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Japan Osaka Electronics Components, Materials & Equipment Exhibition

NEPCON Osaka
DatesShow Hours: 09:00-18:00
1/1
Annual
30000㎡
Exhibition area
650
Exhibitors
28000
Visitors
E-Magazine 120
Ticket discount price200
Exhibition rating4.3
Open: days
Get Ticket
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OSAKAElectronic Production expo Fair Details

2027Japan Osaka Electronics Components, Materials & Equipment Exhibition-OSAKAElectronic Production (NEPCON Osaka) will be held from 2027.05.12-05.14 at Intex Osaka. This OSAKAElectronic Production exhibition covers 30000㎡㎡ with 650 exhibitors and expects over 28000 visitors.
Industry:
Electronic Production fairJapanElectronic Production fairOSAKAElectronic Production expo
Organizer:
RX Japan Ltd.
City:
JapanOSAKA
Venue:
Intex Osaka
Address:
1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan

Japan Osaka Electronics Components, Materials & Equipment ExhibitionProfile

NEPCON Osaka, the Japan Electronics Components, Materials & Equipment Exhibition, is one of Asia’s premier trade shows for electronic design, R&D, and manufacturing technologies. Since its inception in 1972, the event has grown steadily alongside the evolution of Japan’s electronics industry, showcasing cutting-edge innovations from the sector each year.

As a benchmark exhibition in the global electronics packaging and manufacturing fields, NEPCON Osaka remains closely aligned with the pulse of Japan’s electronics industry. It has now expanded into a comprehensive platform encompassing前沿 areas such as automotive electronics, electric vehicles, wearable devices, and LED/OLED lighting, serving as a key gateway for industry stakeholders to gain insights into emerging trends shaping the future of the electronics sector.

Japan is a powerhouse in the electronics industry. However, in recent years, driven by the rapid advancement of AI‑enabled electronics, its domestic manufacturing base has experienced a period of decline—shifting from rapid sales growth to reliance on strengths in core electronic components and upstream chemical materials. This transition has given rise to new market demands, presenting favorable opportunities for Chinese manufacturers of complete systems and supporting products to enter the Japanese market, while also opening up vast prospects for collaboration.

Participating in this exhibition offers more than just a platform to showcase products—it provides a valuable chance to gain deep insights into the Japanese semiconductor market. As the birthplace of global semiconductor technology, Japan is renowned for its mature industrial ecosystem, world‑class R&D capabilities, and distinctive business culture.

JUZAN Exhibitions places innovation and exceptional service experience at the heart of its offerings, earning widespread acclaim. For many years, JUZAN has provided efficient, professional exhibition services to Chinese enterprises engaged in international trade. In recent years, NEPCON Osaka has seen a steady increase in exhibitors and visitors from China, South Korea, and Taiwan.

Japan Osaka Electronics Components, Materials & Equipment Exhibition tickets are e-tickets. Domestic and international visitors must complete online pre-registration with real-name passport verification. After purchase, the organizer verifies visitor identity. Visitors who do not meet entry requirements may need to submit additional documents. Once approved, you will receive email confirmation or a QR code. On site, present your original passport and confirmation letter to collect a paper badge, or scan the QR code to enter.

The 2027 Japan Osaka Electronics Components, Materials & Equipment Exhibition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.

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Japan Osaka Electronics Components, Materials & Equipment Exhibition Photos

Japan Osaka Electronics Components, Materials & Equipment Exhibition on-site exhibition (highlights)1
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NEPCON Osaka Exhibitor Directory / E-Magazine

2026 Japan Osaka Electronics Components, Materials & Equipment Exhibition Online Exhibitor Directory

¥120

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Japan Osaka Electronics Components, Materials & Equipment ExhibitionRange

Main Exhibition Areas:Chip mounters, solder paste printers, dispensing equipment, carrier tapes, feeders, marking systems/inkjet printers, ERP/SCM systems, stamping machines, sealing machines, cleaning machines, electromechanical components, tools, software, rework/repair machines, face shields, tape‑winding machines, carrier‑tape forming equipment, laser processors, precision welding machines, factory control and automation systems, PCB separators, nylon cable ties, inspection/testing/measurement equipment, electronic materials, and other related products

EMS/Electronic Contract Manufacturing Area:EMS (Electronic Manufacturing Services), talent‑placement services (engineers), turnkey plant contracting/solutions, consulting services, and various outsourcing services (All content herein is copyrighted by Juzhan; unauthorized reproduction is prohibited.)

Soldering Area:Soldering machines, reflow ovens, desoldering stations, soldering irons, solder pots, flux applicators, soldering materials and fluxes

Material‑Handling Equipment Area:Feeders, unloaders, conveyors, automated sorting systems, palletizing robots, depalletizing machines, sorters, vertical transport systems, automated guided vehicles, material-handling carts, racking systems, mobile racks, pallets, containers, and other storage solutions

Cleanroom/Electrostatic‑Protection Area:Cleanrooms, laminar flow hoods, air showers, particle counters, ionizers, antistatic products, cleanroom supplies (dust‑proof garments, gloves, face masks), cleanroom wipes, vacuum cleaners, and other related items

Factory/Plant‑Equipment Area:Environmental protection and recycling products, plant‑equipment, eco‑friendly measures, storage containers, and various tools

Cleaning Equipment & Cleaning‑Agent Area:Wet‑cleaning equipment, dry‑cleaning equipment, cleaning agents, peripheral products, and related devices

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Booth inquiry for this edition

吴经理
Mr. WuGold-Medal PM
3 Years Booth Sales
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2027 OSAKAElectronic Production Ticket inquiry

韩经理
Mr. HanGold-Medal PM
3 Years Booth Sales
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刘小姐
Ms. LiuGold-Medal PM
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OSAKAElectronic Production Venue

Intex Osaka
Address: 1-5-102 Nanko-Kita, Suminoe-ku Osaka, 559-0034 Japan
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Venue transport

Metro / rail

It’s about a 5-minute walk from Nakafuto Station (Osaka Metro Nankō Port Town Line/New Tram).

It’s about an 8-minute walk from Trade Center-mae Station (Osaka Metro Nankō Port Town Line/New Tram). On rainy days, we recommend this station, as there is a covered route.

It’s about a 9-minute walk from Cosmosquare Station (Osaka Metro Chūō Line). This is the terminus of the Chūō Line; exit through Exit 3 or Exit 4 and follow the signage to reach the exhibition halls.

Air

From Kansai International Airport: Take the Nankai Electric Railway Airport Express or the JR Kansai Airport Rapid Service to Namba Station, then transfer to the subway as directed above to reach the exhibition venue. The total travel time is approximately 50 minutes to 1 hour. There are no direct train services; a transfer is required.

From Osaka Itami Airport: A taxi ride takes about 45 minutes and costs approximately JPY 11,000. Alternatively, you can take the monorail followed by a subway connection, though this option involves multiple transfers and takes around 1 hour in total.

OSAKAElectronic Production Booth Application

Standard booth

Standard booth Configuration

Carpet
A desk
2~3 chair
A wastebasket
Company board
2~3 spotlight
Two (three) face wall panels
Standard booth Price:
For reference only, the actual booth configuration shall prevail
Blank booth

Blank booth Configuration

No facilities included
Comply with pavilion restrictions
Minimum size required
Blank booth Price:
For reference only, the actual booth configuration shall prevail
View floor price

Process

1.Submit the business license of the company

2.Submit product picture and name

3.Receive exhibition presentation documents and booth drawings

4.Submit booth application form/Sign booth contract

5.Pay the contract booth deposit

6.Prepare for exhibition