibiting companies can leverage Shenzhen’s industrial foundation and locational advantages to efficiently access the South China market and expand into global networks, thereby broadening their commercial partnerships.