Semiconductor Equipment and Materials International (SEMI) West

The Value of Participating in SEMICON West, the U.S. International Semiconductor Exhibition

• North America’s Largest and Most Influential Semiconductor Industry Event: Organized by the Semiconductor Equipment and Materials International (SEMI), SEMICON West is the flagship exhibition of the global semiconductor industry, widely regarded as an industry “barometer.” Covering the entire value chain—from chip design and manufacturing to packaging, testing, equipment, and materials—the event annually draws top-tier companies, industry leaders, and technical experts to San Francisco.
• A One-Stop Showcase Covering the Entire Semiconductor Value Chain: The exhibition encompasses semiconductor manufacturing equipment (including wafer processing, lithography, etching, thin-film deposition, ion implantation, cleaning, and inspection), semiconductor materials (such as silicon wafers, photoresists, specialty gases, target materials, and packaging substrates), IC products and application technologies, test and packaging equipment, as well as components and supporting services. From traditional processes to advanced packaging, exhibitors can seamlessly integrate technology demonstrations, brand exposure, and commercial negotiations all within a single venue.
• Precise Connection with Global Key Buyers and Industry Resources: Last year’s event brought together 670 exhibiting companies from 35 countries and regions, attracting 29,000 professional visitors from 38 nations. The audience included chip manufacturers, equipment and material suppliers, R&D institutions, investors, and decision-makers throughout the supply chain. Exhibitors had direct access to some of the world’s most powerful purchasing groups, enabling efficient business matchmaking and market expansion.
• Unique Value for Chinese Enterprises—A Strategic Engine for Expanding into North America and Global Markets: SEMICON West serves as a critical platform for Chinese semiconductor companies seeking entry into the North American market, connecting with international clients, and showcasing their proprietary technologies. During the exhibition, domestic manufacturers have made rapid breakthroughs in areas such as etching, thin-film deposition, and cleaning; advancements in metrology, coating, development, and ion implantation are poised to move from zero to one; and leading platform-based enterprises continue refining their strategies. The years 2026–2027 will mark a pivotal phase of substantial growth in domestic production rates. Chinese firms can leverage this platform to engage with high-end global buyers and seize dual opportunities presented by “AI chips and advanced manufacturing.”
• A Vanguard for Technological Innovation and Industry Trends: The exhibition sends a clear signal—expansion of AI-driven storage capacity, ramp-up of advanced logic processes, and surging demand for advanced packaging—all three major trends are jointly propelling the semiconductor equipment sector into a period of rapid growth. Technologies like HBM, CoWoS, and 3D stacking are becoming mainstream, driving explosive demand for new process equipment such as hybrid bonding, TCB, laser cutting, and thin-film deposition. Concurrently, the event hosts a series of meticulously curated conferences and workshops, bringing together industry leaders from IBM, AMD, Microsoft, Siemens, and other prominent organizations to discuss cutting-edge technologies.
• Deep Linkages Between High-End Forums and Industry Resources: Alongside the main exhibition, forums such as “Future Computing” explore AI-driven energy-efficient computing systems, with participation from top experts representing institutions like Stanford University, AMD, IBM, Microsoft, and Siemens. Exhibiting companies gain timely access to critical information regarding semiconductor industry policies, technical standards, and market trends.