Japan Osaka Adhesives Exhibition
Exhibitor Directory / E-Catalog

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Online Exhibitor Directory
2026 Japan Osaka Adhesives ExhibitionOnline Exhibitor Directory
Phone
Email
Website
Exhibitors:389
¥160
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Online Exhibitor Directory
2023 Japan Osaka Adhesives ExhibitionOnline Exhibitor Directory
Phone
Email
Website
Exhibitors:292
¥160
Preview
Buy now

Japan Osaka Adhesives ExhibitionCatalog consultation

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Fair basics

Name
Japan Osaka Adhesives Exhibition
Venue
1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan
Short name
Adhesion & Bonding Expo
Dates
2027.05.12-05.14
Organizer
Reed Exhibitions
Hall
Intex Osaka
Visitors
20500
Exhibitors
300

Industry scope

Adhesive Materials: Adhesive films, tapes, adhesives, as well as raw materials and additives

Joining Equipment and Technologies: Laser welding, separation welding, ultrasonic bonding, and others

Testing/Measurement/Analysis: Testing, measurement, and evaluation of adhesive strength and joining strength; non-destructive testing equipment; coating inspection devices, etc. (Copyright of this content belongs to Juzhan. Reproduction without permission is prohibited.)

Equipment for Adhesion and Joining: Coating equipment, drying equipment, cleaning equipment, UV curing equipment, VOC purification equipment, and more

Photos

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