Exhibition Information
- Name
- Semicon Taiwan
- Industry
- Semiconductors
- City
- Taiwan
- Venue
- No. 1 Jingmai 2nd Road, Nangang District
- Abbreviation
- Semicon Taiwan
- Exhibition Dates
- Visitors
- 60000 visitors
- Exhibitors
- 1000 exhibitors
展会简介
The Exhibition Value of SEMICON Taiwan
- SEMICON Taiwan is one of the largest and most influential specialized events in the global semiconductor industry. Since its inception in 1996, it has been successfully held for thirty editions and is widely acclaimed in the industry as the “Olympics of Semiconductors” and the “World Exposition of Technology.” It serves as a core platform for connecting global semiconductor supply-chain resources, showcasing cutting-edge technological achievements, and shaping industry development trends. Hosted by SEMI, the International Semiconductor Industry Association, the 2025 edition marks the event’s 30th anniversary, with an unprecedented scale that underscores its unique status as a global bellwether for the semiconductor industry.
- The core value of participation lies in the exhibition’s role as a premier platform that brings together world-class industry resources and leading figures. In 2025, the event will attract more than 1,200 exhibiting companies from 56 countries and regions, occupying over 4,100 booths, with attendance exceeding 100,000 visitors. A record-breaking 17 national pavilions will be featured, including first-time participants from Canada, Costa Rica, Lithuania, Sweden, Vietnam, and other nations. During the show, more than 200 industry leaders from around the globe—including Infineon CEO Jochen Hanebeck, Silicon Valley “chip guru” Jim Keller, ASE Group CEO Wu Tian-yu, and TSMC Senior Vice President of Advanced Packaging He Jun—will engage in high-level dialogues, providing enterprises with a strategic gateway to directly connect with key global decision-makers.
- The exhibition establishes a one-stop commercial platform spanning the entire semiconductor value chain. Exhibits cover advanced process technologies, advanced packaging, AI and HBM, automotive electronics, intelligent robotics, green manufacturing, semiconductor materials, precision machinery, and semiconductor cybersecurity—encompassing every segment of the industry. In 2025, dedicated zones such as the AI Semiconductor Technology Pavilion, the Materials Zone, the Precision Machinery Zone, the Wide Bandgap Power Semiconductor Zone, and the Semiconductor Packaging Zone will be introduced, creating a comprehensive ecosystem for technology demonstration and business matchmaking—from chip fabrication to IC design, and from specialized hardware to packaging and testing.
- The exhibition aligns with three major industry trends—AI-driven innovation, heterogeneous integration, and sustainable development—establishing a hub for deep collaboration among industry, academia, research institutions, and end-users. During the 2025 event, the SEMI 3DIC Advanced Packaging Alliance will be officially launched, co-led by TSMC and ASE, focusing on industrial cooperation and supply-chain resilience. The G2C+ Alliance will unveil its next-generation CoWoS‑based CoPoS advanced packaging technology, which can increase chip utilization rates to over 90%. Dexin Holdings will participate through a “Alliance Pavilion,” highlighting the vertical integration capabilities of 18 TSMC suppliers. Concurrently, more than 25 international forums will be held, addressing technological trends, industrial strategies, and sustainability, while the SEMI E187 semiconductor equipment cybersecurity certification scheme will also be introduced for the first time.
- For Chinese enterprises, this exhibition represents a strategic gateway for expanding into global markets, connecting with international resources, and showcasing innovative strengths. In 2025, exhibitors include Shenzhen Hanchi Technology, Suzhou Sumag Intelligent Technology, Shenzhen Meirui Precision Electronics, Hangzhou Woken New Materials, Suzhou Huaxing Yuanchuang, and numerous other mainland Chinese companies. Through the “International Semiconductor Week” format, the event fosters in-depth dialogues between Taiwan and Poland, South Korea, Japan, India, and other countries, providing enterprises with an efficient platform to access global supply-chain resources. Participating companies can leverage this platform to secure global procurement channels and seize early opportunities in the AI‑driven evolution of the semiconductor industry.




