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HomeChina Fair2026-01 Semiconductors Fair
IC & SENSOR PACKAGING TECHNOLOGY EXPO exhibition logo

IC & SENSOR PACKAGING TECHNOLOGY EXPO

Japan Tokyo IC and Sensor Packaging Technology Exhibition
2026.01.21-01.23
Ticket Booth Exhibitor
7256 ViewsDays to Open: 57 days
1
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ICP: Zhe ICP 18015679policeZhejiang public network Record 33011002013432
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Booth:0571-88560061
Audience:0571-88683357
Monday to Sunday 9:00-18:00