Choose a catalog
(Click to select)
China Semiconductor Equipment, Materials & Core Components ExpoCatalog consultation
Before you buy:
1. The exhibitor directory / e-catalog will be delivered within 1–2 business days by email to the applicant's inbox . Please check your mail (including spam). If you still do not receive it, contact +86 13732395222.
2. Online directories are for viewing only — no email delivery , and text cannot be copied .
3. Items marked “includes phone / email” include contact details; unmarked items do not.
Fair basics
China Semiconductor Equipment, Materials & Core Components ExpoPast exhibitors
- Domestic Equipment and Materials Companies: NAURA, AMEC, Shengmei Shanghai, Top-Joy Technology, Huahai Qingke, Shanghai Microelectronics Equipment, Zhongke Feice, Kaisitong, Jingsheng Electromechanical, Shenyang Fuchuang, CETC No. 48, Sanhuan Group, XinKailai, Tongfei Shares, Xinyuan Micro, Zhi Chun Technology, Jingce Electronics, Changchuan Technology, Huafeng Measurement & Control
- Renowned International Brands: BOSCH, SIEMENS, ZEISS, KEYENCE, Leica Microsystems, RORZE, MARPOSS, Azbil, Glint Materials, SUSS, Coherent High意, ACS Motion Control, alimex ACP Asia, US CONEC, SilcoTek, German Nomann Group, Daikin Qingyan Advanced Technology
- Core Components and Material Brands: Beijing KeYi, Beijing HuaZhuo Precision, Beijing HuaLin Jiaye, Beijing TongJia HongRui, Beijing YiSheng Precision, Beijing ZhongKe KeYi, Changchun GuangHua Microelectronics, Changzhou Mingsai Robotics, Changzhou RongDao Precision, Dalian JiaFeng Automation, Shanghai BiTong, Shenyang KeYi, Toto Technology, Wuxi YiWen, CETC No. 45
- Universities and Research Institutions: Tsinghua University, Fudan University, Zhejiang University, Jiangnan University, Southeast University, China Electronics Technology Group
Industry scope
Wafer Fabrication Side:Single-crystal furnaces, lithography machines, etching equipment, thin-film deposition systems, and other processing and inspection tools cover the full spectrum of wafer fabrication—from machining and photolithography to thermal treatment and precision testing.
Core Components and Consumables:EFEM units, vacuum products, precision transmission components, optical lenses, and core lithography machine assemblies serve as essential supporting elements.
Packaging and Testing Stage:Equipment for thinning, dicing, bonding, and testing forms the backbone of this stage.
Material Systems:From front-end wafers, photoresists, and electronic gases to back-end packaging substrates, bonding wires, and encapsulating resins.
Supporting Infrastructure:Photolithography equipment, cleanroom engineering, automation systems, and other industry-supporting hardware and software.
Photos
More fair catalogs