Semicon Taiwan – Taiwan International Semiconductor Exhibition

The 30th Taiwan International Semiconductor Exhibition (SEMICON Taiwan 2025) was successfully held from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center. In preparation for the event, a series of high-level forums kicked off on September 8, marking the comprehensive upgrade to “International Semiconductor Week.” Hosted by SEMI, the International Semiconductor Industry Association, this year’s exhibition was themed “Leading with Collaboration. Innovating with the World. Working Together Globally, Pioneering Innovation,” coinciding with the milestone of its 30th anniversary and establishing itself as an annual highlight of the global semiconductor industry.

In terms of scale, the event brought together over 1,200 exhibiting companies from 56 countries and regions, occupying more than 4,100 booths and setting a new record for exhibition space, while attracting over 100,000 professional visitors. A record-breaking 17 national pavilions participated, with Canada, Costa Rica, Lithuania, Sweden, Vietnam, and five other countries making their debut appearances. High-ranking officials from the Czech Republic, the United Kingdom, France, India, the Netherlands, and many other nations attended in official delegations.

This edition featured numerous highlights, with three major alliances launching and cutting-edge technologies unveiled for the first time, becoming central attractions of the show. SEMI’s 3DIC Advanced Packaging Manufacturing Alliance (3DICAMA) was officially launched, co-led by Dr. He Jun, Vice General Manager of TSMC’s Advanced Packaging Technology and Services, and Dr. Hong Songjing, Senior Vice General Manager of ASE. The G2C+ Alliance (comprising Zhi Sheng, Jun Hao, Jun Hua, and Dong Jie) debuted its advanced CoPoS packaging technology—an enhanced version of CoWoS—capable of increasing chip utilization to over 90% and projected to boost profitability by approximately 30%. Dexin Holdings made its first appearance under the “Alliance Pavilion” format, bringing together 18 TSMC suppliers, including Jiadeng and Yideshi, to showcase its full vertical integration capabilities. Tianhong Technology exhibited panel-level packaging equipment, achieving a 90% localization rate and supporting TSMC’s latest packaging dimension specifications.

Complementary events were equally vibrant, creating a premier platform for industry dialogue. During the exhibition, more than 25 international forums were held, covering diverse topics such as technological trends, industrial strategies, and sustainable development. The closing “fireside chat” was moderated by Mr. Wu Tianyu, CEO of ASE, and Mr. Hou Yongqing, Chairman of the Taiwan Semiconductor Industry Association, featuring an in-depth conversation between Mr. Jochen Hanebeck, CEO of Infineon, and Jim Keller, a renowned “chip guru” from Silicon Valley. The Memory Forum gathered senior executives from SK Hynix, Samsung Electronics, and other leading manufacturers to discuss the pivotal role of HBM and DDR5 technologies in the AI era. The International Forum on Heterogeneous Integration convened technical experts from TSMC, ASE, AMD, Broadcom, NVIDIA, Sony, and others to explore advanced packaging, silicon photonics, and AI applications. Additionally, the inaugural “Semiconductor Sustainability International Forum” focused on key issues such as net-zero roadmaps, AI-driven carbon reduction, and circular economy initiatives.

Significant progress was achieved in technical standards and industrial collaboration. SEMI officially launched the E187 semiconductor equipment cybersecurity certification system, with participation from representatives of the American Institute in Taiwan, the British Office in Taiwan, the Dutch Office in Taiwan, as well as TSMC, ASE, Delta Group, and CoreTech R&D. Throughout the exhibition, multiple international exchange events were organized, including the Taiwan–Poland Business Forum, the Korea–Taiwan Semiconductor Supply Chain Economic Cooperation Forum, the Taiwan–Japan Technology Summit, and the Taiwan–India Semiconductor Forum. The British Office in Taiwan and the Taipei Representative Office in the UK also signed a memorandum of understanding on joint semiconductor talent development programs.

Talent cultivation and succession planning emerged as key highlights of the event. For the first time, SEMI presented the “SEMI 20 Under 40” award, recognizing 24 outstanding young professionals under the age of 40 across four categories: innovation, leadership, technology, and industry contribution, thereby affirming the strength of the next generation. A special talent-development exhibit explored themes such as women in tech and global expansion, featuring digital guided tours, interactive science education zones, and STEM workshops that attracted over a hundred high school students.

The professional visitor base was exceptionally strong, with an unprecedented level of international representation. The exhibition drew professional buyers and technical experts from 56 countries and regions, with delegates from the United States, Chile, Africa, Spain, Italy, and other locales arriving independently. Exhibiting companies widely reported the high quality of professional attendees, clear purchasing intentions, and significant results from on-site business matchmaking. Cao Shilun, SEMI’s Global Marketing Director and President of the Taiwan Region, stated that SEMICON Taiwan has risen to become one of the world’s most influential specialized semiconductor exhibitions, serving as a critical platform for technology implementation and industrial collaboration.

Attendees agreed that SEMICON Taiwan is not only an excellent venue for brand exposure and business networking but also a vital hub for gaining insights into global semiconductor trends and exploring pathways toward AI-driven transformation and advanced packaging innovations. The exhibition witnessed Taiwan’s semiconductor industry transition from follower to leader, underscoring its pivotal shift from a manufacturing powerhouse to an innovation-driven center.

The 31st Taiwan International Semiconductor Exhibition (SEMICON Taiwan 2026) will be held from September 2 to 4, 2026, at the Taipei Nangang Exhibition Center, continuing to serve as a global benchmark and innovation platform for the semiconductor industry.