NEPCON JAPAN
Tokyo Electronics Manufacturing Equipment Expo
2026.01.21-01.23
Japan Tokyo IC and Sensor Packaging Technology Exhibition
IC & SENSOR PACKAGING TECHNOLOGY EXPO
3-21-1 Ariake, Koto-ku, Tokyo 135-0063, Japan
Annual
1 / 1
Area
1.6万㎡
Exhibitor
375
Attendee
18k
Ticket Sold Out
0
Days to Open: 90days
Visa Processing
Photos
7197 Views
Industry:Sensor
Organizer:
Reed Exhibitions
Japan Tokyo IC and Sensor Packaging Technology Exhibition Expo Profile
Japan Tokyo IC and Sensor Packaging Technology Exhibition (IC & SENSOR PACKAGING TECHNOLOGY EXPO) is a leading professional packaging technology exhibition in Japan. It is a specialized exhibition showcasing semiconductor/sensor and other electronic device packaging technologies.
Japan Tokyo IC and Sensor Packaging Technology Exhibition (IC & SENSOR PACKAGING TECHNOLOGY EXPO) is a good place for engineers in the semiconductor, sensor, electronics, automotive industries to conduct business negotiations.
Japan Tokyo IC and Sensor Packaging Technology Exhibition (IC & SENSOR PACKAGING TECHNOLOGY EXPO)The previous exhibition covered an area of 16,000 square meters, with 375 participating companies from China, South Korea, Taiwan, India, Thailand, Malaysia, Singapore, Turkey, Germany, etc., and 18,240 participants. The exhibition has strong professionalism and good trade results, attracting many high-tech equipment enthusiasts, users, and industry audiences.
Exhibitor List
Japan Tokyo IC and Sensor Packaging Technology Exhibition
Exhibitor: 0
$0.00
Japan Tokyo IC and Sensor Packaging Technology Exhibition Range
Equipment, packaging materials/components, IC packaging analysis/simulation software, semiconductor devices/detection equipment
SATS/contract design services, plating/etching materials and equipment, MEMS equipment/packaging equipment (The content of this article belongs exclusively to Juzhan, and unauthorized forwarding is prohibited)
AsiaSensor Related exhibition
exhibitionDetail.boothMap
personal.electronic_journal
Japan Tokyo IC and Sensor Packaging Technology Exhibition Booth Sales
Mr. Wu
Japan Tokyo IC and Sensor Packaging Technology Exhibition Ticket Sales
Mr. Han
Japan Tokyo IC and Sensor Packaging Technology Exhibition Venue
Tokyo Big Sight International Exhibition Center
Japan Tokyo IC and Sensor Packaging Technology Exhibition Booth price
Standard booth Configuration
Carpet
A desk
2~3 chair
A wastebasket
Company board
2~3 spotlight
Two (three) face wall panels
Standard booth Price:View price
For reference only, the actual booth configuration shall prevail
Blank booth Configuration
No facilities included
Comply with pavilion restrictions
Minimum size required
Blank booth Price:View price
For reference only, the actual booth configuration shall prevail
Japan Tokyo IC and Sensor Packaging Technology Exhibition Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Expo Profile
Application
Get Ticket
Exhibitor
Warm
There is a certain risk of change in the exhibition time and location. Please refer to the electronic ticket voucher received. The exhibition will also provide phone and SMS notifications for users who book tickets to avoid travel losses.
Notification
Check for changes in show hours and transportation information at your fingertips.
Public account
Mini program
Cooperation
WEARABLE EXPO
Japan Tokyo Wearable Devices Expo
2026.01.21-01.23
INTERNEPCON JAPAN
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2026.01.21-01.23
ELECTROTEST JAPAN
Japan Tokyo Electronic Test, Measurement and Analysis Technology Exhibition
2026.01.21-01.23
ELECTRONIC COMPONENTS & MATERIALS EXPO
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2026.01.21-01.23
PWB EXPO
Japan Tokyo Printed Circuit Board Exhibition
2026.01.21-01.23
FINE PROCESS TECHNOLOGY EXPO
Japan Tokyo Fine Precision Processing Technology Exhibition
2026.01.21-01.23
LED & LASER DIODE TECHNOLOGY EXPO
Japan Tokyo LED and Laser Diode Technology Exhibition
2026.01.21-01.23
SMART FACTORY EXPO TOKYO
Japan Tokyo Smart Factory Exhibition
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RoboDEX Tokyo
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Sensor Fair
IC & SENSOR PACKAGING TECHNOLOGY EXPO
7198 Views
Days to Open: 90 days
MEMS Sensing & Network System
6737 Views
Days to Open: 97 days
Japan Tokyo IC and Sensor Packaging Technology Exhibition
Ticket : Sold out
ServiceBooth: 0571-88560061
Spectator: 0571-88683357
门票咨询
Mr. Han
金牌项目经理
Tel 0571-88683357
Mobile phone 13336023729
展位咨询
Mr. Wu
金牌项目经理
Tel 0571-88535771
Mobile phone 13867062165
Work time:Monday to Friday09:00-18:00
My
Ticket- Booth apply
