Front-End Wafer Fabrication Equipment Zone:Complete lithography systems, etching equipment, thin-film deposition units, doping and thermal processing tools, CMP planarization machines, process-supporting devices, and metrology instruments (SEM, optical defect inspection, film-thickness measurement equipment, etc.)

Packaging and Testing (Back-End) Equipment Zone:Post-wafer processing machinery, traditional core packaging equipment, advanced packaging solutions for 2.5D/3D/Chiplet/HBM, ATE final-test systems, auxiliary inspection devices such as X-ray and ultrasonic scanners, and various packaging consumables

Semiconductor Precision Core Components Zone:Vacuum systems, RF and DC power supplies, precision mechanical parts, high-purity fluid handling systems, optical components, automated wafer-handling robotic arms, precision sensors, and more

Semiconductor Key Materials Zone:8- and 12-inch silicon wafers, SiC/GaN third-generation semiconductor substrates, photoresists and mask blanks, high-purity electronic chemicals, specialty gases, metal/dielectric functional films, and various packaging materials

Support Services and Industrial Chain Extension Zone:EDA tools, IP cores, foundry services, packaging and testing subcontracting, failure analysis laboratories, cleanroom engineering, high-purity gas supply and wastewater/gas treatment systems, finished-chip solutions, and industry-specific solutions

Comprehensive Industry Service Zone:Semiconductor industrial parks, industry associations, investment and financing institutions, industry–university–research collaboration platforms, and testing/certification service providers