Vietnam Hanoi Integrated Circuit and Semiconductor Exhibition

Semiconductor Materials: Silicon wafers and silicon-based materials, silicon wafers, silicon chips, monocrystalline silicon, silicon substrates, germanium–silicon materials, SOI materials, silicon materials for solar cells, compound semiconductor materials, quartz products, graphite products, antistatic materials, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulating materials, ceramic substrates, and sealing & testing materials, among others.

Wafer Fabrication and Packaging: Wafer fabrication, SiP packaging, silicon wafers and IC packaging substrates, printed circuit boards, packaging substrates, as well as related equipment, assembly, and testing processes; encompassing packaging design, testing, equipment and applications, manufacturing and packaging/testing, EDA tools, MCUs, printed circuit boards, packaging substrates, semiconductor materials, and associated equipment.

Integrated Circuit Manufacturing Technologies: Wafer fabrication/contract manufacturing, analog integrated circuits, digital–analog hybrid integrated circuits; along with related microprocessors, memory devices, FPGAs, discrete components, optoelectronic devices, power devices, sensor devices, and other technological components; as well as end‑use IC products.

Semiconductor Equipment Manufacturing: Packaging equipment, diffusion equipment, soldering equipment, cleaning equipment, testing equipment, cooling equipment, oxidation equipment, pick-and-place machines, single-crystal furnaces, oxidation furnaces, grinders, lithography machines, etching machines, polishing machines, ion implantation equipment, CVD/PVD systems, photoresist coating and development machines, reflow ovens, wave soldering machines, probe stations, cleanroom equipment, and more.

Packaging and Testing Support Systems: Test probe stations, probe cards, test machines, sorters, packaging equipment, packaging substrates, lead frames, bonding wires, wire bonding, burn-in testing, grinding fluids, laminated substrates, adhesive tapes, loading plates, wire‑bonding flow control, quartz and graphite products, silicon carbide, and other related materials.

Third-Generation Semiconductors: Third-generation semiconductors such as silicon carbide (SiC), including substrates, packaging, testing, and optoelectronic devices (LEDs, lasers, UV detectors), power electronics (diodes, MOSFETs, JFETs, BJTs, IGBTs, GTOs, ETOs, SBDs, HEMTs, etc.), as well as microwave and RF devices (HEMTs, MMICs, etc.).

Smart Power Technologies: Microwave and RF technologies, semiconductor LEDs, ion power supplies, shared smart charging solutions, communication power supplies, designs for photovoltaic, wind, and energy storage systems, magnetic power conversion technologies, and more.

IC Design: IC and related electronic product design, IC product and application technologies, IC testing methodologies and instruments, IC design and design tools, IC manufacturing and packaging, EDA tools, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, and more.

Electronic Components: Resistors, capacitors, potentiometers, vacuum tubes, heat sinks, electromechanical components, connectors, discrete semiconductor devices/IGBTs, electroacoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro‑specialty motors, electronic transformers, relays, printed circuit boards, base materials and substrates for printed circuits, passive components, core 5G components, power management units, memory devices, PCBs, motor fans, electroacoustic devices, display devices, diodes, transistors, and more.

Cutting-Edge Innovative Applications: AI chips, display chips, driver chips, power management chips, sensor chips, IoT chips, communication chips, transportation electronics chips, computer and control chips, memory chips, 5G chips, automotive-grade chips, audio‑video processing chips, and more.

Two-Way Collaborative Projects: Research outcomes of new technologies/products in this field, R&D and design activities, project investments, technology transfer, OEM/ODM contract manufacturing, joint production and sales, agency distribution, brand franchising, and testing services, among other collaborative initiatives.