Semiconductor Materials:Silicon wafers & silicon-based materials, silicon wafers, silicon chips, monocrystalline silicon, germanium-silicon materials, SOI materials, solar-grade silicon materials & compound semiconductor materials, quartz products, graphite products, anti-static materials, wafer tapes, photomasks, electronic gases, specialty chemical gases, CMP polishing materials, packaging substrates, lead frames, bonding wires, encapsulation materials, ceramic substrates, packaging & testing materials, etc.

Wafer Manufacturing & Packaging:Wafer fabrication, SiP packaging, silicon wafers & IC packaging substrates, printed circuit boards (PCBs), packaging substrates & equipment, assembly & testing, etc.; packaging design, testing, equipment & application manufacturing & packaging/testing, EDA, MCU, PCBs, packaging substrates, semiconductor materials & equipment, etc.

IC Manufacturing Technologies:Wafer fabrication/foundry, analog ICs, mixed-signal ICs; related microprocessors, memory, FPGAs, discrete devices, optoelectronic devices, power devices, sensor devices & other technical components; IC end-products.

Semiconductor Equipment Manufacturing:Packaging equipment, diffusion furnaces, welding equipment, cleaning equipment, testing equipment, cooling equipment, oxidation furnaces, die bonders, crystal pullers, oxidation furnaces, grinders, lithography machines, etching machines, polishing machines, ion implanters, CVD/PVD equipment, coater/developer systems, reflow soldering, wave soldering, probe stations, cleanroom equipment, etc.

Packaging & Testing Accessories:Test probe stations, probe cards, testers, handlers, packaging equipment, packaging substrates, lead frame bonding wires, wire bonding, burn-in testing, slurry/polishing fluids, laminated substrates, die attach adhesives, loading boards, wire bonding flow control, quartz & graphite, silicon carbide, etc.

Third-Generation Semiconductors:Third-gen semiconductor silicon carbide (SiC), substrates, packaging, testing, optoelectronic devices (LEDs, laser diodes (LD), UV detectors), power electronic devices (diodes, MOSFETs, JFETs, BJTs, IGBTs, GTOs, ETOs, SBDs, HEMTs, etc.), microwave & RF devices (HEMTs, MMICs), etc.

Smart Power Technologies:Microwave & RF, semiconductor LEDs, ion power supplies, smart shared charging, communication power supplies, PV/wind/energy storage power design, power converter magnetic technologies, etc.

IC Design:IC & related electronic product design, IC products & application technologies, IC testing methods & instruments, IC design & design tools, IC manufacturing & packaging, EDA, IP design, embedded software, digital circuit design, analog & mixed-signal circuit design, IC layout design, etc.

Electronic Components:Resistors, capacitors, potentiometers, electron tubes, heat sinks, electromechanical components, connectors, semiconductor discrete devices/IGBTs, electro-acoustic devices, laser devices, electronic display devices, optoelectronic devices, sensors, power supplies, switches, micro-motors, electronic transformers, relays, printed circuit boards, PCB base materials, passive components, 5G core components, power management ICs, memory, PCB boards, motor fans, electro-acoustic devices, display devices, diodes, transistors, etc.

Cutting-Edge Innovative Applications:AI chips, display chips, driver ICs, power management ICs, sensor chips, IoT chips, communication chips, automotive electronics chips, computer & control chips, memory chips, 5G chips, automotive-grade chips, audio/video processing chips, etc.

Bilateral Cooperation Projects:Scientific research achievements in new technologies/products, R&D & design, project investment, technology transfer, OEM/ODM manufacturing, joint production & sales, agency & distribution, brand franchising, testing & technical services, etc.