Verified: updated on

Hangzhou Semiconductorslogo

2th

Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition – Hangzhou Changxin Exhibition

SICE

Dates
Show Hours:
Venue
Highlights
A global industry matchmaking platform rooted in the Yangtze River Delta serving the entire semiconductor and integrated circuit value chain.
Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition – Hangzhou Changxin Exhibition

0.00

Buy now

Exhibition Data

1/1
Edition
30000㎡
Exhibition area
500
Exhibitors
36000
Visitors

Hangzhou Semiconductors Expo Details

The Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition—Hangzhou Changxin Exhibition (SICE)—is rooted in the Yangtze River Delta, spanning the entire value chain from design and materials to equipment, manufacturing, and packaging & testing. It focuses on cutting-edge areas such as third-generation semiconductors, advanced packaging, chiplets, EDA tools, and AI chips, bringing together domestic equipment and materials suppliers as well as IC design companies. The event facilitates global supply-and-demand matching across the industry chain, helping to build a secure and resilient local supply‑chain ecosystem.
Industry:
Semiconductors fairHangzhouSemiconductors Expo
Organizer:
Zhejiang Provincial Semiconductor Industry Association
City:
ZhejiangHangzhou
Venue:
Address:
Intersection of Meishi Line and Yannan Line, Xiaoshan District

Profile

The Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition—Hangzhou Changxin Exhibition (SICE)—is anchored in the Yangtze River Delta’s industrial powerhouse, creating a global platform for connecting the integrated circuit industry that integrates showcasing, trading, and networking. With the core mission of “Linking the Chip Ecosystem, Crafting New Opportunities through Intelligent Manufacturing,” the event spans a total exhibition area of 30,000 square meters, comprehensively covering both upstream and downstream segments of the semiconductor value chain.

The semiconductor and integrated circuit industries are pivotal blue‑ocean sectors, serving as key engines, pillars, and hallmarks of future development. As global digital transformation accelerates, their strategic importance continues to grow. Zhejiang Province has now established a complete industrial ecosystem encompassing design, materials, equipment, manufacturing, and packaging & testing, fostering distinctive industrial clusters: one centered on analog chips and power devices around Hangzhou, Shaoxing, Ningbo, and Jiaxing; and another focused on semiconductor materials, clustered in Huzhou, Jinhua, Quzhou, and Lishui.

As China’s “No. 1 City for the Digital Economy,” Hangzhou is home to tech giants such as Alibaba, Hikvision, and New H3C, boasting vast markets for chip applications across cloud computing, AI, security, communications, and other domains. Meanwhile, top-tier institutions like Zhejiang University continuously supply the industry with highly skilled R&D talent.

The Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition—Hangzhou Changxin Exhibition (SICE)—will synergize with regional industry events across the Yangtze River Delta, spotlighting China’s latest technological breakthroughs spanning the entire semiconductor value chain—from equipment and materials to design and manufacturing. The show will place particular emphasis on cutting-edge areas such as third‑generation semiconductors, advanced packaging, chiplets, EDA tools, and AI‑specific chips, striving to build a secure, stable, and resilient domestic supply chain while supporting the Yangtze River Delta in establishing a world‑class integrated circuit industry cluster.

The Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition—Hangzhou Changxin Exhibition (SICE)—will present the global industry with a grand showcase of technologies and products spanning the entire IC value chain, offering an exceptional platform for domestic equipment and materials manufacturers as well as promising IC design firms. It will also attract top international talent to Hangzhou, thereby strongly catalyzing industrial collaboration throughout the Yangtze River Delta.

Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition – Hangzhou Changxin Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

View more

Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition – Hangzhou Changxin Exhibition Range

IC Design/Chips and Applications:
  • EDA ,
  • AI Computing Chips ,
  • Memory Chips ,
  • Automotive Chips ,
  • Smart Home Appliance Chips ,
  • Artificial Intelligence Chips ,
  • Internet of Things ,
  • Artificial Intelligence ,
  • Automotive Electronics ,
  • Smart Cities ,
  • Smart Terminals ,
  • Healthcare and Medical Technology
IC Manufacturing:
  • Semiconductor Wafer Fabrication ,
  • Semiconductor Packaging and Testing Technologies and Products
Advanced Packaging:
  • Flip-Chip ,
  • Bumps ,
  • Wafer-Level Packaging ,
  • 2.5D/3D Advanced Packaging (TSV and TGV) ,
  • Fan-Out Wafer-Level Packaging
Equipment and Instruments:
  • Wafer Processing Equipment ,
  • Semiconductor Packaging Equipment ,
  • Semiconductor Test Equipment ,
  • IC Test Instruments ,
  • SiP Equipment ,
  • 3D Packaging Equipment ,
  • Power Device Equipment
Compound Semiconductors and Power Devices:
  • GaN ,
  • SiC ,
  • Power Devices ,
  • RF Components
Semiconductor Materials:
  • Single-Crystal Silicon ,
  • Silicon Wafers ,
  • Silicon-Based Materials ,
  • Polishing Pads ,
  • Photomasks ,
  • Sputtering Targets ,
  • Polishing Solutions ,
  • Etching Solutions ,
  • Ceramic Packaging Materials ,
  • Bonding Wires ,
  • Lead Frames ,
  • Packaging Substrates ,
  • Photoresists ,
  • Thin-Film Deposition Materials ,
  • Specialty Gases ,
  • Ultrapure Water ,
  • Molding Compounds ,
  • High-Performance Plastics
Core Components:
  • Machine Vision ,
  • Sensors ,
  • Seals ,
  • Precision Bearings ,
  • Metal Components ,
  • Valves ,
  • Silicon Parts ,
  • Robots ,
  • Quartz Components ,
  • Filters ,
  • RF Power Supplies ,
  • Ceramic Components ,
  • ESC Electrostatic Chucks ,
  • Pressure Gauges ,
  • Pumps ,
  • MFC Flow Meters ,
  • Motion Control ,
  • Servo Motors ,
  • Linear Modules ,
  • Cleanroom Cable Chains ,
  • Packaging Molds ,
  • Refrigeration Equipment ,
  • Induction Heaters
AI Computing Power:
  • Servers ,
  • Switches ,
  • Power Supplies ,
  • Liquid Cooling Temperature Control

Booth Sales

吴经理

Mr. WuGold-Medal PM

3 Years Booth Sales

2027 Hangzhou Semiconductors Ticket Sales

Hangzhou Semiconductors Venue

Address: Intersection of Meishi Line and Yannan Line, Xiaoshan District
Hangzhou International Convention Center (New Venue)展馆图
Hangzhou International Convention Center (New Venue)展馆图
Hangzhou International Convention Center (New Venue)实景
Hangzhou International Convention Center (New Venue)展馆图
Hangzhou International Convention Center (New Venue)实景
Hangzhou International Convention Center (New Venue)实景图
Hangzhou International Convention Center (New Venue)展馆图
Hangzhou International Convention Center (New Venue)实景图
Hangzhou International Convention Center (New Venue)实景

Hangzhou Semiconductors Booth Price

Standard booth
Standard booth|9 m² incl. basic setup
Blank booth
Blank booth|From 18 m², construction not included
View Floor PriceBooth Consultation

Process

  1. 1.Submit the business license of the company
  2. 2.Submit product picture and name
  3. 3.Receive exhibition presentation documents and booth drawings
  4. 4.Submit booth application form/Sign booth contract
  5. 5.Pay the contract booth deposit
  6. 6.Prepare for exhibition