
China Western Semiconductor and Integrated Circuit Industry Expo
Xi'an Semiconductor Exhibition- 1/1
- Annual
- 52000㎡
- Exhibition area
- 1500
- Exhibitors
- 65000
- Visitors
China Western Semiconductor and Integrated Circuit Industry ExpoSame period exhibition
Xi'anSemiconductors expo Fair Details
- Organizer:
- China Communications Industry Association
- Venue:
- Address:
- No.1399, Exhibition Road, Badaoqu, Xi'an City, Shaanxi Province, China
China Western Semiconductor and Integrated Circuit Industry ExpoProfile
The China Western Semiconductor and Integrated Circuit Industry Expo (hereinafter referred to as the Xi’an Semiconductor Expo) will leverage the upstream and downstream industrial chains of the electronic information, semiconductor, and integrated circuit sectors to showcase cutting-edge equipment and technologies, while also hosting a series of academic forums. The event aims to attract and bring together leaders from domestic and international government agencies, leading experts and scholars, industry pioneers, technical elites, as well as renowned institutions, organizations, and enterprises from both home and abroad.
This year’s expo has drawn active participation from numerous enterprises and research institutes, including Northern Huacheng, HuaDa JiuTian, UNISOC, Huatian Technology, the Innovation Institute of Aerospace Information of the Chinese Academy of Sciences, Yihai Microelectronics, Kaiyuan Communications, the 513th, 771st, and 772nd Institutes of China Aerospace Science and Technology Corporation, XuanYu Space Technology, the 618th Institute of the Chinese Academy of Aviation, and the 40th, 12th, and 13th Institutes of China Electronics Technology Group Corporation, as well as the 214th Institute of China North Industries Group Corporation—representing a broad spectrum of entities from Beijing, Shanghai, Shenzhen, Suzhou, Xiamen, Chengdu, and other regions across Zhejiang, Shandong, Shanxi, Hebei, and beyond.
The Xi’an Semiconductor Expo will feature a comprehensive program comprising product exhibitions, a plenary forum, technical seminars, and an awards ceremony. The “Two Chains” Integration and Innovative Development Forum, along with enterprise technology project presentations, aligns closely with current industry priorities, addressing key topics such as policy directions, market trends, AI, MCUs, distribution and agency models, end‑user demand, and platform ecosystems. By examining these issues from multiple perspectives—industry dynamics, technological advancements, market opportunities, and talent development—the event seeks to illuminate the present state of the sector and offer insights into future growth trajectories.
Under the overarching theme of “Integration, Win‑Win Cooperation,” the Xi’an Semiconductor Expo serves as a collaborative platform for the semiconductor and integrated circuit industries, helping Shaanxi Province—and the broader western region—forge a new industrial landscape characterized by coordinated development among cities in the central and western regions, thereby driving regional innovation and competitiveness.
China Western Semiconductor and Integrated Circuit Industry Expo tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
China Western Semiconductor and Integrated Circuit Industry Expo Photos
Xi'an Semiconductor Exhibition Exhibitor Directory / E-Magazine
China Western Semiconductor and Integrated Circuit Industry ExpoRange
IC Design Zone: EDA, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, and more
Integrated Circuit Manufacturing Zone: Wafer fabrication facilities, foundries, manufacturing of analog ICs, digital ICs, and mixed-signal ICs, among others
Packaging and Testing Zone: Test probe stations, test equipment, sorters, packaging machinery, packaging substrates, lead frames, bonding wires, and more
Semiconductor Materials Zone: Silicon wafers and silicon-based materials, photomasks, electronic gases, photoresists and associated reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, encapsulating materials, ceramic substrates, die-attach adhesives, and more
Equipment Manufacturing Zone: Thinning machines, single-crystal furnaces, grinding machines, thermal processing equipment, lithography tools, etching systems, ion implantation equipment, CVD/PVD systems, cleaning equipment, dicing saws, wafer probers, bonding machines, test equipment, sorters, probe stations, and more
Third-Generation Semiconductor Special Zone: Featuring gallium nitride (GaN), silicon carbide (SiC), zinc oxide (ZnO), diamond, and related materials and application technologies
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