
China Wuxi Semiconductor Equipment, Materials & Core Components ExhibitionCSEAC
China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition Profile
The China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition (CSEAC) has added a new exhibition hall, setting a new record for exhibition space—spanning eight halls with a total area of 70,000 square meters and expected to host over 1,300 exhibitors.
At present, the global semiconductor industry is at a critical juncture marked by technological iteration and reshaped supply‑demand dynamics. The explosive growth in AI computing power has created supply‑demand gaps, compounded by technological barriers and supply chain volatility. As the world’s largest semiconductor consumer market, China is shifting from mere capacity expansion toward deep industrial‑chain collaboration and greater self‑reliance and controllability. The 15th Five-Year Plan underscores the importance of seizing the historic opportunities presented by the new round of scientific and technological revolution and industrial transformation, accelerating high‑level scientific and technological self‑sufficiency, and fostering new‑type productive forces. It also calls for achieving decisive breakthroughs across the entire value chain in key core technologies, particularly in integrated circuits.
This year’s concurrent forums are strategically focused on cutting‑edge areas such as equipment integration, silicon‑photonics co‑packaging, green facility operations, and human‑like robot perception. These initiatives represent an immediate response to the evolving global semiconductor landscape and a proactive implementation of national strategic priorities.
The flagship forum of the China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition (CSEAC)—the Annual Conference of the China Electronics Specialized Equipment Industry Association—will bring together representatives from industry regulatory authorities, global industry leaders, and prestigious institutions. Discussions will center on critical issues such as the current state and strategic positioning of the semiconductor industry, international cooperation trends, and frontier technologies. The event will also unveil major industry announcements, provide insights into supportive policies, and highlight emerging industry trends.
Once again, the China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition (CSEAC) will serve as a global focal point for the semiconductor equipment, materials, and core components sectors. For every industry professional, CSEAC is more than just a venue for networking—it is an industrial hub for assessing technology roadmaps, aligning R&D directions, and identifying strategic partners.
CSEAC is the premier “barometer” event for the semiconductor equipment, materials, and core components industries. Each year, the exhibition gathers domestic and international companies, experts, and industry organizations along the semiconductor value chain. Through exhibitions, specialized forums, technology launches, and industry matchmaking sessions, it explores new pathways for high‑quality industrial development across such themes as semiconductor equipment, core components, critical materials, advanced processes, advanced packaging, smart manufacturing, and talent cultivation in both academia and industry.
Exhibitor List
China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition Product Range
Wafer Fabrication Side:Processing and inspection equipment, including single-crystal furnaces, lithography machines, etching tools, and thin-film deposition systems, covering the full spectrum of technologies from wafer processing and lithography through thermal treatment to precision metrology.
Core Components and Consumables:Key supporting components such as EFEMs, vacuum products, precision motion systems, optical lenses, and critical lithography machine assemblies.
Packaging and Testing Stage:Includes packaging and testing equipment for processes such as wafer thinning, dicing, wire bonding, and electrical testing.
Material Systems:Encompasses front-end materials like silicon wafers, photoresists, and electronic-grade gases, as well as back-end materials such as packaging substrates, bonding wires, and encapsulating resins.
Supporting Infrastructure:Includes photomask-making equipment, cleanroom engineering, automation systems, and other industry-supporting hardware and software solutions.
China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition Booth Sales

China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition Ticket Sales


China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition Venue
China Wuxi Semiconductor Equipment, Materials & Core Components ExhibitionCommunity
China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition Booth price

Standard booth Configuration

Blank booth Configuration
China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition


















