RadTech North America Conference & Exhibition (US UV+EB Curing Adhesives Exhibition)

The US UV+EB Curing Adhesives Exhibition (RadTech) is a premier global event in the radiation curing industry, integrating education, technology, and scientific research. Organized by RadTech International North America, it is sponsored by leading enterprises such as BASF, DOWA, Heraeus, and Sartomer. The conference primarily discusses the impact of relevant laws and regulations on the UV industry, alongside R&D trends and achievements in hot topics like UV LED, 3D printing, and photoinitiators.

The implementation of Nestlé and Swiss regulations has drawn significant attention from material and formulation companies in the UV curing printing sector under RadTech International North America. The most significant impact is the explicit listing of Bisphenol A (BPA) on the restricted substances list, necessitating alternatives for packaging inks and coatings. This may have long-term implications for suppliers of BPA-based epoxy acrylate resins and related derivatives. Regarding BPA-free alternatives, major multinational corporations have already taken action and developed relevant substitute materials, with the primary direction being BPA-free polyester acrylate resins replacing BPA-based epoxy and modified resins.

Due to its high growth rate in North America, 3D printing is also a key topic at this event. As a major supplier of UV 3D printing materials, Sartomer is a leading presenter on this subject. Sartomer introduced the features of new resins for UV 3D printing, RAHN analyzed the formulation design strategy for SLA 3D printing from a formulation perspective, and Dymax presented the latest advancements in acrylic oligomers for 3D printing. Notably, UNIZ, a Chinese manufacturer of UV 3D printing desktop machines, participated in the concurrent exhibition. Through innovative equipment design and materials, its printing speed has significantly surpassed that of industry-leading UV 3D desktop printers, capable of producing high-precision 3D objects in just 20 minutes.

This conference and exhibition have attracted significant attention from Chinese universities and enterprises. Representatives from Beijing University of Chemical Technology, Beijing Normal University, Qiangli New Materials, Gure Technology, Run'ao Chemical, and CGN DaSheng traveled to the US to attend. Chinese and Taiwanese exhibitors included Taitel, Qiangli, Gure, Qitai, Tongjin, and UNIZ.

RadTech North America Conference & Exhibition (US UV+EB Curing Adhesives Exhibition) tickets are e-tickets. Domestic and international visitors must complete online pre-registration with real-name passport verification. After purchase, the organizer verifies visitor identity. Visitors who do not meet entry requirements may need to submit additional documents. Once approved, you will receive email confirmation or a QR code. On site, present your original passport and confirmation letter to collect a paper badge, or scan the QR code to enter.