IC Design / Chips & Applications:IC and related electronic product design, EDA, AI computing chips, memory chips, automotive chips, smart home appliance chips, AI chips, and products for IoT, artificial intelligence, automotive electronics, smart cities, smart terminals, healthcare, etc.

IC Manufacturing:Semiconductor wafer manufacturing, semiconductor packaging and testing technologies and products

Advanced Packaging:Flip-chip, bumping, wafer-level packaging, 2.5D/3D advanced packaging (TSV & TGV), fan-out wafer-level packaging, and related design, materials, testing, equipment, etc.

Semiconductor Equipment:Wafer dicing and testing equipment, various precision equipment for wafer processing, semiconductor packaging equipment, semiconductor testing equipment, IC test instruments, advanced packaging process equipment (, SiP, 3D packaging), power device equipment, etc.

Semiconductor Materials:Monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, CMP slurry, photoresist, photomasks, sputtering targets, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, thin film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, etc.

Core Semiconductor Components:Machine vision, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC components, robots, quartz components, filters, RF power supplies, ceramic components, ESC electrostatic chucks, pressure gauges, pumps, MFC mass flow controllers, stepper motors, motion control, servo motors, linear modules, cleanroom drag chains, packaging molds, refrigeration equipment, induction heaters, etc.

Compound Semiconductors & Power Devices:Compound semiconductor materials (, GaN, SiC, etc.) and related products, including power devices, RF devices, and upstream equipment and materials

AI Computing Power:AI chips, servers, switches, power supplies, liquid cooling temperature control systems, etc.