Bondexpo Stuttgart (International Trade Fair for Adhesive Bonding and Sealing Technology)Bondexpo

Bondexpo Stuttgart (Bondexpo) is the world's leading meeting place for industry professionals. Since its inception in 2007, the exhibition has become a global hub for the industry and its users. It covers the entire process chain from bonding, potting, sealing, and foam assembly to joining, providing solutions for practical applications and future industry challenges. In particular, the use of new adhesives is becoming increasingly important in lightweight construction, extending beyond the automotive sector to home appliances and equipment.

Furthermore, Bondexpo serves as a bridge between R&D and practical application. It is co-located with Motek, the world's leading trade fair for automated production and assembly.

JZhan has successfully organized numerous high-quality enterprises to exhibit multiple times! Bondexpo Stuttgart (Bondexpo) showcases new future pathways in adhesives, insulation, foaming, sealing, and encapsulation. Precision bonding, potting, sealing, and foaming are integral components of highly automated handling and robotic systems.

Additionally, Bondexpo Stuttgart (Bondexpo) will host an exhibitor forum where experts will present current adhesive technology topics and products to visitors and exhibitors. Consequently, it has evolved into a premier platform for information and knowledge, making it a pivotal event for the industry.