Japan Osaka Adhesive Exhibition展商名录/电子会刊
Japan Osaka Adhesive Exhibition会刊咨询

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展会基本信息
展商行业
Adhesive Materials: Adhesive films, tapes, adhesives, and raw materials/additives
Bonding Equipment and Technology: Laser welding, separation welding, ultrasonic bonding, etc.
Testing/Metrology/Analysis: Testing/measurement/evaluation of adhesive strength/bonding strength, non-destructive testing equipment, coating detection equipment, etc. (The content of this article is the exclusive copyright of Juzhan Network. Unauthorized forwarding is prohibited.)
Bonding and Joining Related Equipment: Coating equipment, drying equipment, cleaning equipment, UV curing equipment, VOC purification equipment, etc.

