Computing Infrastructure and Core Hardware

AI computing chips: CPUs, GPUs, FPGAs, ASICs, NPUs, DPUs, and other training and inference chips

Computing equipment: AI servers (including high-density AI servers, liquid-cooled servers, edge computing appliances), GPU computing clusters, supercomputing/intelligent computing center equipment

Supporting hardware: servers, storage devices, networking equipment (switches, routers), optical modules, fiber optic cables, liquid cooling systems, cabinet power supplies, etc.

Data Center Construction and Supporting Systems

Data center infrastructure: micro-module data centers, containerized data centers, intelligent cabinet systems

Supporting systems: power distribution systems (UPS, precision distribution cabinets, PDUs, energy storage power supplies, busbar systems), precision air-conditioning, fresh-air energy-saving cooling, comprehensive cabling systems, fire safety and security measures, intelligent room management, environmental monitoring systems, etc.

Intelligent/Supercalculating/Edge Computing Centers

Overall schemes: general-purpose computing centers, intelligent computing centers, supercomputing centers, edge computing centers, computing clusters, and comprehensive computing network node plans

Computing Services

Services and platforms: operators, EPC/design institutes, cloud service providers, third-party IDCs, computing power leasing, computing power scheduling, computing power operations and maintenance, computing power security, integrated computing services, etc.

Liquid Cooling Core Technologies and Equipment

Liquid cooling systems: plate-type liquid cooling (including full-liquid-cooled server plates), immersion-type liquid cooling (single-phase/two-phase), spray-type liquid cooling, pipeline-type liquid cooling

Supporting technologies: cold module decoupling design, intelligent temperature control systems, fluid distribution techniques

Core components: coolant fluids (fluorinated liquids, mineral oils, silicone oils, aqueous solutions, etc.), cooling plates, pumps, valves, quick-connect fittings, heat exchangers, leak detection devices, smart sensors, phase-change materials (PCM), etc.

Liquid Cooling Devices, Raw Materials, and Auxiliary Equipment

Liquid cooling devices: plate-type liquid cooling supplies, metal cooling plates, heating equipment and components, liquid circulation devices, immersion-type liquid cooling supplies, heat dissipation devices, radiators, cooling fans, compressors, drive ring power assemblies, temperature control components, thermostats/temperature controllers, temperature sensors, evaporators, condensers, expansion tanks/coolant reservoirs, etc.

Piping and connectors: rubber hoses, metal pipes, corrugated pipes, insulated pipes, water pipes/connectors, cooling pipelines and various connecting parts, etc.

Auxiliary heat dissipation equipment: cooling fans, heat-dissipating materials, enhanced radiators, ambient air exchange devices, etc.