
OCP APAC Summit
OCP APAC Summit- 1/1
- Annual
- 8000㎡
- Exhibition area
- 145
- Exhibitors
- 9500
- Visitors
TaipeiData expo Fair Details
- Industry:
- Data fairTaipeiData expo
- Organizer:
- OCP Foundation
- Venue:
- Taipei Nangang Exhibition center
- Address:
- No. 1 Jingmai 2nd Road, Nangang District
OCP APAC SummitProfile
The OCP APAC Summit, organized by the Open Compute Project (OCP), brings together the Asia-Pacific community for a dedicated face-to-face summit to explore the numerous challenges and opportunities facing data center infrastructure today and tomorrow.
The OCP APAC Summit will showcase the latest innovations and technological advancements from around the world, featuring keynote speeches from experts who are researching, designing, building, and operating next-generation hyperscale data center facilities and infrastructure. The exhibition hall will gather buyers and sellers from across the entire ecosystem and supply chain.
Juzhan has successfully organized numerous high-quality enterprises to participate! The OCP APAC Summit primarily targets professionals and companies in data center infrastructure, AI computing hardware, and high-performance computing. The OCP Summit is not only a platform for economic cooperation and exchange but also a vital opportunity for the development of the Asia-Pacific region.
OCP APAC Summit tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Partial exhibitor directory and exhibitor list for OCP APAC Summit: Trade Link Media Pte Ltd, ZHEJIANG YIZHOU MACHINERY TECHNOLOGY CO., LTD., ProEn Scaffold Pte Ltd, HUZHOU SFR CHAIN TRANSMISSION CO.,LTD, Shandong Fast Smart Equipment Co., Ltd., and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
OCP APAC Summit Photos
OCP APAC Summit Exhibitor Directory / E-Magazine
OCP APAC SummitRange
Discrete Semiconductors / Power Devices: Discrete semiconductor devices, semiconductor ICs, IGBTs, MOSFETs, diodes, rectifiers, thyristors, SCRs, power modules, integrated circuits, optoelectronic components, etc.
Passive Components: Capacitors, resistors, filters, busbars, circuit protection components, magnetic components, connectors, sensors, relays, etc.
Power Systems: AC-DC and DC-DC converters, power modules, UPS (Uninterruptible Power Supply), linear power supplies, three-phase/single-phase power filters, EMC and interference suppression technologies, etc.
Thermal Management Solutions: Heat sinks, radiators, heat pipes, thermal conductive materials, liquid cooling systems, water cooling systems, etc.
Other Supporting Technologies: Test and measurement equipment, servo technology, software tools, test management systems, etc.
Booth inquiry for this edition









2026 TaipeiData Ticket inquiry






TaipeiData Venue
TaipeiData Booth Application

Standard booth Configuration

Blank booth Configuration
Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition




















