As one of Asia’s largest semiconductor exhibitions, this year’s Taiwan International Semiconductor Exhibition (Semicon Taiwan), under the theme “Co-Creating the Future,” has reached record-breaking scale, attracting over 1,300 exhibitors and more than 130,000 global professionals. The event highlights cutting-edge fields such as AI, advanced processes and packaging, silicon photonics, and quantum technologies, hosting over 50 forums and 120 product launch sessions, and featuring specialized zone
The Value of Participating in the Taiwan Semiconductor Exhibition
- SEMICON Taiwan ranks among the largest and most influential specialized events in the global semiconductor industry. Since its inception in 1996, it has been successfully held thirty times, earning acclaim as the “Olympics of Semiconductors” and the “World Exposition of Technology.” It serves as a central platform for connecting global semiconductor supply-chain resources, showcasing cutting-edge technological achievements, and guiding industry development trends. Organized by SEMI, the International Semiconductor Industry Association, the 2025 edition marked the 30th anniversary, reaching record-breaking scale and further solidifying its status as a unique global benchmark for the semiconductor industry.
- The core value of participation lies in its ability to bring together top-tier industry resources and leaders from around the world. The 2025 exhibition attracted over 1,200 exhibiting companies from 56 countries and regions, occupying more than 4,100 booths, with attendance exceeding 100,000 visitors. Seventeen national pavilions set new records, including Canada, Costa Rica, Lithuania, Sweden, Vietnam, and five other countries making their debut appearances. During the event, over 200 industry leaders from across the globe gathered, including Infineon CEO Jochen Hanebeck, Silicon Valley “chip guru” Jim Keller, ASE CEO Wu Tianyu, and TSMC’s Deputy General Manager of Advanced Packaging He Jun, providing enterprises with a strategic opportunity to engage directly with key global decision-makers.
- The exhibition offers a one-stop commercial platform spanning the entire semiconductor value chain. Exhibits cover advanced processes, advanced packaging, AI and HBM, automotive electronics, intelligent robotics, green manufacturing, semiconductor materials, precision machinery, and semiconductor cybersecurity—encompassing every segment of the industry. The 2025 exhibition established specialized zones such as the AI Semiconductor Technology Zone, Materials Zone, Precision Machinery Zone, Wide-Bandgap Power Semiconductor Zone, and Semiconductor Packaging Zone, creating a complete ecosystem for technology demonstration and business matchmaking—from chip fabrication to IC design, from dedicated hardware to packaging and testing.
- The exhibition aligns with three major industry trends—AI-driven innovation, heterogeneous integration, and sustainable development—building a robust technological hub through deep collaboration among academia, industry, and end-users. During the 2025 exhibition, SEMI officially launched the 3DIC Advanced Packaging Manufacturing Alliance, co-led by TSMC and ASE, focusing on industrial cooperation and supply-chain resilience. The G2C+ Alliance unveiled its advanced CoPoS packaging technology—an upgraded version of CoWoS—capable of boosting chip utilization to over 90%; Dexin Holdings participated under the “Alliance Pavilion” format, demonstrating the vertical integration capabilities of 18 TSMC suppliers. Over 25 international forums were held concurrently, addressing technological trends, industrial strategies, and sustainability, alongside the inaugural launch of the SEMI E187 semiconductor equipment cybersecurity certification system.
- For Chinese enterprises, this exhibition represents a strategic gateway for expanding into global markets, connecting with international resources, and showcasing innovative strengths. The 2025 exhibition attracted numerous mainland Chinese companies, including Shenzhen Hanchi Technology, Suzhou Sumagnetic Intelligent Technology, Shenzhen Meirui Precision Electronics, Hangzhou Woken New Materials, and Suzhou Huaxing Yuanchuang. Through the “International Semiconductor Week” model, the exhibition facilitated in-depth dialogues between Taiwan and Poland, South Korea, Japan, India, and other nations, providing enterprises with an efficient platform to connect with global supply-chain resources. Exhibiting companies can leverage this platform to access worldwide procurement networks and seize early opportunities in the AI-driven semiconductor industry.