China Western Semiconductor and Integrated Circuit Industry ExpoCatalog consultation
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Fair basics
Industry scope
IC Design Zone: EDA, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, and more
Integrated Circuit Manufacturing Zone: Wafer fabrication facilities, foundries, manufacturing of analog ICs, digital ICs, and mixed-signal ICs, among others
Packaging and Testing Zone: Test probe stations, test equipment, sorters, packaging machinery, packaging substrates, lead frames, bonding wires, and more
Semiconductor Materials Zone: Silicon wafers and silicon-based materials, photomasks, electronic gases, photoresists and associated reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, encapsulating materials, ceramic substrates, die-attach adhesives, and more
Equipment Manufacturing Zone: Thinning machines, single-crystal furnaces, grinding machines, thermal processing equipment, lithography tools, etching systems, ion implantation equipment, CVD/PVD systems, cleaning equipment, dicing saws, wafer probers, bonding machines, test equipment, sorters, probe stations, and more
Third-Generation Semiconductor Special Zone: Featuring gallium nitride (GaN), silicon carbide (SiC), zinc oxide (ZnO), diamond, and related materials and application technologies
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