Front-end Wafer Fabrication Equipment Zone:Lithography systems, etching equipment, thin-film deposition tools, doping and thermal processing equipment, CMP planarization systems, process‑supporting equipment, and metrology devices (such as SEM, optical defect inspection systems, and film‑thickness measurement instruments)

Packaging and Testing (Back-end) Equipment Zone:Wafer‑level post‑processing equipment, core traditional packaging machinery, advanced packaging solutions for 2.5D/3D/Chiplet/HBM applications, ATE final‑test systems, auxiliary inspection equipment such as X‑ray and ultrasonic testers, and a full range of packaging consumables

Semiconductor Precision Core Components Zone:Vacuum systems, RF and DC power supplies, precision mechanical components, high-purity fluid handling systems, optical assemblies, automated wafer‑handling robotic arms, precision sensors, and related technologies

Key Semiconductor Materials Zone:8‑inch and 12‑inch silicon wafers, SiC/GaN third‑generation semiconductor substrates, photoresists and mask blanks, high‑purity electronic chemicals, specialty gases, metallic and dielectric functional films, and various packaging materials

Support Services and Industry‑Chain Extension Zone:EDA tools, IP cores, foundry services, packaging and testing contract manufacturing, failure analysis and testing laboratories, cleanroom engineering, high‑purity gas supply and wastewater/gas treatment systems, finished chip products, and industry‑specific solutions

Comprehensive Industry Services Zone:Semiconductor industrial parks, trade associations, investment and financing institutions, industry–university–research collaboration platforms, and testing and certification service providers