NEPCON JAPAN
NEPCON JAPAN
2027.02.17-02.19
IC & Sensor Packaging Technology Expo TokyoIC & SENSOR PACKAGING TECHNOLOGY EXPO
Tokyo Big Sight International Exhibition Center
1 / 1
Annual
1.6万㎡
Area
375
Exhibitor
18k
Attendee
Exhibitor List ¥280 Ticket ¥300
Open: 244days
Photos
1.1w Views
Industry:Sensor
Organizer:
RX (Reed Exhibitions)
IC & Sensor Packaging Technology Expo Tokyo Profile
The IC & Sensor Packaging Technology Expo Tokyo is Japan's leading professional exhibition dedicated to packaging technologies. It specifically showcases packaging solutions for semiconductors, sensors, and other electronic devices.
Juzhan has repeatedly organized delegations of high-quality enterprises to participate! The IC & Sensor Packaging Technology Expo Tokyo serves as an excellent venue for business negotiations with engineers from the semiconductor, sensor, electronic equipment, and automotive industries.
The IC & Sensor Packaging Technology Expo Tokyo covered a total area of 16,000 square meters at its last edition, featuring 375 exhibitors from China, South Korea, Taiwan, India, Thailand, Malaysia, Singapore, Turkey, Germany, and other regions, with 18,240 attendees. Renowned for its high professionalism and strong trade outcomes, the event has attracted numerous high-tech equipment enthusiasts, end-users, and industry professionals.
Exhibitor List
2023 IC & Sensor Packaging Technology Expo Tokyo
Exhibitor: 1363
$280
KH
Kawasaki Heavy Industries, Ltd.
Booth No： 54-26 Region: 日本
BI
BROTHER INDUSTRIES, LTD.
Booth No： 56-20 Region: 日本
EE
Emerson Electric Co.
Booth No： 34-8 Region: 美国
TI
Toray Industries, Inc.
Booth No： 27-36 Region: 日本
NC
NIKON CORPORATION
Booth No： 14-7 Region: 日本
IC & Sensor Packaging Technology Expo Tokyo Product Range
Equipment & Machinery, Packaging Materials/Components, IC Packaging Analysis/Simulation Software, Semiconductor Devices/Testing Equipment
SATS/Contract Design Services, Plating/Etching Materials & Equipment, MEMS Equipment/Packaging Equipment
IC & Sensor Packaging Technology Expo Tokyo Booth Sales
Mr. Wu
IC & Sensor Packaging Technology Expo Tokyo Ticket Sales
Mr. Han
刘小姐
IC & Sensor Packaging Technology Expo Tokyo Venue
Tokyo Big Sight International Exhibition Center
Address: 3-21-1 Ariake, Koto-ku, Tokyo 135-0063, Japan
IC & Sensor Packaging Technology Expo TokyoCommunity
苏州长城精工科技股份有限公司
苏州崇越工程有限公司
鸿劲兴业精密科技(苏州)有限公司
东莞金源五金机械有限公司
东莞触点智能装备有限公司
麦斯克电子材料股份有限公司
高正科技有限公司
马克拉伯(深圳)科技有限公司
青岛赛尔科技有限公司
青岛育豪微电子设备有限公司
陕西智拓固相增材制造技术有限公司
阿斯富乐半导体科技(苏州)有限公司
More
IC & Sensor Packaging Technology Expo Tokyo Booth price
Standard booth Configuration
Carpet
A desk
2~3 chair
A wastebasket
Company board
2~3 spotlight
Two (three) face wall panels
Standard booth Price:View price
For reference only, the actual booth configuration shall prevail
Blank booth Configuration
No facilities included
Comply with pavilion restrictions
Minimum size required
Blank booth Price:View price
For reference only, the actual booth configuration shall prevail
IC & Sensor Packaging Technology Expo Tokyo Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Profile
Application
Get Ticket
Exhibitor
Booth Sales
Office hours: Monday to Friday 09:00-18:00
Warm
There is a certain risk of change in the exhibition time and location. Please refer to the electronic ticket voucher received. The exhibition will also provide phone and SMS notifications for users who book tickets to avoid travel losses.
Notification
Check for changes in show hours and transportation information at your fingertips.
Public account
Mini
Cooperation
WEARABLE EXPO
Tokyo Wearable Technology Exhibition, Japan
2027.02.17-02.19
INTERNEPCON JAPAN
Japan Tokyo Electronic Components Exhibition
2027.02.17-02.19
ELECTROTEST JAPAN
ELECTROTEST JAPAN
2027.02.17-02.19
ELECTRONIC COMPONENTS & MATERIALS EXPO
Electronic Components & Materials Expo
2027.02.17-02.19
PWB EXPO
Japan Printed Circuit Board Exhibition (PWB EXPO)
2027.02.17-02.19
FINE PROCESS TECHNOLOGY EXPO
Fine Process Technology Expo
2027.02.17-02.19
SMART FACTORY EXPO TOKYO
SMART FACTORY EXPO TOKYO
2027.02.17-02.19
RoboDEX Tokyo
RoboDEX Tokyo
2027.02.17-02.19
Sensor Fair
IC & Sensor Packaging Technology Expo Tokyo
Ticket : ¥300
OnlineBooth: 0571-88535771
Spectator: 0571-89099107
Online
门票咨询
Mr. Han
金牌项目经理
OnlineTel 13336023729
Mobile phone 15397162655
门票咨询
铜牌项目经理
OnlineTel 18067909721
Mobile phone 18067909721
展位咨询
Mr. Wu
金牌项目经理
OnlineTel 13867062165
Mobile phone 13867062165
Work time:Monday to Friday09:00-18:00
My
Ticket- Booth apply