Taiwan International Semiconductor Exhibition Semicon
Semicon TaiwanVenueTaipei Nangang Exhibition center
- 1/1
- Annual
- 40000㎡
- Exhibition area
- 1000
- Exhibitors
- 60000
- Visitors
TaipeiSemiconductors expo Fair Details
- Organizer:
- SEMICON
- Venue:
- Taipei Nangang Exhibition center
- Address:
- No. 1 Jingmai 2nd Road, Nangang District
Taiwan International Semiconductor Exhibition SemiconProfile
Semicon Taiwan is one of Asia’s largest exhibitions for semiconductor equipment and materials. The event draws manufacturers, designers, distributors, and buyers from across the globe, showcasing cutting-edge technologies and fostering industry collaboration. SEMI believes that this platform will help Taiwan’s semiconductor sector align with international trends, leveraging its robust technological capabilities and extensive industry expertise to make an even greater contribution to global technological advancement.
The year 2026 marks a pivotal moment as AI computing demand surges and semiconductor technology competition shifts from process scaling to system integration. As a global hub for advanced semiconductor manufacturing, Taiwan will highlight the industry’s strategic transformation—from focusing on “process innovation” to embracing “ecosystem-wide integration.”
Each year, national pavilions from leading semiconductor nations—including Japan, South Korea, the United States, Germany, and the Netherlands—participate in the exhibition. Notably, Silicon Saxony has organized a German Pavilion for many consecutive years, underscoring Europe’s semiconductor industry’s strong commitment to the Asian market.
Exhibitors and buyers at Semicon Taiwan gain insights into the latest design and manufacturing technologies for semiconductor equipment and materials, as well as emerging market demands and development trends. They also have the opportunity to expand their business networks, explore new markets, and forge valuable connections and collaborations with industry peers and professionals.
As the second-largest and Asia’s most influential specialized semiconductor exhibition, Semicon Taiwan, together with SEMICON China and SEMICON Korea, forms SEMI’s flagship exhibition portfolio in the Asia-Pacific region. Serving as a global barometer for the semiconductor industry, the event is not only a platform for technological showcase but also an annual gathering that brings together the entire semiconductor value chain—from equipment and materials to wafer fabrication, IC design, and system applications—covering the full breadth of the semiconductor ecosystem.
Taiwan International Semiconductor Exhibition Semicon tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Partial exhibitor directory and exhibitor list for Taiwan International Semiconductor Exhibition Semicon: 无锡邑文微电子科技股份有限公司, 云南鑫耀半导体材料有限公司, 槃实科技（深圳）有限公司, 上海微电子装备(集团)股份有限公司, 盟佳科技股份有限公司, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
The Exhibition Value of SEMICON Taiwan
- SEMICON Taiwan is one of the largest and most influential specialized events in the global semiconductor industry. Since its inception in 1996, it has been successfully held for thirty editions and is widely acclaimed in the industry as the “Olympics of Semiconductors” and the “World Exposition of Technology.” It serves as a core platform for connecting global semiconductor supply-chain resources, showcasing cutting-edge technological achievements, and shaping industry development trends. Hosted by SEMI, the International Semiconductor Industry Association, the 2025 edition marks the event’s 30th anniversary, with an unprecedented scale that underscores its unique status as a global benchmark for the semiconductor industry.
- The core value of participation lies in the exhibition’s role as a premier platform that brings together world-class industry resources and leading figures. In 2025, the event will attract more than 1,200 exhibiting companies from 56 countries and regions, occupying over 4,100 booths, with attendance exceeding 100,000 visitors. A record-breaking 17 national pavilions will be featured, including first-time participants from Canada, Costa Rica, Lithuania, Sweden, Vietnam, and other nations. During the show, more than 200 industry leaders from around the globe—including Infineon CEO Jochen Hanebeck, Silicon Valley “chip guru” Jim Keller, ASE Group CEO Wu Tian-yu, and TSMC Senior Vice President of Advanced Packaging He Jun—will engage in high-level dialogues, providing enterprises with a strategic gateway to directly connect with key global decision-makers.
- The exhibition establishes a one-stop commercial platform covering the entire semiconductor value chain. Exhibits span advanced process technologies, advanced packaging, AI and HBM, automotive electronics, intelligent robotics, green manufacturing, semiconductor materials, precision machinery, and semiconductor cybersecurity—covering all segments of the industry. In 2025, dedicated zones such as the AI Semiconductor Technology Pavilion, the Materials Zone, the Precision Machinery Area, the Wide Bandgap Power Semiconductor Section, and the Semiconductor Packaging Hall will showcase end-to-end solutions, creating a comprehensive ecosystem for technology demonstration and business matchmaking—from chip fabrication to IC design, and from specialized hardware to packaging and testing.
- The event aligns with three major industry trends—AI-driven innovation, heterogeneous integration, and sustainable development—establishing a hub for deep collaboration among academia, industry, research institutions, and end-users. During the 2025 edition, the SEMI 3DIC Advanced Packaging Alliance was officially launched, co-led by TSMC and ASE, focusing on industrial cooperation and supply-chain resilience. The G2C+ Alliance unveiled its next-generation CoWoS‑based CoPoS advanced packaging technology, which can increase chip utilization rates to over 90%. Dexin Holdings participated through a “Alliance Pavilion,” highlighting the vertical integration capabilities of 18 TSMC suppliers. Concurrently, more than 25 international forums were held, addressing technological trends, industry strategies, and sustainability, while the SEMI E187 semiconductor equipment cybersecurity certification program was introduced for the first time.
- For Chinese enterprises, this exhibition represents a strategic gateway for expanding into global markets, connecting with international resources, and showcasing innovative strengths. In 2025, exhibitors include Shenzhen Hanchi Technology, Suzhou Sumag Intelligent Technology, Shenzhen Meirui Precision Electronics, Hangzhou Woken New Materials, Suzhou Huaxing Yuanchuang, and numerous other mainland Chinese companies. Through the “International Semiconductor Week” format, the event fosters in-depth dialogues between Taiwan and Poland, South Korea, Japan, India, and other countries, providing enterprises with an efficient platform to access global supply-chain resources. Participating companies can leverage this platform to secure global procurement channels and seize early opportunities in the AI‑driven evolution of the semiconductor industry.
Notable exhibitors
- International Chip and Equipment Giants: ASML, Applied Materials, Lam Research, Tokyo Electron, KLA, Infineon, NXP, Texas Instruments, Intel, AMD, Qualcomm, Arm, NVIDIA, SK Hynix, Samsung Electronics, ASE
- Advanced Packaging and Manufacturing Alliance: TSMC, ASE, Lite-On, Siliconware, King Yuan Electronics, ChipMOS
- Leading Taiwanese Enterprises: Foxconn, MediaTek, ASUS, Quanta, Wistron, Pegatron, Advantech, Zhen Ding Technology, Unimicron Technology, Shing Hung Group
- DeXin Holdings Alliance Companies: Jiadeng, Yideshi, Songsheng, Shenghuang, Naiter, Yuanda, Kangchun, Jingcheng, Weicheng, Yongjie, Fuhong, Taitaifa, Xin Yingcai, Yineng, Yuzhan, Lianying, Jingcheng, Changda
- G2C+ Alliance Companies: Zhisheng, Junhao, Junhua, Dongjie
- Semiconductor Equipment Companies: Tianhong Technology, TitanSheng Technology, Qunyi Industrial, Yijie Systems, YouTian New Technology, Youwei Technology, Jigao Industrial
- Materials Companies: Taiwan Fuji Electronic Materials, Daxing Materials, Corning, Mitsubishi Chemical, Kao, Taiwan Lisen Noco, Hualii, Taiwan Nagase, Shengmao Technology
- Precision Machinery and Machine Tool Companies: Yawei, Bade, Chengtai, Fuyu, Pushen, Weston, Jianhe, Pufa, Tengbo, Dayongcheng, Yuewei Technology, Jian Chun Industrial, Jiangze Precision, Taiwan Huailin
- Wide Bandgap Semiconductor Companies: Geqi Compound Semiconductors, Baida Advanced Materials, Hongjin Precision, Delu Technology, Xudong Machinery
- Mainland Chinese Exhibitors: Shenzhen Hanchi Technology, Suzhou Sumagnetic Intelligent Technology, Shenzhen Meirui Precision Electronics, Hangzhou Wakeen New Materials, Suzhou Huaxingyuanchuang, Shenzhen Zhuoxing Semiconductor, Dalian Huabang Chemical, Zhejiang Aobo Quartz
Taiwan International Semiconductor Exhibition Semicon Photos
Semicon Taiwan Exhibitor Directory / E-Magazine
2024 Taiwan International Semiconductor Exhibition Semicon Online Exhibitor Directory
Exhibitor number: 1119
￥180
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Semiconductor Technology: Advanced semiconductor process technologies, advanced semiconductor packaging and testing technologies, semiconductor process equipment, semiconductor application materials, semiconductor components, and semiconductor module manufacturers (Copyright of this content belongs to Juzhan; redistribution is prohibited without prior consent)
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Exhibition Review
The 30th Taiwan International Semiconductor Exhibition (SEMICON Taiwan 2025) was successfully held from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center. In advance, starting on September 8, a series of high‑level forums kicked off, marking the event’s comprehensive upgrade to “International Semiconductor Week.” Hosted by SEMI, the global semiconductor industry association, this year’s exhibition carried the theme “Leading with Collaboration. Innovating with the World. Collaborating Globally, Pioneering Innovation,” coinciding with the milestone of its 30th anniversary and establishing itself as an annual highlight for the worldwide semiconductor community.
In terms of scale, the event brought together over 1,200 exhibiting companies from 56 countries and regions, occupying more than 4,100 booths and setting a new record for exhibition space, while attracting over 100,000 professional visitors. A record-breaking 17 national pavilions participated, with Canada, Costa Rica, Lithuania, Sweden, Vietnam, and five other countries making their debut. High‑level officials from the Czech Republic, the United Kingdom, France, India, the Netherlands, and several other nations attended in official delegations.
This edition featured numerous highlights, with three major alliances launching and cutting‑edge technologies unveiled for the first time—key attractions drawing widespread attention. SEMI’s 3DIC Advanced Packaging Alliance (3DICAMA) was officially launched, co‑led by Dr. He Jun, Vice General Manager of TSMC’s Advanced Packaging Technology and Services, and Dr. Hong Songjing, Senior Vice General Manager of ASE. The G2C+ Alliance (comprising Zhisheng, Junhao, Junhua, and Dongjie) debuted its advanced CoPoS packaging technology—an enhanced version of CoWoS—that can increase chip utilization to over 90%, with projected profit gains of up to 30%. Dexin Holdings made its first appearance under a “Alliance Pavilion” format, bringing together 18 TSMC suppliers, including Jiadeng and Yideshi, to showcase its full vertical integration capabilities. Tianhong Technology exhibited panel‑level packaging equipment, achieving a 90% domestic content rate and supporting TSMC’s latest packaging specifications.
Complementary events added richness to the program, creating a premier platform for industry dialogue. During the exhibition, more than 25 international forums were held, addressing diverse topics such as technological trends, industry strategies, and sustainable development. The closing “fireside chat” was moderated by Mr. Wu Tianyu, CEO of ASE, and Mr. Hou Yongqing, Chairman of the Taiwan Semiconductor Industry Association, featuring an in‑depth conversation between Mr. Jochen Hanebeck, CEO of Infineon, and Jim Keller, a renowned “chip guru” from Silicon Valley. The Memory Forum gathered senior executives from SK Hynix, Samsung Electronics, and other leading manufacturers to discuss the pivotal role of HBM and DDR5 technologies in the AI era. The International Forum on Heterogeneous Integration convened experts from TSMC, ASE, AMD, Broadcom, NVIDIA, Sony, and other firms to explore advanced packaging, silicon photonics, and AI applications. Meanwhile, the inaugural “International Forum on Semiconductor Sustainability” focused on key issues such as net-zero roadmaps, AI‑driven carbon reduction, and circular economy initiatives.
Significant progress was achieved in technical standards and industry collaboration. SEMI’s E187 semiconductor equipment cybersecurity certification scheme was officially launched, with participation from representatives of the American Institute in Taiwan, the British Office in Taiwan, the Dutch Office in Taiwan, as well as TSMC, ASE, Delta Group, and Corel Research. Throughout the event, additional international exchange activities took place, including the Taiwan–Poland Business Forum, the Korea–Taiwan Semiconductor Supply Chain Economic Cooperation Forum, the Taiwan–Japan Technology Summit, and the Taiwan–India Semiconductor Forum. Furthermore, the British Office in Taiwan and the Taipei Representative Office in the UK signed a memorandum of understanding on joint semiconductor talent‑development initiatives.
Talent cultivation and succession planning emerged as central themes of the exhibition. For the first time, the exhibition presented the “SEMI 20 Under 40 Award,” honoring 24 outstanding young professionals under the age of 40 across four categories: innovation, leadership, technology, and industry contribution. A special talent‑development exhibit explored themes such as women in STEM and global expansion, featuring digital guided tours, interactive science‑education zones, and STEM workshops that attracted over one hundred high school students.
The professional audience was exceptionally strong, with an unprecedented level of international representation. The exhibition drew professional buyers and technical experts from 56 countries and regions, with delegates from the United States, Chile, Africa, Spain, Italy, and other locales traveling independently to attend. Exhibiting companies widely reported the high quality of the professional audience and the clarity of purchasing intentions, resulting in highly effective business matchmaking. Cao Shilun, SEMI’s Global Marketing Director and President of the Taiwan Region, stated that SEMICON Taiwan has risen to become one of the world’s most influential specialized semiconductor exhibitions, serving as a critical platform for technology implementation and industry collaboration.
Attendees agreed that SEMICON Taiwan is not only an excellent venue for brand exposure and business networking but also a vital hub for gaining insights into global semiconductor trends and exploring pathways toward AI‑driven transformation and advanced packaging innovations. The exhibition witnessed Taiwan’s semiconductor industry transition from follower to leader, underscoring its pivotal shift from a manufacturing powerhouse to an innovation‑driven center.
The 31st Taiwan International Semiconductor Exhibition (SEMICON Taiwan 2026) will be held from September 2 to 4, 2026, at the Taipei Nangang Exhibition Center, continuing to serve as a global benchmark and innovation platform for the semiconductor industry.
Booth inquiry for this edition
2026 TaipeiSemiconductors Ticket inquiry
TaipeiSemiconductors Venue
TaipeiSemiconductors Booth Application
Standard booth Configuration
Blank booth Configuration
Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
