China Shenzhen International Electronic Information Expo

From April 9 to 11, 2025, the 13th China Electronic Information Expo (CITE 2025), in conjunction with the 105th China Electronics Show and the 2025 Spring National Specialized Electronic Components Exhibition, was successfully held at the Shenzhen Convention & Exhibition Center (Futian). This year’s event, themed “Technology Leads, ‘Shenzhen’ Brings Together Innovation,” was co-hosted by the Ministry of Industry and Information Technology and the Shenzhen Municipal People’s Government, marking a major annual milestone for the electronic information industry.

In terms of scale, the expo covered nearly 60,000 square meters, bringing together 1,200 high-quality exhibitors from around the world and attracting 55,891 professional visitors, including 28% international attendees—totaling 2,145 overseas visitors—from countries and regions such as the United States, South Korea, Japan, Russia, and Southeast Asia. The exhibition organized more than 135 visiting delegations and hosted over 150 procurement matchmaking sessions, with on-site group visits exceeding 5,000 participants—a new record.

This edition featured a wealth of highlights, with eight thematic pavilions serving as the centerpiece of the show. The expo showcased multiple specialized zones, including Smart Terminals, Optoelectronic Displays, Intelligent Robotics, Low-Altitude Economy, Big Data Storage, Basic Components, Integrated Circuits, and Specialized Electronic Components. The Intelligent Robotics zone drew exceptional attention, with Elephant Robotics presenting its MercuryX1 wheeled humanoid robot, integrating advanced large language models, SLAM navigation, and machine vision technologies; companies such as LeSen Robotics, Wandechang, and Langyu Xin Technology also competed on the same stage. The Low-Altitude Economy zone captured significant interest, featuring innovative products like EHang’s EH216-S autonomous flying vehicle, Gaoju Innovation’s EMO intelligent swarm drones, and LuHai Technology’s drone-based inspection systems. Meanwhile, the Specialized Electronic Components exhibit reached a record-breaking size of 5,500 square meters, with over 200 suppliers—including CETC, CASIC, and AVIC—participating and attracting more than 5,000 procurement representatives from aerospace, aviation, shipbuilding, and defense sectors for business discussions.

The Taiwan Pavilion made its debut, becoming one of the exhibition’s key highlights. For the first time, the expo established a “Taiwan Technology Pavilion,” themed “Promoting Cross-Strait High-Tech Integration and Co‑Building an Innovative Industrial Ecosystem.” Thirteen Taiwanese enterprises—including AIAOYI, Omjia, Chenxiang Intelligence, Yashi Innovation Technology, Dahui International, Xinhe, Xin’anxin, e+ Traditional Chinese Medicine Robot, Energy Dragon, Zhengda Huixian, Qianhong Electronics, and Yishu Electronics—exhibited, covering areas such as AI‑assisted driving, cutting-edge semiconductor testing, AI‑based medical systems, electronic components, and AU‑innovative display technologies and applications.

A rich array of concurrent events created a premier platform for industry dialogue. The opening summit, themed “Building a New Global AI Computing and Storage Ecosystem,” brought together over 500 distinguished guests, including academicians, experts, and industry leaders. Prominent speakers such as Jiang Guofei, Chief Scientist of China Electronics Information Industry Group Co., Ltd.; Pan Yi, Dean of the School of Computer Science at Shenzhen Polytechnic; and Cheng Jinhui, Senior Architect at Seagate Technology, engaged in insightful discussions. More than 50 high‑level forums were held concurrently, focusing deeply on core areas like AI computing power, semiconductor manufacturing, and the low‑altitude economy, while addressing cutting-edge topics such as humanoid robotics, smart manufacturing, next‑generation components, consumer electronics, and the Internet of Things.

Innovative awards were announced, recognizing numerous groundbreaking achievements. During the opening ceremony, the 13th China Electronic Information Expo Innovation Gold Awards were unveiled, honoring ten pioneering innovations, including Shenzhen University’s “Variable‑Threshold Single‑Bit ADC Chip,” Zhonghaoxinying’s “Chasha® High‑Performance TPU AI Chip,” and MediaTek’s “Dimensity 9400 Chip.” These accolades underscore China’s remarkable leap from technological “catch‑up” to global “leadership.”

The professional audience was exceptionally strong, with international participation reaching a record high. The expo attracted professional buyers and technical experts from across the globe, with international visitors accounting for 28%—a 7‑percentage-point increase over the previous edition. The specially established “International Trade Expressway” proved highly effective, facilitating over a hundred preliminary cooperation agreements on the very first day of the overseas procurement matchmaking sessions. Delegations from Thailand’s Digital Economy Commission, Malaysia’s Science Park, Russian smart hardware importers, Vietnamese electronic component distributors, and other nations formed multi‑national procurement teams for intensive matchmaking. The procurement matchmaking sessions brought together more than 50 purchasing companies and over 80 supplier firms, conducting more than 150 one‑on‑one, precision‑targeted meetings on site.

The expo’s outcomes and industry response were overwhelmingly positive. Guo Zhaoping, Deputy Director of the China Electronics Technology Commission, noted in his opening address that in 2024, China’s electronic information industry maintained a trajectory of high‑quality growth, with annual digital industry revenue reaching RMB 35 trillion—an increase of 5.5% year over year—and integrated circuit output surpassing 450 billion units. Furthermore, new energy vehicle production and sales remained No. 1 globally for the tenth consecutive year. Attendees agreed that CITE is not only an excellent platform for brand exposure and commercial matchmaking but also a critical hub for understanding global trends in electronic information and exploring pathways for AI‑industry integration.

The 14th China Electronic Information Expo (CITE 2026) was successfully held from April 9 to 11, 2026, at the Shenzhen Convention & Exhibition Center (Futian). This year’s exhibition is themed “New Technologies, New Products, New Scenarios,” featuring eight core sectors: Consumer Electronics, Embodied Intelligence, Large AI Models/Intelligent Computing Centers, AI-Driven Application Scenarios, Integrated Circuits, Low-Altitude Economy, Electronic Components, and Specialized & Dual-Use Electronics. Concurrently, a series of high-end events under the “2+8+N” framework will be held, further establishing an efficient platform for global exchange and collaboration within the electronic information industry.