

日本东京微细精密加工技术展览会
FINE PROCESS TECHNOLOGY EXPO
3-21-1 Ariake, Koto-ku, Tokyo 135-0063, Japan
Annual
1 / 1
Area
1.6万㎡
Exhibitor
378
Attendee
19k
Exhibitor List ¥280 Ticket ¥300
0
Days to Open: 35days
Photos
1.1w Views
Industry:金属加工
Organizer:
励展集团
日本东京微细精密加工技术展览会 Expo Profile
日本东京微细精密加工技术展览会(FINE PROCESS TECHNOLOGY EXPO)是日本领先的微细精密加工技术展览会。汇集了电子制造的成型、切割、冲压、蚀刻等精细工艺技术,聚集各种微型加工和超精密加工技术。(本文内容版权归属聚展所有,未经同意,禁止转发)
日本东京微细精密加工技术展FINE PROCESS TECHNOLOGY EXPO上届展会总面积16000平方米,参展企业378家均来自中国、韩国、中国台湾、新加坡、印度、俄罗斯、土耳其等,参展人数达18500人。
日本东京微细精密加工技术展FINE PROCESS TECHNOLOGY EXPO聚集所有业务技术咨询与设计、研究人员及开发人员,为不同的电子产品制造商,如电器、汽车、汽车设备、半导体、发光二极管、移动通信系统设备、工业设备等提供直接商谈及讨论的专业平台。
Exhibitor List
2023 日本东京微细精密加工技术展览会在线展商名录
Exhibitor: 1363
$280
KH
Kawasaki Heavy Industries, Ltd.
Booth No: COMING SOON Region: 日本
BI
Brother Industries, Ltd.
Booth No: COMING SOON Region: 日本
EE
Emerson Electric Co.
Booth No: COMING SOON Region: 美国
TI
TORAY INDUSTRIES, INC.
Booth No: COMING SOON Region: 日本
NC
NIKON CORPORATION
Booth No: COMING SOON Region: 日本
日本东京微细精密加工技术展览会 Range
冲压加工、切削/钻孔、精密/微细钣金加工、金属成型、精密铸造、镜面磨削、镭射加工、模塑、难切削材料加工等(本文内容版权归属聚展所有,未经同意,禁止转发)
日本金属加工 Related exhibition
exhibitionDetail.boothMap
personal.electronic_journal
日本东京微细精密加工技术展览会 Booth Sales

Ms. Mao
日本东京微细精密加工技术展览会 Ticket Sales

Ms. Lu

Mr. Han
日本东京微细精密加工技术展览会 Venue
Tokyo Big Sight International Exhibition Center
日本东京微细精密加工技术展览会Community

深圳市宽地工业有限公司
470s8c1
View

展位推荐
8qp0141
View
1
shhiop1
View
上海威探
c51kph
View
s9nqgs
View
未知
kn77ah1
View
1
4nxedm1
View
wgn7p93
View
0g4o583
View
日本东京微细精密加工技术展览会 Booth price

Standard booth Configuration
Carpet
A desk
2~3 chair
A wastebasket
Company board
2~3 spotlight
Two (three) face wall panels
Standard booth Price:View price
For reference only, the actual booth configuration shall prevail

Blank booth Configuration
No facilities included
Comply with pavilion restrictions
Minimum size required
Blank booth Price:View price
For reference only, the actual booth configuration shall prevail
日本东京微细精密加工技术展览会 Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
Expo Profile
Application
Get Ticket
Exhibitor
Warm
There is a certain risk of change in the exhibition time and location. Please refer to the electronic ticket voucher received. The exhibition will also provide phone and SMS notifications for users who book tickets to avoid travel losses.
Notification
Check for changes in show hours and transportation information at your fingertips.
Public account
Mini program
Cooperation

Tokyo Electronics Manufacturing Equipment Expo
2026.01.21-01.23

WEARABLE EXPO
Japan Tokyo Wearable Devices Expo
2026.01.21-01.23

INTERNEPCON JAPAN
Japan Tokyo Electronic Components Exhibition
2026.01.21-01.23

ELECTROTEST JAPAN
Japan Tokyo Electronic Test, Measurement and Analysis Technology Exhibition
2026.01.21-01.23

IC & SENSOR PACKAGING TECHNOLOGY EXPO
Japan Tokyo IC and Sensor Packaging Technology Exhibition
2026.01.21-01.23

ELECTRONIC COMPONENTS & MATERIALS EXPO
Japan Tokyo Electronic Parts and Equipment Exhibition
2026.01.21-01.23

PWB EXPO
Japan Tokyo Printed Circuit Board Exhibition
2026.01.21-01.23

FINE PROCESS TECHNOLOGY EXPO
Japan Tokyo Fine Precision Processing Technology Exhibition
2026.01.21-01.23

LED & LASER DIODE TECHNOLOGY EXPO
Japan Tokyo LED and Laser Diode Technology Exhibition
2026.01.21-01.23

SMART FACTORY EXPO TOKYO
Japan Tokyo Smart Factory Exhibition
2026.01.21-01.23

RoboDEX Tokyo
Japan Tokyo Robot Exhibition
2026.01.21-01.23




















