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Semiconductor Exhibition in Munich, GermanyCatalog consultation
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Fair basics
Semiconductor Exhibition in Munich, GermanyPast exhibitors
- International semiconductor equipment and materials giants: ASML (Netherlands), Applied Materials (USA), Infineon Technologies (Germany, with CEO Jochen Hanebeck in attendance), STMicroelectronics (Switzerland/France, with multiple executives attending), Robert Bosch GmbH (Germany, with VP Engineering present), GlobalFoundries (USA/Germany, with GM in attendance), imec (Belgium, with multiple executives attending), CEA-Leti (France, with multiple executives attending)
- Semiconductor equipment and process companies: Adeon Technologies (Netherlands, specializing in vacuum plug systems), AIM Solder (USA, producing ultra-fine solder pastes), Almit (Germany, offering welding materials), budatec (Germany, developing vacuum welding systems), Carl Zeiss Industrial Metrology (Germany, providing industrial measurement systems), (Italy, supplying PCB substrate materials), F&S Bondtec Semiconductor (Austria, offering bonding test systems), Fritsch (Germany, manufacturing mounting systems), Fuji Europe (Japan, focusing on SMT smart manufacturing), IPTE (Belgium, automating testing processes)
- Welding and materials companies: Indium Corporation (USA, supplying solder and thermal management materials), Felder (Germany, producing high-purity fluxes), Ersa GmbH (Germany, offering semi-automatic crimping systems, recipient of an Innovation Award)
- Smart manufacturing and automation companies: Bosch Rexroth (Germany, specializing in drive and control technologies), Komax Group (Switzerland, processing cables, recipient of an Innovation Award), Yamaha Robotics (Japan, providing mounting solutions), Festo SE & Co. KG (Germany, pioneering automation technologies)
- Testing and measurement companies: Camtek (Israel, offering advanced inspection and metrology services), Cognex (USA, utilizing machine vision), Viscom (Germany, integrating AI-powered inspection systems), Keysight (USA, providing comprehensive testing solutions)
- Research institutes and industry associations: Fraunhofer IZM (Germany, focusing on reliable electronics and system integration), FED (German Association for Electronic Design and Manufacturing), Chips Joint Undertaking (EU initiative for chip development), Yole Group (providing market analysis)
- Other notable exhibitors: BTU International (offering heat treatment solutions), Herrmann Ultraschalltechnik (specializing in ultrasonic welding), JBC Soldering (producing welding tools), Universal Instruments (engaged in smart manufacturing), SEGGER Microcontroller (developing embedded systems)
Industry scope
Semiconductor Materials:monocrystalline silicon, silicon wafers, germanium-silicon materials, SOI materials, silicon materials for solar cells, compound semiconductor materials, quartz products, graphite products, antistatic materials, and more
Semiconductor Equipment:semiconductor packaging equipment, diffusion equipment, welding equipment, cleaning equipment, testing equipment, cooling equipment, oxidation equipment, and others (Copyright of this content belongs to Juzhan; unauthorized reproduction prohibited.)
IC Products and Application Technologies:semiconductor optoelectronic devices, discrete semiconductor components and their application technologies; IC products and related technologies, IC testing methods and instruments, IC design and design tools, IC manufacturing and packaging; as well as finished integrated circuit products
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