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OCP Southeast Asia Tech Day @ DCWACatalog consultation
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Fair basics
Industry scope
AI & High-Performance Computing Infrastructure: High-density server and rack designs supporting AI/GPU; AI acceleration modules and systems based on OCP open hardware standards (, OAM, OAI).
Advanced Liquid Cooling & Thermal Management Technologies: Cold plates, Liquid-to-Liquid (L2L) and Liquid-to-Air (L2A) Coolant Distribution Units (CDUs); liquid cooling solutions supporting high-power chips (, >1400W); closed-loop liquid cooling systems suitable for retrofitting existing data centers.
High-Voltage Direct Current (HVDC) Power Architecture: ±400VDC and 800VDC HVDC power systems; high-efficiency power equipment such as Solid-State Transformers (SST), row-level power systems, and EVA cabinets.
AI Networking & Interconnect Technologies: 1.6T Ethernet switches (based on platforms like Tomahawk 6); Co-Packaged Optics (CPO) optical modules and low-latency network solutions; integrated solutions for UALink (Scale-Up Ethernet) and UEC (Scale-Out).
Modular & Edge Data Center Solutions: Pre-modularized IT cabinets, micro data centers; rapid deployment solutions tailored for tropical climates (, fluorine pump + micro-module solutions showcased by Haiwu).
Green & Sustainable Technologies: Energy-saving equipment, renewable energy integration; PUE optimization, utilization of natural cooling sources, water treatment systems, etc.
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