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Shenzhen High-Tech Fair – Semiconductor and Integrated Circuit ExhibitionCatalog consultation
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Fair basics
Industry scope
Semiconductor Materials:Silicon wafers, silicon-based materials, polishing pads, photomasks, sputtering targets, polishing liquids, etching solutions, ceramic packaging materials, packaging substrates, photoresists, specialty gases, ultrapure water
Compound Semiconductors:Silicon carbide (SiC), gallium nitride (GaN), cubic boron nitride (CBN), SiC crystal growth furnaces, SiC substrates and epitaxial wafers, GaN substrates and epitaxial wafers, SiC power devices, GaN power devices
IC Design:EDA/IP tools, processor chips, memory chips, digital chips, analog chips, automotive electronics chips, consumer electronics chips, industrial-grade chips
Wafer Fabrication Equipment:Etching equipment, ion implantation systems, thin-film deposition units, lithography machines, coating and developing apparatus, thinning equipment, wet-processing systems, cleaning devices, polishing machinery, metrology and inspection tools
Core Components of Semiconductor Equipment:RF power supplies, RF generators, valves, vacuum pumps, valve cores, electrostatic chucks, sealing rings, transfer modules, gas flow meters, precision bearings, motion controllers, coating materials, precision motion stages, robotic arms, reaction chamber spray nozzles
Advanced Packaging:Flip-chip packaging, wafer-level packaging, 2.5D packaging, 3D packaging, bump-based packaging, fan-out wafer-level packaging, probe stations, test machines, sorters, X-ray inspection equipment
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