Hangzhou Global Intelligent Computing Conference & Exhibition
Exhibitor Directory / E-Catalog

Hangzhou Global Intelligent Computing Conference & ExhibitionCatalog consultation

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Fair basics

Name
Hangzhou Global Intelligent Computing Conference & Exhibition
Venue
No. 353, Benjing Avenue, Xiaoshan District, Hangzhou City, Zhejiang Province
Short name
DIC
Dates
2027.02.25-02.27
Organizer
Infor Convention & Exhibition (Shanghai) Co., Ltd., Zhejiang Provincial Artificial Intelligence Society
Hall
Hangzhou International Convention and Exhibition Center
Visitors
50000
Exhibitors
500

Industry scope

Computing Industry:General-purpose computing, high-performance computing, intelligent computing, quantum computing, heterogeneous computing, parallel computing; computing architectures, computing acceleration systems, distributed computing frameworks; computing simulation tools, computing compilation software, computing development kits; domestic computing ecosystems, information technology innovation (ITI) computing hardware and software; computing performance testing, computing evaluation tools; computing migration, computing offload technologies and products, computing industrial park operations, computing industry standards and certification, computing industry intellectual property services, computing industry technology transfer, computing industry incubation and acceleration, computing industry investment funds, computing industry think tanks and consulting, etc.

Core Computing Power Equipment and Architectures:AI chips, DPUs, CPUs, GPUs, NPUs, FPGAs, large AI models, AI accelerator cards, computing modules, processing-in-memory chips, complete servers, rack-mounted servers, blade servers, industrial servers, supercomputing equipment, AI training/inference servers, server racks, firewalls and gateways, edge computing chips, edge computing devices, cloud services, IoT, computing security, software applications, computing-network collaboration, computing-electricity collaboration, etc.

Storage and Data Infrastructure:All-flash storage, distributed storage, NAS/SAN storage, object storage, disk arrays, solid-state drives, storage chips, storage servers, disaster recovery backup equipment, data migration, data compression, data storage security systems

Networking and High-Speed Interconnects:Computing networks, optical communications/optical modules, high-speed fiber optic connections, data center interconnects, backbone network equipment, switches, routers, high-speed network interface cards, DPUs/intelligent NICs, cabling systems, IDC network architectures, low-latency interconnection devices, computing-network convergence devices, etc.

Data Center Infrastructure:Intelligent computing centers, supercomputing centers, edge data centers, modular data centers, micro-module machine rooms, server racks, UPS systems, precision air conditioners, fresh air systems, power supply and distribution systems, intelligent monitoring, infrastructure and environmental monitoring systems, etc.

Green Energy-Saving and Cooling Technologies:Liquid-cooled servers, immersion liquid cooling, cold plate liquid cooling, air-cooling energy-saving solutions, data center energy-saving retrofits, waste heat recovery, low-carbon energy-saving technologies, power distribution systems, photovoltaic energy storage computing support, green IDC solutions, fire protection and security, etc.

Cloud Computing, Computing Platforms, and Scheduling:Public clouds, private clouds, hybrid clouds, edge clouds, computing scheduling platforms, computing trading platforms, computing grid integration, cloud-native technologies, containers, virtualization, distributed computing management, multi-cloud management platforms, etc.

Computing Security and Operations & Maintenance:Computing network security, data security, host security, AI model security, privacy-preserving computation, confidential computing, computing risk management, intelligent O&M, automated monitoring, disaster recovery security, equipment safety solutions, etc.

Industry-Specific Computing Application Solutions:Industrial computing, financial computing, medical computing, transportation computing, energy computing, education and research computing, autonomous driving computing, smart city computing, government big data, industry-specific deployment plans for large AI models, etc.

Research, Services, and Industrial Support Ecosystem:Universities and research institutes, computing testing and certification, planning and design, engineering construction, O&M services, investment and financing institutions, industry media, industrial parks, computing incubation platforms, etc.

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Hangzhou Global Intelligent Computing Conference & Exhibition
Date
2027.02.25-02.27
Venue
Hangzhou International Convention and Exhibition Center

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You can request an e-invoice from the order page; it will be emailed within about 1–5 business days.