China Western Semiconductor and Integrated Circuit Industry ExpoCatalog consultation
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Fair basics
Industry scope
IC Design Zone:EDA tools, IP design, embedded software, digital circuit design, analog and mixed-signal circuit design, integrated circuit layout design, and more
Integrated Circuit Manufacturing Zone:Wafer fabrication facilities, foundries, manufacturers of analog, digital, and mixed-signal ICs, and related production processes
Packaging and Testing Zone:Probe stations, test equipment, sorters, packaging machinery, packaging substrates, lead frames, bonding wires, and other essential components
Semiconductor Materials Zone:Silicon wafers and silicon-based materials, photomasks, electronic gases, photoresists and associated reagents, CMP polishing materials, target materials, packaging substrates, lead frames, bonding wires, encapsulating materials, ceramic substrates, chip adhesives, and more
Equipment Manufacturing Zone:Thinning machines, single-crystal furnaces, grinders, heat-treatment equipment, lithography systems, etching machines, ion-implantation devices, CVD/PVD systems, cleaning equipment, dicing saws, wafer loaders, bonding machines, test equipment, sorters, probe stations, and other specialized apparatus
Third-Generation Semiconductor Special Zone:Featuring gallium nitride (GaN), silicon carbide (SiC), zinc oxide (ZnO), diamond, and related materials and application technologies
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