Electronics Components/Modules/Equipment Pavilion: Semiconductors, electronic display devices, modules, printed circuit boards, wires and cables, functional components (such as buzzers, magnetic heads, micro-motors, sensors, etc.), passive components (resistors, capacitors, transformers, crystals, etc.), interconnect components (connectors, switches, relays, etc.), magnetic materials, industrial equipment, batteries and related materials, and other electronics‑related products; Digital Networking Pavilion: digital home appliances, mobile networking products, digital software solutions, consumer and personal devices, automotive electronics, consumer electronics, home networking products, network and broadcasting services, online platforms, and intermediate equipment.

Electronics Manufacturing and Production Equipment: Cables: cable manufacturing, plug and connector fabrication technologies, coiled‑product manufacturing, and hybrid component production; PCBs: PCB fabrication, circuit carrier manufacturing, and electronic manufacturing services; SMT: testing and measurement technologies, quality assurance (A1 and A2), component‑mounting techniques (A2 and A3), production logistics and material‑handling technologies (A2), PCB soldering and joining methods (A4), surface‑finishing processes (A4), and robotics in electronics manufacturing (A3); Semiconductors: semiconductor manufacturing, display‑device production, LED and discrete‑component fabrication, photovoltaic manufacturing, micro‑ and nano‑scale production, cleanroom technologies, and materials processing; Future Technologies: cyber‑physical systems, Industry 4.0 in electronics manufacturing and smart factories, 3D printing in electronics manufacturing, the integration of IT into production, manufacturing technologies for batteries and energy storage, organic and printed electronics, and additive manufacturing.