
China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition
CSEACVenueWuxi Taihu International Expo Centre
- 1/1
- Annual
- 70000㎡
- Exhibition area
- 1300
- Exhibitors
- 80000
- Visitors
WuxiSemiconductors expo Fair Details
- Organizer:
- China Electronics Special Equipment Industry Association
- Venue:
- Wuxi Taihu International Expo Centre
- Address:
- No. 88, Qingshu Road, Taihu New City, Wuxi
China Wuxi Semiconductor Equipment, Materials & Core Components ExhibitionProfile
The China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition (CSEAC) has added a new exhibition hall, setting a new record for exhibition space—spanning eight halls with a total area of 70,000 square meters and expected to host over 1,300 exhibitors.
At present, the global semiconductor industry is at a critical juncture marked by technological iteration and reshaped supply‑demand dynamics. The explosive growth in AI computing power has created supply‑demand gaps, compounded by technological barriers and supply chain volatility. As the world’s largest semiconductor consumer market, China is shifting from mere capacity expansion toward deep industrial‑chain collaboration and greater self‑reliance and controllability. The 15th Five-Year Plan underscores the importance of seizing the historic opportunities presented by the new round of scientific and technological revolution and industrial transformation, accelerating high‑level scientific and technological self‑sufficiency, and fostering new‑type productive forces. It also calls for achieving decisive breakthroughs across the entire value chain in key core technologies, particularly in integrated circuits.
This year’s concurrent forums are strategically focused on cutting‑edge areas such as equipment integration, silicon‑photonics co‑packaging, green facility operations, and human‑like robot perception. These initiatives represent an immediate response to the evolving global semiconductor landscape and a proactive implementation of national strategic priorities.
The flagship forum of the China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition (CSEAC)—the Annual Conference of the China Electronics Specialized Equipment Industry Association—will bring together representatives from industry regulatory authorities, global industry leaders, and prestigious institutions. Discussions will center on critical issues such as the current state and strategic positioning of the semiconductor industry, international cooperation trends, and frontier technologies. The event will also unveil major industry announcements, provide insights into supportive policies, and highlight emerging industry trends.
Once again, the China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition (CSEAC) will serve as a global focal point for the semiconductor equipment, materials, and core components sectors. For every industry professional, CSEAC is more than just a venue for networking—it is an industrial hub for assessing technology roadmaps, aligning R&D directions, and identifying strategic partners.
CSEAC is the premier “barometer” event for the semiconductor equipment, materials, and core components industries. Each year, the exhibition gathers domestic and international companies, experts, and industry organizations along the semiconductor value chain. Through exhibitions, specialized forums, technology launches, and industry matchmaking sessions, it explores new pathways for high‑quality industrial development across such themes as semiconductor equipment, core components, critical materials, advanced processes, advanced packaging, smart manufacturing, and talent cultivation in both academia and industry.
China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Partial exhibitor directory and exhibitor list for China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition: 基恩士(中国)有限公司, 格兰富水泵(上海)有限公司, 欧士机(上海)精密工具有限公司, 威乐(中国)水泵系统有限公司, 无锡雨露精工有限公司, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
Highlights of the Wuxi Semiconductor Equipment Annual Conference
- A Nationally Recognized Authority in the Semiconductor Equipment Industry: Hosted by the China Electronics Special Equipment Industry Association, this event is one of the most prestigious and influential annual gatherings in the semiconductor equipment sector. Over thirteen editions, it has evolved into a vital platform for collaboration and promotion between domestic semiconductor equipment and component manufacturers and end‑user companies, creating tangible and comprehensive business opportunities for Chinese-made products to integrate into both domestic and international supply chains.
- Precise Coverage Across the Entire Industry Chain: The exhibition area focuses on core segments including semiconductor equipment, critical components, key materials, testing technologies, and supporting services—spanning from wafer fabrication tools and packaging & testing equipment to high-purity photoresists and specialty gases. This seamless integration across upstream and downstream sectors effectively breaks down information barriers within the industry.
- A Global Hub for Resource Networking: The event attracts more than 1,000 exhibitors from 23 countries and regions, with over 200 international participants. Leading domestic listed companies such as Northern Huacheng, AMEC, Shengmei Shanghai, and Tuojing Technology compete alongside renowned global enterprises including New Kaile, BOSCH, SIEMENS, and ZEISS.
- In‑Depth Empowerment Through High‑Level Forums: Concurrently held are one plenary summit and seventeen specialized forums, bringing together over one hundred industry authorities. The Chairpersons’ Forum convenes dozens of semiconductor industry leaders to discuss pressing issues, while the thematic forums delve into hot topics such as post‑Moore’s Law innovation, AI‑driven advancements, localization of mature process technologies, multi‑dimensional integration, and semiconductor equipment financing and investment.
- A Platform for Precise Supply‑Demand Matching: The “Upstream–Downstream Supply‑Demand Matchmaking Session” gathers leading firms from wafer fabrication, packaging & testing, and equipment supply, enabling face‑to‑face exchanges between equipment, material, and component suppliers. This “one‑on‑one, point‑to‑point” approach facilitates highly efficient connections, delivering concrete orders and collaborative opportunities for participating enterprises.
- Talent Development through Industry‑Academia Collaboration: The event draws nearly 30 prestigious universities—including Tsinghua, Fudan, and Zhejiang University—and over 100 corporate exhibitors, who engage in on‑site university‑enterprise matchmaking initiatives. On‑site recruitment events,成果 exhibitions, and talent‑matching sessions further support these efforts, with listed companies like Northern Huacheng, AMEC, and Tongfei Shares conducting live hiring activities, providing an effective platform for connecting businesses with skilled professionals.
- The Advantages of Wuxi’s Industrial Cluster: As a major birthplace of China’s integrated circuit industry, Wuxi maintains the second-largest industrial scale nationwide and has established a complete value chain encompassing design, manufacturing, packaging & testing, equipment, materials, and ancillary support services. This robust industrial foundation provides strong backing for exhibitors seeking precise customer engagement and regional market expansion.
Notable exhibitors
- Domestic Equipment and Materials Companies: NAURA, AMEC, Shengmei Shanghai, Tuojing Technology, Huahai Qingke, Shanghai Micro Electronics Equipment, Zhongke Feice, Kaisitong, Jingsheng Mechanical & Electrical, Shenyang Fuchuang, CETC Institute 48, Sanhuan Group, XinKailai, Tongfei Co., Ltd., Xinyuan Micro, Zhi Chun Technology, Jingce Electronics, Changchuan Technology, Huafeng Measurement & Control
- Internationally Renowned Enterprises: BOSCH, SIEMENS, ZEISS, KEYENCE, Leica Microsystems, RORZE, MARPOSS, Azbil, Glint Materials, SUSS, Coherent, ACS Motion Control, alimex ACP Asia, US CONEC, SilcoTek, German Nomon Group, Daikin Qingyan Advanced Technology
- Core Components and Materials Brands: Beijing Scientific Instrument, Beijing Huazhuo Precision, Beijing Hualin Jiaye, Beijing Tongjia Hongrui, Beijing Yisheng Precision, Beijing Zhongke Scientific Instrument, Changchun Guanghua Microelectronics, Changzhou Mingsai Robotics, Changzhou Rongdao Precision, Dalian Jiafeng Automation, Shanghai Bitong, Shenyang Scientific Instrument, Toto Technology, Wuxi Yiwen, CETC Institute 45
- Universities and Research Institutions: Tsinghua University, Fudan University, Zhejiang University, Jiangnan University, Southeast University, China Electronics Technology Group
China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition Photos
CSEAC Exhibitor Directory / E-Magazine
2025 China Wuxi Semiconductor Equipment, Materials & Core Components Exhibition Online Exhibitor Directory
Exhibitor number: 1009
¥70
Buy nowChina Wuxi Semiconductor Equipment, Materials & Core Components ExhibitionRange
Wafer Fabrication Side:Processing and inspection equipment, including single-crystal furnaces, lithography machines, etching tools, and thin-film deposition systems, covering the full spectrum of technologies from wafer processing and lithography through thermal treatment to precision metrology.
Core Components and Consumables:Key supporting components such as EFEMs, vacuum products, precision motion systems, optical lenses, and critical lithography machine assemblies.
Packaging and Testing Stage:Includes packaging and testing equipment for processes such as wafer thinning, dicing, wire bonding, and electrical testing.
Material Systems:Encompasses front-end materials like silicon wafers, photoresists, and electronic-grade gases, as well as back-end materials such as packaging substrates, bonding wires, and encapsulating resins.
Supporting Infrastructure:Includes photomask-making equipment, cleanroom engineering, automation systems, and other industry-supporting hardware and software solutions.
Exhibition Review
In September 2025, the 13th China Semiconductor Equipment Annual Conference was successfully held in Wuxi, marking a milestone achievement.
This year’s event reached an unprecedented scale, with the exhibition area surpassing 60,000 square meters for the first time—more than a 40% increase over the previous edition. The show brought together over 1,130 exhibiting companies from 23 countries and regions worldwide, spanning the entire semiconductor manufacturing value chain. Over the three-day duration, it attracted 117,000 professional visitors from across the globe, who engaged in on-site discussions and business exchanges. Total purchase commitments reached RMB 2.65 billion, underscoring the immense commercial appeal of the Wuxi Semiconductor Exhibition as one of the premier industry events in the Asia-Pacific region.
Leading domestic equipment manufacturers took center stage, drawing widespread attention. AMEC unveiled six groundbreaking new products covering etching and atomic layer deposition, highlighting its comprehensive advancements in advanced process technologies. Meanwhile, industry leaders such as North Huachuang, Top-Joy Technology, Shengmei Semiconductor, and HuaHai Qingke showcased their latest solutions for critical processes including thin-film deposition, cleaning, and polishing. The exhibitor roster provided end-to-end coverage—from core manufacturing equipment and packaging & testing to essential materials and components, as well as facility support services—vividly illustrating the breadth and depth of China’s semiconductor industry ecosystem.
This year’s conference clearly highlighted two key trends shaping the industry: the transition of domestic substitution from “isolated breakthroughs” to “ecosystem-wide collaboration.” The exhibition served not only as a platform for showcasing cutting-edge equipment but also as a comprehensive review of domestically produced core components and materials, with pronounced synergies across the upstream and downstream segments of the supply chain. At the same time, the event focused on the future directions of “digital intelligence and advanced packaging,” with related technologies and solutions garnering significant attention, signaling that the focus of industry competition is shifting toward higher-value-added segments.
CSEAC 2025 was more than just a successful industry gathering—it sent a clear signal: China’s semiconductor equipment sector has established a robust industrial cluster and, with unprecedented collaborative innovation capabilities, is actively participating in the transformation and reshaping of the global supply chain.
Booth inquiry for this edition



2026 WuxiSemiconductors Ticket inquiry






WuxiSemiconductors Venue
Venue transport
- Air
From Sunan Shuofang International Airport: Taxis or ride-hailing services are the most direct option, with a travel time of approximately 30–45 minutes.
- Train
From Wuxi Railway Station: Take bus route K5 from the north square of the station for direct service; the journey takes approximately 50–60 minutes. Alternatively, a taxi or ride-hailing vehicle can be taken, with a travel time of about 25–40 minutes.
From Wuxi East Railway Station: A taxi or ride-hailing vehicle will take approximately 35–50 minutes.
- Drive
By car, you can simply navigate to the “Wuxi Taihu International Expo Center.” It is located adjacent to Jinshi Road and Qingshu Road and is easily accessible via major urban thoroughfares such as Nanhu Avenue and Gonghu Avenue.
WuxiSemiconductors Booth Application

Standard booth Configuration

Blank booth Configuration
Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition






















