
OCP APAC SummitOCP APAC Summit
OCP APAC Summit Profile
The OCP APAC Summit, organized by the Open Compute Project (OCP), brings together the Asia-Pacific community for a dedicated face-to-face summit to explore the numerous challenges and opportunities facing data center infrastructure today and tomorrow.
The OCP APAC Summit will showcase the latest innovations and technological advancements from around the world, featuring keynote speeches from experts who are researching, designing, building, and operating next-generation hyperscale data center facilities and infrastructure. The exhibition hall will gather buyers and sellers from across the entire ecosystem and supply chain.
Juzhan has successfully organized numerous high-quality enterprises to participate! The OCP APAC Summit primarily targets professionals and companies in data center infrastructure, AI computing hardware, and high-performance computing. The OCP Summit is not only a platform for economic cooperation and exchange but also a vital opportunity for the development of the Asia-Pacific region.
Exhibitor List
OCP APAC Summit Product Range
Discrete Semiconductors / Power Devices: Discrete semiconductor devices, semiconductor ICs, IGBTs, MOSFETs, diodes, rectifiers, thyristors, SCRs, power modules, integrated circuits, optoelectronic components, etc.
Passive Components: Capacitors, resistors, filters, busbars, circuit protection components, magnetic components, connectors, sensors, relays, etc.
Power Systems: AC-DC and DC-DC converters, power modules, UPS (Uninterruptible Power Supply), linear power supplies, three-phase/single-phase power filters, EMC and interference suppression technologies, etc.
Thermal Management Solutions: Heat sinks, radiators, heat pipes, thermal conductive materials, liquid cooling systems, water cooling systems, etc.
Other Supporting Technologies: Test and measurement equipment, servo technology, software tools, test management systems, etc.
OCP APAC Summit Booth Sales



OCP APAC Summit Ticket Sales



OCP APAC Summit Venue
OCP APAC SummitCommunity
OCP APAC Summit Booth price

Standard booth Configuration

Blank booth Configuration
OCP APAC Summit Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition























