
Asia Semiconductor Equipment Exhibition, Hanoi, Vietnam
NEPCON ASIA Vietnam- 1/1
- Annual
- 10000㎡
- Exhibition area
- 300
- Exhibitors
- 10000
- Visitors
Asia Semiconductor Equipment Exhibition, Hanoi, VietnamSame period exhibition
HanoiSemiconductors expo Fair Details
- Organizer:
- Reed Exhibitions
- Venue:
- Vietnam Exhibition Center
- Address:
- Trung Tâm Triển Lãm Việt Nam, Đường Cầu Tứ Liên Trường Sa, Đông Hội, Đông Anh, Hà Nội, 越南
Asia Semiconductor Equipment Exhibition, Hanoi, VietnamProfile
The NEPCON ASIA Vietnam exhibition for semiconductor manufacturing equipment in Hanoi, Vietnam, capitalizes on the country’s burgeoning electronic manufacturing sector. By precisely aligning with local market demands, NEPCON ASIA @ Vietnam unlocks new business opportunities and sets the stage for a fresh chapter in the Asian electronics industry.
As a leading global trade show brand in the electronics manufacturing sector, the NEPCON series boasts decades of deep roots across the world’s major manufacturing hubs. It focuses on the entire electronics manufacturing value chain, covering critical areas such as SMT assembly, semiconductor packaging and testing, soldering, inspection, and automation.
Vietnam’s electronics manufacturing industry is entering a new phase of rapid growth. As of March 2026, the semiconductor sector has attracted nearly US$16 billion in registered foreign investment, with 228 projects already operational. During the same period, the information and electronics industry recorded US$4.82 billion in actual utilized foreign capital, up 58.7% year over year, while exports of automotive electronic components surged by 69.2%. Against this backdrop, global manufacturing leaders such as Samsung Electronics, Foxconn, Amkor, and Intel are accelerating their investments in Vietnam, expanding from smart terminal assembly to upstream semiconductor packaging and testing. Vietnam’s electronics industry is swiftly shifting toward higher-value-added segments, unleashing strong market momentum and creating vast opportunities for collaboration among global electronics manufacturers.
NEPCON ASIA Vietnam serves as a pivotal platform for connecting technological innovation, business matchmaking, and insights into industry trends. It opens the door to Southeast Asia’s smart manufacturing market! If you’re interested in exhibiting, contact Juzhan to secure your booth today!
Asia Semiconductor Equipment Exhibition, Hanoi, Vietnam tickets are e-tickets. Domestic and international visitors must complete online pre-registration with real-name passport verification. After purchase, the organizer verifies visitor identity. Visitors who do not meet entry requirements may need to submit additional documents. Once approved, you will receive email confirmation or a QR code. On site, present your original passport and confirmation letter to collect a paper badge, or scan the QR code to enter.
Partial exhibitor directory and exhibitor list for Asia Semiconductor Equipment Exhibition, Hanoi, Vietnam: ZHEJIANG BAIYI ADHESIVE PRODUCTS CO.,LTD., Specialty Coating Systems, Jiangsu Shuangxing Color Plastic New Materials Co., Ltd., V. HIMARK TECHNOLOGY CO., LTD., SHENZHEN BLUIRIS TECHNOLOGY CO., LTD., and others. The 2027 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
Asia Semiconductor Equipment Exhibition, Hanoi, Vietnam Photos
NEPCON ASIA Vietnam Exhibitor Directory / E-Magazine
2026 Asia Semiconductor Equipment Exhibition, Hanoi, Vietnam Online Exhibitor Directory
Exhibitor number: 192
¥50
Buy nowAsia Semiconductor Equipment Exhibition, Hanoi, VietnamRange
Printed Circuit Boards: SMT equipment, PWB/PCB, rigid boards, multilayer boards, flexible boards, rigid‑flex boards, semiconductor‑packaged PCBs, embedded passive devices (EPD), PCB materials, rigid copper-clad laminates, flexible copper-clad laminates, protective boards, copper foil, insulating materials
IC Packaging: Assembly equipment (bonding machines, molding machines, resin coating machines, dicing saws, lead‑frame processing equipment, laser processors), packaging materials/components (sealants, adhesives, lead frames, bonding wires, tape materials), analysis and simulation software, packaging technologies (CSP, BGA, wafer-level CSP)
Electronic Components: Capacitors, inductors/coils, magnetic contactors, circuit breakers, antistatic components (antistatic materials, insulating materials, RoHS‑compliant parts/materials), thermal management components (heater control parts, heat‑sink plates/materials), connectors, sensors, interconnect cables
EMS/Contract Manufacturing Services: Electronic manufacturing/production services, turnkey factories/solutions, consulting services
Soldering: Soldering machines, reflow ovens, rework stations, soldering irons, solder baths, flux applicators, soldering materials/fluxes
SMT Material Handling Equipment and Systems: Loaders, unloaders, conveyors, automated sorting systems, palletizing robots, pallet stackers, sorters, automated guided vehicles, shelving units, mobile racks, pallets, cabinets (All content herein is copyrighted by Juzhan; unauthorized reproduction prohibited.)
Cleanroom/Antistatic Solutions: Cleanroom systems/items, clean benches, air showers, particle counters, ionizers, ESD/antistatic products, swabs/cleaning cloths, vacuum cleaners, cleaning equipment, and related accessories (filter units, oil‑water separators, ultrasonic generators, wastewater treatment systems)
Testing: Board‑level visual inspection equipment, solder‑joint visual inspection equipment, visual inspection of ICs/PCBs/component parts, lead‑frame inspection, in‑board circuit testers, IC/LSI testers, test fixtures/testing jigs/probes/test stands, 2D/3D inspection, analysis equipment/software, and contract analysis services
Booth inquiry for this edition



2027 HanoiSemiconductors Ticket inquiry






HanoiSemiconductors Venue
HanoiSemiconductors Booth Application

Standard booth Configuration

Blank booth Configuration
Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition





















