Verified: updated on

Shenzhen AIlogo

Shenzhen High-Tech Fair AI Computing Power Industry and Data Center Liquid Cooling Technology Exhibition

CHTF

Dates
Show Hours:
Venue
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER
Highlights
An international industry matchmaking platform for AI computing power and liquid cooling technologies in data centers.
Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

Shenzhen High-Tech Fair AI Computing Power Industry and Data Center Liquid Cooling Technology Exhibition Same Period Exhibition

Exhibition Data

1/1
Edition
10000㎡
Exhibition area
120
Exhibitors
451000
Visitors

Shenzhen AI Expo Details

The Shenzhen High-Tech Fair’s AI Computing Power Industry and Data Center Liquid Cooling Technology Exhibition focuses on the synergy between AI computing infrastructure and green energy, encompassing liquid-cooled servers, energy storage systems, green power supply equipment, and intelligent scheduling platforms. It brings together leading enterprises to showcase integrated solutions, targeting the data center, new energy, and smart manufacturing sectors, thereby advancing the practical implementation of computing–power integration.
Industry:
AI fairShenzhenAI Expo
Organizer:
Ministry of Commerce, Ministry of Science and Technology, Ministry of Industry and Information Technology of China
City:
GuangdongShenzhen
Venue:
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER
Address:
No. 1, Exhibition City Road, Peace Community, Fuhai Street, Bao'an District, Shenzhen

Profile

The Shenzhen High-Tech Fair AI Computing Power Industry and Data Center Liquid Cooling Technology Exhibition (CHTF) is a flagship event of the High-Tech Fair, dedicated to showcasing Asia’s AI computing power industry and data center technologies. With computing and power integration as its core highlight, the exhibition breaks away from traditional single-product displays, establishing an end-to-end ecosystem platform encompassing “computing power + electricity + energy storage + intelligent scheduling.” By fostering collaborative innovation among upstream and downstream enterprises, it explores synergistic pathways between digital infrastructure and next-generation power systems, providing a vital platform for industrial matchmaking to nurture new productive forces and advance dual-carbon goals.

As large-scale AI models and digital industries accelerate their deployment, computing power has become the cornerstone underpinning the development of new productive forces. However, rapidly growing demand for computing capacity has also brought to the fore persistent challenges such as high energy consumption and difficulties in integrating green power sources. Intelligent computing clusters rely heavily on electricity, with power costs accounting for over 50% of total operating expenses. Meanwhile, renewable energy sources like wind and solar suffer from intermittency and volatility, making it difficult to sustainably support large-scale computing loads. Consequently, the tension between computing growth and green, low-carbon development has become increasingly pronounced, rendering computing–power coordination a critical breakthrough for the industry.

Historically, the computing, renewable energy, energy storage, and smart dispatch sectors have operated independently, with companies focusing solely on developing and selling individual components. This fragmentation of software and hardware ecosystems, coupled with siloed solutions, has resulted in cumbersome implementation processes and insufficient stability for green computing projects—challenges that fail to meet national requirements for integrated source–grid–load–storage systems.

The standout feature of this year’s Shenzhen High-Tech Fair AI Computing Power Industry and Data Center Exhibition is its shift from standalone product showcases to comprehensive, end-to-end system solutions, aligning precisely with national policy priorities. Participating companies will present fully integrated packages covering the entire workflow—from renewable energy generation and energy storage management to computing hardware deployment and intelligent software-based scheduling—including liquid-cooled computing servers, high-capacity energy storage systems, green power supply equipment, and AI-powered energy management platforms—all delivered as complete software–hardware suites.

The Shenzhen High-Tech Fair AI Computing Power Industry and Data Center Liquid Cooling Technology Exhibition (CHTF) replaces isolated product displays with holistic system solutions and fragmented presentations with closed-loop industrial ecosystems, thereby redefining the paradigm of computing–power collaboration. This approach aims to shed the “high-energy-consuming” stigma associated with the computing sector and position it as a pivotal driver for advancing new productive forces and achieving dual-carbon objectives.

Shenzhen High-Tech Fair AI Computing Power Industry and Data Center Liquid Cooling Technology Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

Partial exhibitor directory and exhibitor list for Shenzhen High-Tech Fair AI Computing Power Industry and Data Center Liquid Cooling Technology Exhibition: 龙芯中科技术股份有限公司, 邦彦技术股份有限公司, 中山市世豹新能源有限公司, 深圳市研越科技有限公司, 中科热科技江苏有限公司, 深圳市研盛芯控电子技术有限公司, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.

View more

CHTF 2026 Venue Map

Shenzhen AI venue floor plan

CHTF Exhibitior List

Shenzhen High-Tech Fair AI Computing Power Industry and Data Center Liquid Cooling Technology Exhibition Range

Is my product suitable?

Computing Infrastructure and Core Hardware

AI Computing ChipsCPUGPUFPGAASICNPUDPUTraining ChipsInference ChipsAI ServersHigh-Density AI ServersLiquid-Cooled ServersEdge Computing SystemsGPU Computing ClustersSupercomputing Center EquipmentIntelligent Computing Center EquipmentStorage DevicesSwitchesRoutersOptical ModulesFiber Optic CablesCabinet Power Supplies

Data Center Construction and Supporting Systems

Micro-Modular Data CentersContainerized Data CentersSmart Cabinet SystemsUPSPrecision Distribution CabinetsPDUEnergy Storage and Power SupplyBusbar SystemsPrecision Air ConditionersFresh-Air Energy-Saving CoolingStructured Cabling SystemsFire Safety and SecurityIntelligent Data Center ManagementEnvironmental Monitoring Systems

Intelligent Computing, Supercomputing, and Edge Computing Centers

General-Purpose Computing CentersIntelligent Computing CentersSupercomputing CentersEdge Computing CentersComputing ClustersComputing Network Nodes

Computing Services

Telecom OperatorsEPC Design InstitutesCloud Service ProvidersThird-Party IDCsComputing Resource LeasingComputing Resource SchedulingComputing Resource Operations and MaintenanceComputing Resource SecurityComputing Service Integration

Core Liquid-Cooling Technologies and Equipment

Cold-Plate Liquid CoolingAll-Liquid-Cooled Cold-Plate ServersImmersion Liquid CoolingSingle-Phase Immersion Liquid CoolingTwo-Phase Immersion Liquid CoolingSpray Liquid CoolingPiping Liquid CoolingDecoupled Cold-Module DesignIntelligent Temperature-Control SystemsFluid Distribution TechnologiesCoolant FluidsFluorinated LiquidsMineral OilsSilicone OilsAqueous SolutionsCold PlatesPumpsValvesQuick-Connect FittingsHeat ExchangersLeakage Detection DevicesSmart SensorsPhase-Change Materials

Raw Materials and Auxiliary Equipment for Liquid-Cooling Systems

Cold-Plate Liquid-Cooling SuppliesMetallic Cold PlatesHeating Devices and ComponentsLiquid Circulation EquipmentImmersion Liquid-Cooling SuppliesHeat Dissipation ComponentsRadiatorsHeat-Dissipating FansCompressorsDrive Ring Power ComponentsTemperature Control ComponentsThermostatsTemperature ControllersTemperature SensorsEvaporatorsCondensersExpansion TanksCoolant TanksHosesMetal PipesCorrugated PipesInsulated PipesWater PipesFittingsCooling PipelinesConnecting ComponentsCooling FansHeat-Dissipating MaterialsEnhanced RadiatorsAmbient Air Exchange Equipment

Booth Sales

曾经理

Ms. ZengGold-Medal PM

3 Years Booth Sales

2026 Shenzhen AI Ticket Sales

Shenzhen AI Venue

SHENZHEN WORLD EXHIBITION&CONVENTION CENTER
Address: No. 1, Exhibition City Road, Peace Community, Fuhai Street, Bao'an District, Shenzhen
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER实拍
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER实景图
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER实拍图
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER实景
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER展馆图
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER实景图
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER实拍图
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER实景
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER实拍
SHENZHEN WORLD EXHIBITION&CONVENTION CENTER实景

Shenzhen AI Booth Price

Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

Process

  1. 1.Submit the business license of the company
  2. 2.Submit product picture and name
  3. 3.Receive exhibition presentation documents and booth drawings
  4. 4.Submit booth application form/Sign booth contract
  5. 5.Pay the contract booth deposit
  6. 6.Prepare for exhibition