Shanghai Integrated Circuit Exhibition – Shanghai National Chip Exhibition
NICEVenueNational Exhibition and Convention CenterExhibition hall number: 5.2馆
- 1/1
- Annual
- 30000㎡
- Exhibition area
- 400
- Exhibitors
- 30000
- Visitors
Shanghai Integrated Circuit Exhibition – Shanghai National Chip ExhibitionSame period exhibition
ShanghaiSemiconductors expo Fair Details
- Organizer:
- Ministry of Industry and Information Technology, Ministry of Commerce, Chinese Academy of Sciences, China Council for the Promotion of International Trade
- City:
- Shanghai
- Venue:
- National Exhibition and Convention Center
- Address:
- No. 333, Songze Avenue, Xujing Town, Qingpu District, Shanghai
Shanghai Integrated Circuit Exhibition – Shanghai National Chip ExhibitionProfile
The Shanghai Integrated Circuit Exhibition—Shanghai Guoxin Expo (NICE), held concurrently with the China International Industrial Fair, is anchored by the core principles of “Integrating Chip Intelligence, Coexisting Ecosystems, and Empowering Transactions.” It focuses on establishing a closed-loop ecosystem that bridges chips to real-world application scenarios, enabling end-to-end implementation across the entire value chain—from chip design and specialized manufacturing processes to packaging, integration, and comprehensive solutions.
This exhibition highlights the pivotal role of integrated circuits in key CIIF application domains, such as smart factories, automotive electronics, and embodied intelligence. Leveraging the China International Industrial Fair’s robust industrial ecosystem, the event introduces an innovative “Exhibition + Conference + Precision Matching” model. Concurrently, it hosts the Shanghai Integrated Circuit Ecosystem Conference, industry annual meetings, and numerous specialized forums, complemented by one‑on‑one supply‑demand matchmaking sessions, cross‑border collaboration negotiations, and the introduction of dedicated IC‑sector awards.
As a central hub for the integrated circuit ecosystem, this venue seamlessly integrates technology showcases with precision‑driven business transactions, emphasizing tailored solutions and scenario‑specific adaptations. It offers a one-stop platform for transforming technological innovation into tangible outcomes—strengthening connections, securing contracts, attracting top talent, and capturing prestigious awards—while strategically locking in critical resources from government entities, investors, and skilled professionals to seize emerging growth opportunities.
Spanning over 30,000 square meters, the Shanghai Integrated Circuit Exhibition—Shanghai Guoxin Expo (NICE) brings together more than 400 leading domestic and international integrated circuit companies. As the nation’s premier, highest‑profile professional gathering in the industrial sector, it boasts the most comprehensive industry chain coverage. Backed by the China International Industrial Fair’s substantial visitor traffic, the event aggregates vast, highly targeted industrial resources.
Shanghai Integrated Circuit Exhibition – Shanghai National Chip Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Shanghai Integrated Circuit Exhibition – Shanghai National Chip Exhibition Photos
NICE Exhibitor Directory / E-Magazine
Shanghai Integrated Circuit Exhibition – Shanghai National Chip ExhibitionRange
Integrated Circuit Design and IP Cores:Design of general-purpose and application-specific chips, AI chips, power management chips, sensor chips, RF chips, MCU/MPU master control chips, IP core licensing, EDA design software, and customized chip solution services, among others.
Wafer Fabrication and Foundry Services:Foundry services, advanced process technologies, semiconductor substrates, epitaxial wafers, photolithography, etching, thin-film deposition, and other manufacturing processes tailored to meet the mass-production requirements of mid-to-high-end chips.
Packaging and Testing Technologies and Products:Traditional packaging, advanced packaging (such as Chiplet, SiP, and 2.5D/3D packaging), chip testing equipment, reliability assessment, sorting equipment, packaging materials, and related supporting products and technologies.
Semiconductor Equipment and Core Materials:Semiconductor-specific equipment, including lithography tools, etchers, thin-film deposition systems, cleaning equipment, and inspection devices; as well as core consumables and materials such as photoresists, specialty gases, target materials, polishing slurries, and packaging substrates.
Chip-Based End-Application Solutions:Integrated chip application solutions for industrial control, smart manufacturing, new-energy vehicles, photovoltaic and wind energy, artificial intelligence, the Internet of Things, low-altitude platforms, consumer electronics, security, and communications—enabling deep integration between chips and end-use scenarios.
Booth inquiry for this edition
2026 ShanghaiSemiconductors Ticket inquiry
ShanghaiSemiconductors Venue
ShanghaiSemiconductors Booth Application
Standard booth Configuration
Blank booth Configuration
Process
1.Submit the business license of the company
2.Submit product picture and name
3.Receive exhibition presentation documents and booth drawings
4.Submit booth application form/Sign booth contract
5.Pay the contract booth deposit
6.Prepare for exhibition
