China Shenzhen Semiconductor and Display Technology Expo展商名录/电子会刊

Electronic Components Zone: Passive components, semiconductor discrete devices/IGBT, special electronic core components, power management, sensors, storage, connectors relays, cables, connector devices crystal oscillators, resistors, potentiometers magnetic components, filter components PCB boards, motors fans, acoustic devices, display devices diodes, transistors filter components, switches and component materials and equipment

IC Design, Chip Zone: IC and related electronic product design, AI chips power management chips, IoT chips, 5G communication chips and solutions, automotive electronics chips, security control chips, analog communication RF chips, storage chips, LED lighting and display driving chips, etc.

Third-Generation Semiconductor Zone: Third-generation semiconductor SiC, GaN, wafers, substrates, packaging, testing, optoelectronic devices (light emitting diodes LED, laser LD, detector UV) power electronic devices (diodes, MOSFET, JFET, IGBT, GTO, ETO, SBD, HEMT, etc.) microwave RF devices (HEMT, MMIC)

Semiconductor Equipment Zone: thinning machine, single crystal furnace, grinding machine, thermal treatment equipment, lithography machine, etching machine, ion implantation equipment, CVD/PVD equipment, bonding machine plasma cleaning equipment, cutting machine, chip mounting machine, wire bonding machine, reflow soldering, wave soldering, test equipment, sorting machine, coupling machine, carrier forming machine, detection equipment, constant temperature and humidity test chamber, sensors, packaging molds, test fixtures, precision slides stepper motors, valves, probe stations, clean room equipment, water treatment, etc. (The content of this article is the exclusive copyright of Ju Fair. Unauthorized forwarding is prohibited)

Wafer Manufacturing and Packaging Zone: wafer manufacturing, SiP advanced packaging, OSATs EMS, OEMs, IDM, silicon wafers and IC substrate boards, printed circuit boards, packaging substrates and equipment and assembly and testing, etc.; packaging design, testing, equipment and applications manufacturing and testing, EDA, MCU, printed circuit boards, packaging substrates semiconductor materials and equipment

Semiconductor Materials Zone: silicon wafers, silicon wafers, photoresist, wafer tape, photomask, electronic gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging materials, slicing, grinding, polishing, thin films, etc.