NEPCON JAPAN
Tokyo Electronics Manufacturing Equipment Expo
2027.02.17-02.19
Japan Tokyo IC and Sensor Packaging Technology ExhibitionIC & SENSOR PACKAGING TECHNOLOGY EXPO
Tokyo Big Sight International Exhibition Center
1 / 1
Annual
1.6万㎡
Area
375
Exhibitor
18k
Attendee
Ticket Sold Out
Days to Open: 376days
Photos
9477 Views
Industry:Sensor
Organizer:
Reed Exhibitions
Japan Tokyo IC and Sensor Packaging Technology Exhibition Profile
Japan Tokyo IC and Sensor Packaging Technology Exhibition (IC & SENSOR PACKAGING TECHNOLOGY EXPO) is a leading professional packaging technology exhibition in Japan. It is a specialized exhibition showcasing semiconductor/sensor and other electronic device packaging technologies.
Japan Tokyo IC and Sensor Packaging Technology Exhibition (IC & SENSOR PACKAGING TECHNOLOGY EXPO) is a good place for engineers in the semiconductor, sensor, electronics, automotive industries to conduct business negotiations.
Japan Tokyo IC and Sensor Packaging Technology Exhibition (IC & SENSOR PACKAGING TECHNOLOGY EXPO)The previous exhibition covered an area of 16,000 square meters, with 375 participating companies from China, South Korea, Taiwan, India, Thailand, Malaysia, Singapore, Turkey, Germany, etc., and 18,240 participants. The exhibition has strong professionalism and good trade results, attracting many high-tech equipment enthusiasts, users, and industry audiences.
Exhibitor List
Japan Tokyo IC and Sensor Packaging Technology Exhibition
Exhibitor: 0
$0.00
Japan Tokyo IC and Sensor Packaging Technology Exhibition Range
Equipment, packaging materials/components, IC packaging analysis/simulation software, semiconductor devices/detection equipment
SATS/contract design services, plating/etching materials and equipment, MEMS equipment/packaging equipment (The content of this article belongs exclusively to Juzhan, and unauthorized forwarding is prohibited)
Japan Tokyo IC and Sensor Packaging Technology Exhibition Booth Sales
Mr. Wu
Japan Tokyo IC and Sensor Packaging Technology Exhibition Ticket Sales
Mr. Han
Japan Tokyo IC and Sensor Packaging Technology Exhibition Venue
Tokyo Big Sight International Exhibition Center
Japan Tokyo IC and Sensor Packaging Technology ExhibitionCommunity
苏州长城精工科技股份有限公司
苏州崇越工程有限公司
鸿劲兴业精密科技(苏州)有限公司
东莞金源五金机械有限公司
东莞触点智能装备有限公司
麦斯克电子材料股份有限公司
高正科技有限公司
马克拉伯(深圳)科技有限公司
青岛赛尔科技有限公司
青岛育豪微电子设备有限公司
陕西智拓固相增材制造技术有限公司
阿斯富乐半导体科技(苏州)有限公司
More
Japan Tokyo IC and Sensor Packaging Technology Exhibition Booth price
Standard booth Configuration
Carpet
A desk
2~3 chair
A wastebasket
Company board
2~3 spotlight
Two (three) face wall panels
Standard booth Price:View price
For reference only, the actual booth configuration shall prevail
Blank booth Configuration
No facilities included
Comply with pavilion restrictions
Minimum size required
Blank booth Price:View price
For reference only, the actual booth configuration shall prevail
Japan Tokyo IC and Sensor Packaging Technology Exhibition Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Profile
Application
Get Ticket
Exhibitor
Warm
There is a certain risk of change in the exhibition time and location. Please refer to the electronic ticket voucher received. The exhibition will also provide phone and SMS notifications for users who book tickets to avoid travel losses.
Notification
Check for changes in show hours and transportation information at your fingertips.
Public account
Mini program
Booth Sales
Office hours: Monday to Friday 09:00-18:00
Cooperation
WEARABLE EXPO
Japan Tokyo Wearable Devices Expo
2027.02.17-02.19
INTERNEPCON JAPAN
Japan Tokyo Electronic Components Exhibition
2027.02.17-02.19
ELECTROTEST JAPAN
Japan Tokyo Electronic Test, Measurement and Analysis Technology Exhibition
2027.02.17-02.19
ELECTRONIC COMPONENTS & MATERIALS EXPO
Japan Tokyo Electronic Parts and Equipment Exhibition
2027.02.17-02.19
PWB EXPO
Japan Tokyo Printed Circuit Board Exhibition
2027.02.17-02.19
FINE PROCESS TECHNOLOGY EXPO
Japan Tokyo Fine Precision Processing Technology Exhibition
2027.02.17-02.19
SMART FACTORY EXPO TOKYO
Japan Tokyo Smart Factory Exhibition
2027.02.17-02.19
RoboDEX Tokyo
Japan Tokyo Robot Exhibition
2027.02.17-02.19
Sensor Fair
Japan Tokyo IC and Sensor Packaging Technology Exhibition
Ticket : Sold out
ServiceBooth: 0571-88535771
Spectator: 0571-89099107
Online
门票咨询
Mr. Han
金牌项目经理
OnlineTel 13336023729
Mobile phone 13336023729
展位咨询
Mr. Wu
金牌项目经理
OnlineTel 0571-88535771
Mobile phone 13867062165
Work time:Monday to Friday09:00-18:00
My
Ticket- Booth apply