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China Wuxi Semiconductor Equipment, Materials & Core Components ExhibitionCatalog consultation
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Fair basics
China Wuxi Semiconductor Equipment, Materials & Core Components ExhibitionPast exhibitors
- Domestic Equipment and Materials Companies: NAURA, AMEC, Shengmei Shanghai, Tuojing Technology, Huahai Qingke, Shanghai Micro Electronics Equipment, Zhongke Feice, Kaisitong, Jingsheng Mechanical & Electrical, Shenyang Fuchuang, CETC Institute 48, Sanhuan Group, XinKailai, Tongfei Co., Ltd., Xinyuan Micro, Zhi Chun Technology, Jingce Electronics, Changchuan Technology, Huafeng Measurement & Control
- Internationally Renowned Enterprises: BOSCH, SIEMENS, ZEISS, KEYENCE, Leica Microsystems, RORZE, MARPOSS, Azbil, Glint Materials, SUSS, Coherent, ACS Motion Control, alimex ACP Asia, US CONEC, SilcoTek, German Nomon Group, Daikin Qingyan Advanced Technology
- Core Components and Materials Brands: Beijing Scientific Instrument, Beijing Huazhuo Precision, Beijing Hualin Jiaye, Beijing Tongjia Hongrui, Beijing Yisheng Precision, Beijing Zhongke Scientific Instrument, Changchun Guanghua Microelectronics, Changzhou Mingsai Robotics, Changzhou Rongdao Precision, Dalian Jiafeng Automation, Shanghai Bitong, Shenyang Scientific Instrument, Toto Technology, Wuxi Yiwen, CETC Institute 45
- Universities and Research Institutions: Tsinghua University, Fudan University, Zhejiang University, Jiangnan University, Southeast University, China Electronics Technology Group
Industry scope
Wafer Fabrication Side:Processing and inspection equipment, including single-crystal furnaces, lithography machines, etching tools, and thin-film deposition systems, covering the full spectrum of technologies from wafer processing and lithography through thermal treatment to precision metrology.
Core Components and Consumables:Key supporting components such as EFEMs, vacuum products, precision motion systems, optical lenses, and critical lithography machine assemblies.
Packaging and Testing Stage:Includes packaging and testing equipment for processes such as wafer thinning, dicing, wire bonding, and electrical testing.
Material Systems:Encompasses front-end materials like silicon wafers, photoresists, and electronic-grade gases, as well as back-end materials such as packaging substrates, bonding wires, and encapsulating resins.
Supporting Infrastructure:Includes photomask-making equipment, cleanroom engineering, automation systems, and other industry-supporting hardware and software solutions.
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