Semiconductor Industry Exhibition of the United States

Semicon West, the U.S. International Semiconductor Exhibition, has now become one of the world’s most influential trade shows for semiconductor manufacturing equipment. At the last edition, leading global manufacturers and industry giants were all present, underscoring the event’s outstanding exhibition performance and high visitor satisfaction, thereby firmly establishing its position as a premier international trade show in the sector. We cordially invite domestic manufacturers, suppliers, distributors, importers and exporters, as well as government agencies and industry associations.

As the annual highlight of North America’s semiconductor industry, Semicon West serves not only as a gateway to Silicon Valley but also as the very heart of global semiconductor design, capital innovation, and cutting-edge R&D. It stands as the highest‑level trade platform connecting the entire microelectronics value chain with the United States’ most advanced technologies.

This year’s Semicon West will focus intensively on “Silicon Valley Collaboration in the AI Era: Closing the Loop from Design to Manufacturing,” with particular emphasis on advancing international trade in high‑performance computing (HPC), advanced process nodes at 2 nm and below, optoelectronic integration, and next‑generation heterogeneous packaging technologies. The exhibition will help Chinese enterprises establish precise connections with the R&D headquarters of Silicon Valley giants such as NVIDIA, Apple, and Intel, enabling deeper participation in the restructuring of semiconductor supply chains across North America and globally.

Semicon West brings together over 670 top-tier companies from more than 50 countries and regions, including the United States, Japan, Germany, China, the Netherlands, and others. The event will feature leading technology players such as the global equipment trifecta—Applied Materials, ASML, and Lam Research—as well as design‑software leaders like Synopsys and Cadence, alongside chip industry heavyweights including NVIDIA, Intel, and AMD, all showcasing their comprehensive technology roadmaps through 2027–2030.

With innovation-driven technology and exceptional service experiences at its core, Juzhan has earned widespread acclaim. For many years, Juzhan has provided efficient, professional exhibition services to Chinese export enterprises. Semicon West will spotlight future trends, technological applications, and innovations shaping the semiconductor industry, serving as an essential platform for technical exchange among global semiconductor companies and a key gateway for entering the Americas market. 

Semiconductor Industry Exhibition of the United States tickets are e-tickets. Domestic and international visitors must complete online pre-registration with real-name passport verification. After purchase, the organizer verifies visitor identity. Visitors who do not meet entry requirements may need to submit additional documents. Once approved, you will receive email confirmation or a QR code. On site, present your original passport and confirmation letter to collect a paper badge, or scan the QR code to enter.

Partial exhibitor directory and exhibitor list for Semiconductor Industry Exhibition of the United States: Agilent Technologies, Daido Steel Co., Ltd., DEDIPROG TECHNOLOGY CO., LTD., DASSAULT SYSTEMES, Forge Nano, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.

The Value of Participating in SEMICON West

• North America’s Largest and Most Influential Semiconductor Industry Event: Hosted by the Semiconductor Equipment and Materials International (SEMI), SEMICON West is the flagship trade show of the global semiconductor industry, widely regarded as an industry “barometer.” The exhibition covers the entire value chain—chip design, manufacturing, packaging and testing, equipment, and materials—drawing top-tier companies, industry leaders, and technical experts from around the world to San Francisco each year.
• A One-Stop Showcase Covering the Entire Semiconductor Value Chain: The event encompasses semiconductor manufacturing equipment—including wafer processing, lithography, etching, thin-film deposition, ion implantation, cleaning, and inspection—as well as semiconductor materials such as silicon wafers, photoresists, specialty gases, target materials, and packaging substrates. It also features IC products and application technologies, test and assembly‑testing equipment, and components and supporting systems, spanning the full spectrum of the industry. From conventional processes to advanced packaging, exhibitors can engage in comprehensive interactions—from technology demonstrations and brand exposure to business negotiations.
• Precise Access to Global Key Buyers and Industry Chain Resources: The last edition attracted 670 exhibiting companies from 35 countries and regions, drawing 29,000 professional visitors from 38 nations. Attendees included chip manufacturers, equipment and material suppliers, R&D institutions, investors, and decision-makers across the supply chain. Exhibitors gained direct access to one of the world’s most influential purchasing audiences, enabling efficient business matchmaking and market expansion.
• Unique Value for Chinese Companies—A Strategic Engine for Expanding into North America and the Global Market: SEMICON West serves as a pivotal platform for Chinese semiconductor firms seeking to enter the North American market, connect with international customers, and showcase their proprietary technologies. During the event, domestic manufacturers have made rapid advances in areas such as etching, thin films, and cleaning, while breakthroughs in metrology, resist coating and development, and ion implantation are imminent. Leading platform-based enterprises continue to refine their strategic positioning, with 2026–2027 poised to mark a critical phase of substantial localization. Chinese companies can leverage this platform to engage with high-end global buyers and seize dual opportunities presented by AI chips and advanced manufacturing.
• A Vanguard for Technological Innovation and Industry Trends: The exhibition sends a clear signal: AI-driven memory capacity expansion, ramp-up of advanced logic processes, and surging demand for advanced packaging are collectively propelling the semiconductor equipment sector into a period of rapid growth. The widespread adoption of advanced packaging technologies such as HBM, CoWoS, and 3D stacking is spurring explosive demand for new process equipment, including hybrid bonding, TCB, laser cutting, and thin-film deposition. Concurrent with the exhibition, a series of meticulously curated conferences and workshops bring together industry leaders from IBM, AMD, Microsoft, Siemens, and other giants to discuss cutting-edge technologies.
• Deep Integration with High-End Forums and Industry Resources: Alongside the main exhibition, high-profile forums such as “Future Computing” explore AI‑driven energy‑efficient computing systems, featuring experts from top institutions including Stanford University, AMD, IBM, Microsoft, and Siemens. Participating companies gain timely access to critical insights on semiconductor industry policies, technical standards, and market trends.

Notable exhibitors

• Internationally renowned companies: onsemi, NXP, Microchip, Intel, TSMC, Amkor, ASM, IBM, AMD, Microsoft, Siemens AG, Merck KGaA, HPE, Ciena, Rigetti
• Leading equipment manufacturers: NAURA (etching, thin films, cleaning, CMP), AMEC (etching, thin films, advanced packaging), Top-Joy Technology (PECVD, ALD, SACVD, hybrid bonding), Micro-Link Nano (ALD), Shengmei Shanghai (cleaning, photoresist coating and development), Xinyuan Micro (photoresist coating and development)
• Metrology and inspection companies: Zhongke Feice (film thickness, OCD, defect inspection), Jingce Electronics (film thickness, OCD, defect inspection, probe cards)
• Packaging and testing firms: Huafeng Test Control (SoC testing), Jinhaitong (sorters), Guangli Technology (dicing saws), Niko Equipment (packaging molding equipment), Delong Laser (laser processing equipment)
• Materials and component suppliers: Anji Technology, Huater Gas, Jingrui Electronic Materials, Nanjing University Optoelectronics, Dinglong Shares, Youyan New Materials, Jiangfeng Electronics
• EDA and design service providers: Huada Jiutian, Gailun Electronics, Guangli Micro, Guoxin Technology, Verisilicon
• Other notable enterprises: Maywa Co., Ltd. (cross-sector semiconductor packaging for photovoltaics), Autowell (cross-sector semiconductor packaging for photovoltaics)