

Japan Tokyo Printed Circuit Board Exhibition Expo Profile
Japan Tokyo Printed Circuit Board Exhibition (PWB EXPO) is the leading printed circuit board exhibition in Japan. It showcases the latest printed circuit boards and related technologies that support high performance and high-performance electronic devices. It's a great place for engineers to conduct business negotiations and technical consultations with electronic devices, smartphones, automotive electronics, and other products.
Japan Tokyo Printed Circuit Board Exhibition (PWB EXPO)covered an area of 18,000 square meters, with 385 participating companies from China, Taiwan, China, South Korea, Dubai, India, Russia, Germany, France, Ukraine, the United States, etc., and a total of 21,647 participants.
Japan Tokyo Printed Circuit Board Exhibition (PWB EXPO)mainly come from electrical equipment manufacturing enterprises, semiconductor and assembly industries, automotive transportation machinery manufacturing enterprises, other electronic product manufacturing enterprises, etc.
Exhibitor List
Japan Tokyo Printed Circuit Board Exhibition Range
Various printed circuit boards: Rigid printed circuit boards, flexible (foldable) printed circuit boards, combined printed circuit boards, optical printed circuit boards, multi-layer printed circuit boards, printed circuit boards for semiconductor packaging, multi-layer printed circuit boards, soft printed circuit boards
Embedded printed circuit boards
Printed circuit board materials
Printed circuit board design tools
Design, development, and manufacturing commission services
Japan Tokyo Printed Circuit Board Exhibition Booth Sales

Japan Tokyo Printed Circuit Board Exhibition Ticket Sales

Japan Tokyo Printed Circuit Board Exhibition Venue
Japan Tokyo Printed Circuit Board Exhibition Booth price

Standard booth Configuration

Blank booth Configuration
Japan Tokyo Printed Circuit Board Exhibition Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Cooperation


WEARABLE EXPO

INTERNEPCON JAPAN

ELECTROTEST JAPAN

IC & SENSOR PACKAGING TECHNOLOGY EXPO

ELECTRONIC COMPONENTS & MATERIALS EXPO

FINE PROCESS TECHNOLOGY EXPO

LED & LASER DIODE TECHNOLOGY EXPO

SMART FACTORY EXPO TOKYO
















