Beijing International Semiconductor Exhibition
CIOE EXPOVenueChina International Exhibition Center Jingan
- 1/1
- Annual
- 30000㎡
- Exhibition area
- 360
- Exhibitors
- 80000
- Visitors
Beijing International Semiconductor ExhibitionSame period exhibition
Beijing CitySemiconductors expo Fair Details
- Organizer:
- China Equipment Management Association, China Association of Circulation of Electromechanical Products
- City:
- Beijing
- Venue:
- China International Exhibition Center Jingan
- Address:
- No.6, East Section of North Third Ring Road, Chaoyang District, Beijing
Beijing International Semiconductor ExhibitionProfile
Established in 2005, the Beijing International Semiconductor Exhibition (CIOE EXPO) is jointly organized by the China Equipment Management Association, the China Association of Circulation of Electromechanical Products, and Zhonggongzhi Technology Co., Ltd. It has witnessed the advancement of China's semiconductor industry, facilitated technical exchange and integrated development between domestic and international sectors, and boosted the prosperity of the global semiconductor technology and equipment market.
The Beijing International Semiconductor Exhibition (CIOE EXPO) is an international exhibition dedicated to the semiconductor industry. It gathers renowned enterprises and professionals worldwide, showcasing cutting-edge semiconductor manufacturing technologies and equipment, and providing a platform for communication and cooperation among exhibitors and visitors.
With the rise of China's intelligent manufacturing sector and the global semiconductor electronics industry's shift from vertical to horizontal structures, alongside increasingly refined value chain divisions, China is emerging as a major global semiconductor manufacturing base, driving the rapid growth of its domestic semiconductor industry. To further advance the sector, fully showcase cutting-edge equipment technologies, actively promote industry interaction, and strengthen awareness of communication and cooperation for mutual promotion and common development.
We are committed to advancing semiconductor manufacturing equipment, promoting industrial upgrading and innovative development. As a national-level, international, and professional industry event, the Beijing International Semiconductor Exhibition (CIOE EXPO) provides a platform for Chinese semiconductor equipment enterprises to expand globally.
Beijing International Semiconductor Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Partial exhibitor directory and exhibitor list for Beijing International Semiconductor Exhibition: 广州市斯巴拓电子科技有限公司, 深圳市微纳运控技术有限公司, 纽泰克斯电线(潍坊)有限公司, 上海临滴科技有限公司, 深圳市亚中咨询有限公司, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
Beijing International Semiconductor Exhibition Photos
CIOE EXPO Exhibitor Directory / E-Magazine
Beijing International Semiconductor ExhibitionRange
Semiconductor design, packaging & testing, and manufacturing companies (Copyright belongs to Juzhan. Reproduction without permission is prohibited.)
Semiconductor Raw Materials: Silicon wafers, silicon chips, photoresist, photomasks, electronic & specialty gases, CMP polishing materials, photoresist materials, wet electronic chemicals, sputtering targets, packaging & testing materials
Semiconductor Production Equipment: Single crystal furnaces, oxidation furnaces, diffusion equipment, ion implanters, PVD, CVD, lithography machines, etching machines, polishing machines, edge grinders, coater/developers, front-end metrology & inspection equipment, wet processing equipment, thermal processing equipment, coating equipment, single wafer deposition systems, cleaning equipment
Semiconductor Packaging Processes & Equipment: Wafer thinning machines, dicing saws, die bonders, wire bonders, molding machines, lead forming equipment, handlers, testers, robotic automation, machine vision, other materials and specialized electronic equipment, etc.
Semiconductor Testing & Packaging Supporting Products: Probe cards, wire bonding, burn-in testing, automated testing, laser cutting & others, grinding slurry, dicing liquid, dicing tape/high-temperature tape, laminated substrates, die attach adhesive, loading boards, bonding wires, flow control, quartz & graphite, silicon carbide, etc.
Booth inquiry for this edition
2026 Beijing CitySemiconductors Ticket inquiry
Beijing CitySemiconductors Venue
Beijing CitySemiconductors Booth Application
Standard booth Configuration
Blank booth Configuration
Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
