Full Day Tickets
Exhibition Information
- Name
- Shenzhen International Electronics Show & Embedded Systems Exhibition
- Industry
- Electronics
- City
- Shenzhen
- Venue
- No. 1, Exhibition City Road, Peace Community, Fuhai Street, Bao'an District, Shenzhen
- Abbreviation
- ELEXCON
- Dates
- Visitors
- 60000 visitors
- Exhibitors
- 600 exhibitors
Exhibition Introduction
Shenzhen International Electronics Exhibition (ELEXCON)
South China’s flagship platform for electronics and embedded technologies: As a leading specialized exhibition in China’s electronics and embedded technology fields, after more than two decades of development, it has become a pivotal event in Shenzhen and South China, concentrating on cutting-edge electronic and embedded solutions. The 2025 edition brought together 375 global industry leaders and attracted 28,225 professional visitors, 73% of whom held decision-making roles in procurement, technology, or R&D. Attendees spanned seven major application areas, including consumer electronics, automotive, communications, industrial control, and IoT.
One-stop coverage of the entire value chain: Exhibits comprehensively covered core segments such as chips, storage, embedded and edge AI, power and power semiconductors, automotive electronics, electronic components, modules, and system-level solutions. From GPU/MCU/RISC-V processors and embedded AI algorithms to power devices, SiC/GaN, connectors, passive components, advanced semiconductor packaging, and testing & measurement equipment, the show provided engineers and technical decision-makers with a one-stop platform for learning and selecting—from individual components to complete systems, from design to manufacturing.
A global resource linkage hub: The exhibition drew overseas visitors from 52 countries and regions worldwide, with Russia, India, Indonesia, Malaysia, and Japan ranking among the top five source markets. In 2026, it will be co-hosted with CIOE China Optics Expo and IICIE International Integrated Circuit Innovation Expo, creating a super-sized exhibition cluster spanning 340,000 square meters, bringing together over 5,000 exhibitors and attracting more than 240,000 professional visitors, including over 7,000 international attendees from 97 countries and regions.
A vanguard for AI and green technologies: With the theme “All for AI, All for GREEN,” the show focused on cutting-edge areas such as embedded AI and edge computing, AI computing power, embodied intelligence, new-energy vehicle three-electric technologies, intelligent cockpits, SiP, and advanced packaging. The AI zone—featuring AI glasses, AI robots, and AI toys—remained highly popular, while the embodied robotics section showcased innovative solutions in bionic sensing, motion control, and cognitive decision-making, fully demonstrating the latest achievements resulting from the deep integration of AI and electronics.
More than 20 high-profile forums delivering authoritative insights: Concurrent with the exhibition, the 7th China Embedded Technology Conference, the 9th China System-Level Packaging Conference, the New-Energy Vehicle Electronics Innovation Forum, the AI Computing Power Full-Stack Technology Forum, and the China Tour of AI Glasses, among more than 20 specialized conferences, were held. Over 100 speakers engaged in in-depth discussions on hot topics such as edge AI, embodied intelligence, storage technologies, automotive electronics, and machine vision, providing attendees with vertical opportunities for learning and networking.
Effective precision matching between supply and demand: The exhibition specially collaborated with OE Automotive to organize the “Automotive Electronics Supply-Demand Matching Meeting,” inviting numerous vehicle manufacturers and Tier-1 suppliers to engage in targeted negotiations with chip, module, and system vendors, effectively facilitating upstream-downstream alignment. The Kaifa Gala Greater Bay Area Developer/Engineer Carnival adopted an interactive format, enabling participants to delve into technical details and build professional networks.
