• Design, EDA, and IPZiguang Group, Huada Jiutian, VeriSilicon, Gailun Electronics, Guowei Group, Datang Telecom, Synopsys
• Wafer Foundry and ManufacturingSMIC, HuaHong Group (including HuaHong Macro and Huali Microelectronics), Jita Semiconductor, Yangtze Memory Technologies, ChangXin Memory, Jinghe Integrated Circuit, YueXin Semiconductor
• Semiconductor EquipmentNorthern Huacheng, AMEC, Shengmei Shanghai, Shanghai Microelectronics, HuaHai Qingke, Tuojing Technology, Xinyuan Micro, Zhongke Feice, Tokyo Precision, Disco, SiDian Semiconductor, Kaishitong, Bokang Information
• Semiconductor MaterialsShanghai Silicon Industry, Liangong Micro, Youyan New Materials, Jiangfeng Electronics, Anji Technology, Huat Gas, JinHong Gas, Nanjing University Optoelectronics, Yak Technology, Zhonghuan Leading, XinHua Semiconductor, Guiyan Platinum, Dijing Semiconductor
• Packaging and TestingJCET, Tongfu Microelectronics, Huatian Technology, Jingfang Technology, Qizhong Technology, Yongxi Electronic, CR Microelectronics
• Power and Compound SemiconductorsCR Microelectronics, Silan Micro, BYD Semiconductor, San’an Optoelectronics, Tianyue Advanced, Zhongjia Semiconductor, HanTianTiancheng
• Artificial Intelligence and Chip DesignHuawei Hisilicon, Horizon Robotics, Black Sesame Intelligence, Cambrian, Suiyuan Technology, Moore Threads, Tienshi Zhixin, Kunlun Chip Technology, Yisiwei Computing
• Testing and Measurement InstrumentsHuafeng Test Control, Changchuan Technology, LianDong Technology, Jingce Electronics, Huaxing Yuanchuang
• Research and Industrial InstitutionsChinese Academy of Sciences’ Shenyang Institute of Automation, China Electronics Technology Group, HuaJin Semiconductor, XinXin Leasing
• International EnterprisesInfineon, STMicroelectronics, NXP, TDK, Carl Zeiss, Integ

Semiconductor design, packaging, testing, and manufacturing companies（All content herein is copyrighted by Juzhan; unauthorized reproduction prohibited）

Semiconductor raw materials:silicon wafers, silicon chips, photoresist, photomasks, electronic gases and specialty chemical gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging and testing materials

Semiconductor manufacturing equipment:single-crystal furnaces, oxidation furnaces, diffusion equipment, ion implantation systems, PVD, CVD, lithography machines, etching machines, polishing machines, chamfering machines, coating/developing machines, front-end test equipment, wet-process equipment, thermal processing units, coating devices, single-crystal wafer deposition systems, cleaning equipment

Semiconductor packaging processes and equipment:thinning machines, dicing machines, pick-and-place machines, wire bonding machines, molding machines, bending equipment, sorting machines, testing machines, robotic automation systems, machine vision tools, and other specialized materials and electronic devices

Semiconductor testing and packaging support products:probe cards, wire bonding, burn-in testing, automated testing, laser cutting and related processes, grinding fluids, dicing fluids, sealing films (adhesives), high-temperature tapes, laminated substrates, mounting adhesives, loading plates, wire bonding materials, flow control devices, quartz, graphite, silicon carbide, and more