Hangzhou International Semiconductor and Integrated Circuit Industry Innovation Exhibition – Hangzhou Changxin ExhibitionCatalog consultation
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Fair basics
Industry scope
IC Design/Chips and Applications: IC and related electronic product design, EDA tools, AI computing chips, memory chips, automotive chips, smart home appliance chips, artificial intelligence chips, as well as products for the Internet of Things, artificial intelligence, automotive electronics, smart cities, intelligent terminals, health care, and more
IC Manufacturing: Semiconductor wafer fabrication, semiconductor packaging and testing technologies, and related products
Advanced Packaging: Flip-chip, bumping, wafer-level packaging, advanced 2.5D/3D packaging (including TSV and TGV), fan-out wafer-level packaging, along with associated design, materials, testing, and equipment
Wafer Processing and Packaging/Testing Equipment: Various precision equipment required for wafer processing, as well as semiconductor packaging equipment, semiconductor test equipment, IC test instruments, advanced packaging process equipment (such as SiP and 3D packaging), and power device manufacturing equipment
Compound Semiconductors and Power Devices: Compound semiconductor materials (, GaN, SiC) and their related products, including power devices, RF components, and upstream equipment and materials
Semiconductor Materials: Monocrystalline silicon, silicon wafers and silicon-based materials, polishing pads, photomasks, sputtering targets, polishing liquids, etching solutions, ceramic packaging materials, bonding wires, lead frames, packaging substrates, photoresists, thin-film deposition materials, specialty gases, ultrapure water, molding compounds, high-performance plastics, and more
Core Semiconductor Components: Machine vision systems, sensors, sealing rings, precision bearings, metal components, valves, silicon/SiC parts, robots, quartz components, filters, RF power supplies, ceramic parts, ESC electrostatic chucks, pressure gauges, pumps, MFC flow meters, motion control systems, servo motors, linear modules, cleanroom cable carriers, packaging molds, refrigeration equipment, induction heaters, and other such components
AI Computing Power: AI chips, servers, switches, power supplies, liquid cooling and temperature control systems, and related infrastructure
Supporting Facilities and Services: Supporting products/cleanrooms, general commercial services/consulting, sales and after-sales service, standards, and other related offerings
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