Shenzhen Electronics Show – China Electronics Show

From April 9 to 11, 2025, the 13th China Electronic Information Expo (CITE 2025), in conjunction with the 105th China Electronics Show and the 2025 Spring National Special Electronic Components Exhibition, was successfully held at the Shenzhen Convention & Exhibition Center (Futian). This year’s event was themed “Technology Leads ‘Shenzhen’ to Converge on Innovation,” co-hosted by the Ministry of Industry and Information Technology and the Shenzhen Municipal People’s Government, and organized by China National Electronics Import & Export Corporation. It stands as a premier annual gathering for the electronic information industry.

In terms of scale, the exhibition spanned 80,000 square meters, bringing together over 1,000 exhibitors from around the globe, attracting 63,485 professional visitors, hosting more than 100 visiting delegations, and facilitating 145 business-matching sessions. Exhibits covered the entire industrial value chain, including smart terminals, intelligent robots, the low‑altitude economy, data infrastructure, optoelectronic displays, basic electronic components, and specialized electronics, comprehensively showcasing the complete industrial ecosystem—from foundational components to cutting-edge smart applications.

This edition of the expo featured numerous highlights, with cutting-edge technologies and innovative breakthroughs serving as the central attractions. Ten groundbreaking achievements—including Shenzhen University’s “Variable-Threshold Single-Bit ADC Chip,” Zhonghao Xinying’s “Chasha® High-Performance TPU AI Chip,” and MediaTek’s “Dimensity 9400 Chip”—were awarded the Innovation Gold Award at the 13th China Electronic Information Expo. The intelligent robotics zone drew significant attention, with Unitree Robotics engaging directly with attendees, demonstrating the human touch of technology. Meanwhile, Elephant Robotics’ MercuryX1 integrates advanced large language models, SLAM navigation, ROS systems, and machine vision technologies, supporting diverse applications in education, research, and service sectors. In the low‑altitude economy segment, Gaoju Innovation’s EMO intelligent drone swarm propelled low‑altitude cultural‑tourism drone performances into the 2.0 era, while Luhai Technology unveiled an internationally leading drone inspection system, applicable to hazardous building assessments and photovoltaic panel fault detection. In the realm of basic electronic components, Guangdong Huilun Crystal’s “Quartz Crystal Resonator with Built-in Thermistor” received Qualcomm certification, becoming a core component for 5G smartphones; Keda Jia’s “CSUC Chip-Scale Common-Mode Inductor,” featuring a flat-wire winding design, improved efficiency by 30%; and Chaozhou Sanhuan Technology’s “High-Performance MLCC,” which achieved mass production of green tape with a thickness of just 1 micron, helping to break foreign monopolies.

A rich array of concurrent events created a high‑end platform for industry dialogue. Over 50 high‑level forums were held during the exhibition, focusing deeply on key topics such as AI computing power, semiconductor manufacturing, and the low‑altitude economy. The opening summit, themed “Building a Global New Ecosystem for AI Storage and Computing,” brought together heavyweight figures from academia and industry, including Jiang Guofei, Chief Scientist of China Electronics; Pan Yi, Dean of the School of Computer Science at Shenzhen Polytechnic; Cheng Jinhuai, Senior Architect at Seagate; and Meng Shengfan, Director of Ecosystem Partnerships at Tencent Cloud. The 2025 Spring National Special Electronic Components Exhibition made its debut in Hall 8, spanning 5,500 square meters, where suppliers such as CETC, CASIC, and AVIC engaged in on‑site negotiations with over 5,000 procurement representatives from aerospace, aviation, shipbuilding, weaponry, and electronics sectors.

The professional visitor base was robust, underscoring the high quality of buyer resources. The event attracted professional buyers and technical experts from across the globe, with overseas attendance reaching 2,145. The Taiwan delegation continued to grow in size, with companies like AIAVIO, Omjia, Chenxiang Intelligence, and Yashi Innovative Technology presenting their latest offerings in AI‑assisted driving, innovative semiconductor testing, and AI‑based medical systems. The Shenzhen Innovation Zone gathered 20 local enterprises, showcasing innovations in smart wearables, intelligent robots, drones, and other fields. Exhibitors generally reported that the quality of professional visitors was high, with clear purchasing objectives, resulting in highly effective on‑site business matchmaking—over 95% of exhibitors expressed satisfaction with the event’s outcomes.

The expo yielded substantial results and received enthusiastic industry acclaim. Guo Zhaoping, Deputy Director of the China Electronics Science and Technology Commission and Chairman of China National Electronics International Information Service Co., Ltd., noted in his opening address that in 2024, China’s electronic information industry maintained a trajectory of high‑quality growth, with annual digital industry revenue reaching RMB 35 trillion, up 5.5% year over year. Attendees agreed that the China Electronics Show is not only an excellent platform for brand exposure and business matching but also a critical hub for gaining insights into global electronic information trends and exploring pathways for technological innovation and industrial collaboration.

The 107th China Electronics Show (Shenzhen) will be held from April 9 to 11, 2026, at the Shenzhen Convention & Exhibition Center (Futian). The event is expected to cover 60,000 square meters, feature 1,200 exhibitors, attract 55,891 professional visitors, and host the 14th China Electronic Information Expo alongside the 2026 Spring National Special Electronic Components Exhibition, continuing to provide an efficient platform for global exchange and cooperation within the electronic information sector.