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China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition (CSEAC)Catalog consultation
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1. The exhibitor directory / e-catalog will be delivered within 1–2 business days by email to the applicant's inbox . Please check your mail (including spam). If you still do not receive it, contact 0571-88535771.
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Fair basics
Industry scope
Wafer Fabrication: Processing and inspection equipment such as crystal pullers, lithography systems, etching equipment, and thin-film deposition systems, covering the entire technological process from wafer processing, lithography, and heat treatment to precision inspection.
Core Components & Consumables: Key supporting components including EFEMs, vacuum products, precision transmission parts, optical lenses, and core lithography machine components.
Packaging & Testing: Packaging and testing equipment covering thinning, dicing, bonding, and testing processes.
Materials: Front-end materials such as silicon wafers, photoresists, and electronic gases, to back-end materials including packaging substrates, bonding wires, and encapsulation resins.
Supporting Infrastructure: Industry-supporting equipment and software such as photomask making equipment, cleanroom engineering, and automation systems.
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