The American UV+EB Curing Adhesives Exhibition (Radtech) is a global event that combines education, technology, and research in the radiation curing industry. Hosted by Radtech International NA, the North American Radiation Curing Association, it is sponsored by companies such as BASF, DOWA, Heraeus, and Sartomer. The conference mainly discusses the impact of relevant laws and regulations on the UV industry, as well as the latest developments in related technologies such as UV LED, 3D printing, and initiators.

The implementation of Nestle and Swiss regulations has attracted great attention from material and formula companies in the photopolymerization field of the North American Radiation Curing Association. Among them, the most significant impact is the clear inclusion of Bisphenol A (BPA) in the banned list, which requires packaging inks and coatings to seek alternatives. This may have a long-term impact on suppliers of bisphenol A epoxy acrylates and their derivatives. For the replacement of BPA-free materials, major multinational companies have already taken action and developed related alternative materials, with the main direction being polyester acrylates without phenol replacing bisphenol A epoxy resins and modified resins.

Due to its high growth rate in North America, 3D printing is also a key topic at this conference. As a major supplier of UV 3D printing materials, Sartomer is the main reporting company for this topic. Sartomer introduced the characteristics of new resins used for UV 3D printing, RAHN analyzed the design ideas of 3D printing SLA formulas from the formulation perspective, and Dymax also introduced the latest progress in acrylic oligomers for 3D printing. It is worth mentioning that the Chinese desktop 3D printer manufacturer UNIZ participated in the concurrent exhibition during the conference. Through equipment design and material innovation, its speed has far exceeded that of leading enterprises in the industry, capable of printing high-precision three-dimensional products within 20 minutes.

The American UV+EB Curing Adhesives Exhibition (Radtech) attracted the attention of domestic universities and enterprises in China, with personnel from Beijing University of Chemical Technology, Beijing Normal University, Strong New Materials, GuRun Technology, RunAo Chemical, and China General Nuclear Dahseng attending the conference in the United States. Chinese and Taiwan exhibitors include Taitel, Strong, GuRun, QiTai, Tongjin, and UNIZ.