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China Semiconductor Equipment, Materials & Core Components ExpoCatalog consultation
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Fair basics
China Semiconductor Equipment, Materials & Core Components ExpoPast exhibitors
- Domestic Equipment and Materials Companies: NAURA, AMEC, Shengmei Shanghai, Top-Joy Technology, Huahai Qingke, Shanghai Microelectronics Equipment, Zhongke Feice, Kaisitong, Jingsheng Electromechanical, Shenyang Fuchuang, CETC No. 48, Sanhuan Group, New Kaile, Tongfei Shares, Xinyuan Micro, Zhi Chun Technology, Jingce Electronics, Changchuan Technology, Huafeng Measurement & Control
- Renowned International Brands: BOSCH, SIEMENS, ZEISS, KEYENCE, Leica Microsystems, RORZE, MARPOSS, Azbil, Glint Materials, SUSS, Coherent High意, ACS Motion Control, alimex ACP Asia, US CONEC, SilcoTek, Germany’s Nomon Group, Daikin Qingyan Advanced Technology
- Key Component and Material Brands: Beijing KeYi, Beijing Hua Zhuo Jingke, Beijing Hua Lin Jiaye, Beijing Tong Jia Hongrui, Beijing Yi Sheng Precision, Beijing Zhongke KeYi, Changchun Guanghua Microelectronics, Changzhou Mingsai Robotics, Changzhou Rongdao Precision, Dalian Jiafeng Automation, Shanghai Bitong, Shenyang KeYi, Toto Technology, Wuxi Yiwen, CETC No. 45
- Universities and Research Institutions: Tsinghua University, Fudan University, Zhejiang University, Jiangnan University, Southeast University, China Electronics Technology Group
Industry scope
Wafer Fabrication Stage:Single-crystal furnaces, lithography machines, etching systems, thin-film deposition equipment, and other processing and inspection tools cover the full spectrum of wafer fabrication—from machining and photolithography through thermal treatment to precision metrology.
Core Components and Consumables:EFEMs, vacuum products, precision transmission components, optical lenses, and core lithography machine assemblies are among the critical supporting elements.
Packaging and Testing Stage:Equipment covering thinning, dicing, wire bonding, and testing processes is included.
Material Systems:From front-end wafers, photoresists, and electronic gases to back-end packaging substrates, bonding wires, and encapsulating resins.
Supporting Infrastructure:Photolithography equipment, cleanroom engineering, automation systems, and other industry-supporting hardware and software.
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