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Beijing City Semiconductorslogo

21th

Beijing International Semiconductor Exhibition

CIOE EXPO

Dates
Show Hours:
Venue
Highlights
An international industry trade show focused on semiconductor manufacturing technologies and equipment.
Standard booth
Standard booth|9 m² incl. basic setup
16800 元/9㎡
Blank booth
Blank booth|From 18 m², construction not included
1700 元/㎡
View Floor PriceBooth Consultation

Beijing International Semiconductor Exhibition Same Period Exhibition

Exhibition Data

1/1
Edition
30000㎡
Exhibition area
360
Exhibitors
80000
Visitors

Beijing City Semiconductors Expo Details

The Beijing International Optoelectronics Expo (CIOE EXPO), a national-level, internationally oriented professional trade show, focuses on semiconductor manufacturing equipment and technologies, bringing together leading global companies to showcase cutting-edge products. Its core scope encompasses wafer processing, packaging and testing, as well as related equipment and materials, highlighting the rise of China’s intelligent manufacturing and the value of global supply-chain collaboration.
Industry:
Semiconductors fairBeijing CitySemiconductors Expo
Organizer:
China Equipment Management Association, China National Machinery & Electrical Products Circulation Association
City:
Beijing
Venue:
Address:
No. 55 Yuxiang Road, Shunyi District, Beijing

Profile

The Beijing International Semiconductor Exhibition (CIOE EXPO)was founded in 2005.It is co-organized by the China Equipment Management Association, the China National Machinery & Electrical Products Circulation Association, and Zhonggong Zhi Technology Co., Ltd. Over the years, it has witnessed the continuous advancement of China’s semiconductor industry, facilitated technological exchanges and integrated development between domestic and international players, and contributed to the robust growth of both domestic and global semiconductor equipment markets.

The Beijing International Semiconductor Exhibition (CIOE EXPO)is an international trade show dedicated exclusively to semiconductors. It brings together renowned companies and industry professionals from around the world, showcasing cutting-edge semiconductor manufacturing technologies and equipment, and providing a platform for exhibitors and visitors to network and collaborate.

With the rise of China’s intelligent manufacturing sector and the global semiconductor electronics industry’s shift from a vertical to a horizontal structure—accompanied by increasingly refined value-chain specialization—China has emerged as one of the world’s major semiconductor manufacturing hubs, driving rapid growth across the domestic semiconductor ecosystem. To further elevate the semiconductor industry, fully showcase state-of-the-art equipment and technologies, actively promote cross-industry dialogue and cooperation, and strengthen awareness of collaboration within the sector, thereby achieving mutual advancement and shared development,

we are committed to advancing semiconductor manufacturing equipment, fostering industrial upgrading, and spurring innovative development.The Beijing International Semiconductor Exhibition (CIOE EXPO)is a national, international, and specialized industry event that serves as a gateway for Chinese semiconductor equipment manufacturers seeking to expand globally.

Beijing International Semiconductor Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

Partial exhibitor directory and exhibitor list for Beijing International Semiconductor Exhibition: 纽泰克斯电线(潍坊)有限公司, 上海临滴科技有限公司, 广州金升阳科技有限公司, 歌尔微电子股份有限公司, 芜湖泰和管业股份有限公司, 宁波地博电气有限公司, and others. The 2027 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.

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Highlights of the Beijing International Semiconductor Exhibition:

  • A Nationally Recognized Authority in the Semiconductor IndustryEstablished in 2005 and now in its 19th edition, this annual flagship event for China’s semiconductor industry is widely regarded by domestic and international manufacturers of semiconductor equipment and related service providers as an “international showcase.” Co-hosted by authoritative organizations such as the China Equipment Management Association and the China National Machinery & Electrical Products Circulation Association, it has witnessed the remarkable growth and technological progress of China’s semiconductor sector.
  • Million-Scale Data Resources Empowering Precision MarketingDrawing on the organizer’s extensive database of one million professional buyers across 23 industry segments, meticulous outreach strategies—including personalized phone calls, courier-delivered visitor passes, and targeted field promotions in key industrial clusters—ensure high-quality attendance and precise procurement matching.
  • Comprehensive Coverage of the Entire Semiconductor Value ChainExhibits span the full spectrum of semiconductor design, packaging, testing, and manufacturing, encompassing critical areas such as raw materials (silicon wafers, photoresists, electronic gases), production equipment (lithography tools, etchers, CVD systems), packaging machinery, and ancillary test-and-measurement products.
  • An International Hub for Resource ConnectivityEach year, the event attracts influential buyers from 17 countries and regions, including the United States, South Korea, Japan, Germany, and France. Renowned global corporations such as Bosch, ZF, BYD, Huawei, Samsung, Foxconn, Siemens, and Honeywell regularly send purchasing delegations. Concurrent international technical exchange sessions provide an effective platform for cross-border collaboration.
  • High-Value Buyer Clusters Ensuring Tangible OutcomesProfessional buyers represent dozens of application sectors, including automotive electronics, new-energy vehicles, 3C electronics, home appliances, medical devices, aerospace, and rail transportation. For 2026, the exhibition anticipates welcoming 360 exhibitors and over 80,000 professional visitors, with buyer demand driving multiple technical forums and precision matchmaking efforts to maximize conversion rates.
  • Multi-Dimensional Brand Exposure and PromotionWith nearly 300 media outlets providing continuous coverage and a multi-channel marketing strategy that integrates traditional, online, and social media platforms, including WeChat and Weibo, the event ensures sustained brand visibility and enhanced industry influence for exhibiting companies.
  • Strategic Location Advantages in the Capital RegionBenefiting from Beijing’s status as a national center for scientific and technological innovation, the exhibition serves as a pivotal hub for the semiconductor industry cluster spanning Beijing, Tianjin, and Hebei. The organizing committee offers shuttle bus services to nearby purchasing groups, ensuring timely arrival of key decision-makers and facilitating seamless access to the event.
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Range

  • Design, EDA, and IPZiguang Group, Huada Jiutian, VeriSilicon, Gailun Electronics, Guowei Group, Datang Telecom, Synopsys
  • Wafer Foundry and ManufacturingSMIC, HuaHong Group (including HuaHong Macro and Huali Microelectronics), Jita Semiconductor, Yangtze Memory Technologies, ChangXin Memory, Jinghe Integrated Circuit, YueXin Semiconductor
  • Semiconductor EquipmentNorthern Huacheng, AMEC, Shengmei Shanghai, Shanghai Microelectronics, HuaHai Qingke, Tuojing Technology, Xinyuan Micro, Zhongke Feice, Tokyo Precision, Disco, SiDian Semiconductor, Kaishitong, Bokang Information
  • Semiconductor MaterialsShanghai Silicon Industry, Liangong Micro, Youyan New Materials, Jiangfeng Electronics, Anji Technology, Huat Gas, JinHong Gas, Nanjing University Optoelectronics, Yak Technology, Zhonghuan Leading, XinHua Semiconductor, Guiyan Platinum, Dijing Semiconductor
  • Packaging and TestingJCET, Tongfu Microelectronics, Huatian Technology, Jingfang Technology, Qizhong Technology, Yongxi Electronic, CR Microelectronics
  • Power and Compound SemiconductorsCR Microelectronics, Silan Micro, BYD Semiconductor, San’an Optoelectronics, Tianyue Advanced, Zhongjia Semiconductor, HanTianTiancheng
  • Artificial Intelligence and Chip DesignHuawei Hisilicon, Horizon Robotics, Black Sesame Intelligence, Cambrian, Suiyuan Technology, Moore Threads, Tienshi Zhixin, Kunlun Chip Technology, Yisiwei Computing
  • Testing and Measurement InstrumentsHuafeng Test Control, Changchuan Technology, LianDong Technology, Jingce Electronics, Huaxing Yuanchuang
  • Research and Industrial InstitutionsChinese Academy of Sciences’ Shenyang Institute of Automation, China Electronics Technology Group, HuaJin Semiconductor, XinXin Leasing
  • International EnterprisesInfineon, STMicroelectronics, NXP, TDK, Carl Zeiss, Integ

 

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Review

The 2025 Beijing International Semiconductor Exhibition (CIOE EXPO) was successfully held from June 17 to 19 at the China International Exhibition Center in Beijing. With the theme “Semiconductor Era, Semiconductor Manufacturing,” the event spanned an exhibition area of 25,000 square meters, bringing together 360 exhibitors from around the globe and attracting over 40,000 professional visitors.

At the show, leading domestic equipment manufacturers such as Northern Huacheng, AMEC, Shengmei Shanghai, and HuaHai Qingke showcased their latest products for core processes including etching, thin-film deposition, and CMP. In the materials sector, companies like Shanghai Silicon Industry, Youyan New Materials, and Jiangfeng Electronics highlighted groundbreaking advancements, such as 12-inch silicon wafers and ultra-high-purity metal targets. Chengdu Fangzhou Microelectronics presented its series of depletion-mode MOSFETs and other power devices, which have garnered significant attention from major IC manufacturers thanks to their pin-to-pin replacement capabilities for products from international brands like Infineon and Toshiba. Meanwhile, EDA leaders such as Huada Jiutian and Gailun Electronics unveiled the latest upgraded versions of their end-to-end design toolchains.

During the exhibition, 15 specialized conferences were held, including the “China Semiconductor Equipment Self-Reliance Development Forum” and the “Compound Semiconductor Technology Summit,” offering in-depth discussions on key topics such as domestic substitution pathways, advanced packaging technologies, and third-generation semiconductor materials. Leveraging a buyer database of one million contacts, the organizing committee provided tailored, one-on-one matchmaking services to more than 90 VIP purchasing delegations, including representatives from BYD, Huawei, Bosch, and Samsung. Real-time engagement via the official WeChat platform, coupled with comprehensive coverage by nearly 300 media outlets, ensured robust brand exposure for participating companies.

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CIOE EXPO Exhibitior List

Beijing International Semiconductor Exhibition Range

Semiconductor raw materials:
  • Silicon wafers ,
  • Silicon wafers ,
  • Photoresist ,
  • Photomasks ,
  • Electronic gases ,
  • Specialty chemical gases ,
  • CMP polishing materials ,
  • Photoresist materials ,
  • Wet electronic chemicals ,
  • Sputtering targets ,
  • Packaging and testing materials
Semiconductor manufacturing equipment:
  • Single-crystal furnaces ,
  • Oxidation furnaces ,
  • Diffusion equipment ,
  • Ion implantation equipment ,
  • PVD ,
  • CVD ,
  • Lithography machines ,
  • Etching machines ,
  • Polishing machines ,
  • Chamfering machines ,
  • Coating and developing machines ,
  • Front-end test equipment ,
  • Wet-process equipment ,
  • Thermal processing ,
  • Coating equipment ,
  • Single-crystal deposition systems ,
  • Cleaning equipment
Semiconductor packaging processes and equipment:
  • Thinning machines ,
  • Dicing machines ,
  • Die attach machines ,
  • Wire bonding machines ,
  • Molding machines ,
  • Bending equipment ,
  • Sorting machines ,
  • Test machines ,
  • Robotic automation ,
  • Machine vision
Supporting products for semiconductor testing and packaging:
  • Probe cards ,
  • Wire bonding ,
  • Burn-in testing ,
  • Automated testing ,
  • Laser cutting ,
  • Grinding fluids ,
  • Dicing fluids ,
  • Encapsulation films ,
  • High-temperature tapes ,
  • Laminated substrates ,
  • Die attach adhesives ,
  • Loading plates ,
  • Flow control ,
  • Quartz and graphite ,
  • Silicon carbide

Booth Sales

吴经理

Mr. WuGold-Medal PM

3 Years Booth Sales

2027 Beijing City Semiconductors Ticket Sales

Beijing City Semiconductors Venue

Address: No. 55 Yuxiang Road, Shunyi District, Beijing
Beijing Capital International Convention Center实景
Beijing Capital International Convention Center展馆图
Beijing Capital International Convention Center实景图
Beijing Capital International Convention Center实景
Beijing Capital International Convention Center实景
Beijing Capital International Convention Center实拍图
Beijing Capital International Convention Center实景
Beijing Capital International Convention Center实拍
Beijing Capital International Convention Center实景图
Beijing Capital International Convention Center实拍图
Beijing Capital International Convention Center实拍

Beijing City Semiconductors Booth Price

Standard booth
Standard booth|9 m² incl. basic setup
16800 元/9㎡
Blank booth
Blank booth|From 18 m², construction not included
1700 元/㎡
View Floor PriceBooth Consultation

Process

  1. 1.Submit the business license of the company
  2. 2.Submit product picture and name
  3. 3.Receive exhibition presentation documents and booth drawings
  4. 4.Submit booth application form/Sign booth contract
  5. 5.Pay the contract booth deposit
  6. 6.Prepare for exhibition