Verified: updated on
HOT24th
Shenzhen International Electronics Show & Embedded Systems Exhibition
ELEXCON
- Dates
- Show Hours:
- Highlights
- A regional specialized trade show focusing on electronic components and embedded technologies.
Shenzhen International Electronics Show & Embedded Systems Exhibition Same Period Exhibition
Exhibition Data
- 1/1
- Edition
- 30000㎡
- Exhibition area
- 600
- Exhibitors
- 60000
- Visitors
Shenzhen Electronics Expo Details
- Organizer:
- Bowen Group
- Venue:
- SHENZHEN WORLD EXHIBITION&CONVENTION CENTER
- Address:
- No. 1, Exhibition City Road, Peace Community, Fuhai Street, Bao'an District, Shenzhen
Profile
The Shenzhen International Electronics Show (ELEXCON) serves as a leading domestic professional platform for electronic components and embedded technologies. With the theme “AI for All, Green for All,” it will provide end-to-end technological solutions and supply-chain support for the rapidly growing AI and dual-carbon sectors.
The Shenzhen International Electronics Show (ELEXCON) will showcase cutting-edge products, technologies, and solutions across key areas such as AI and computing chips, storage, embedded AI, power and energy electronics, high-performance electronic components, and the Chiplet heterogeneous integration ecosystem. It offers extensive resources for technology development and component selection to support more than 20 fast-growing industries, including AI hardware, home appliances, power tools, mobility and electric vehicles, new energy, industrial automation, rail transit, and the Internet of Things, thereby driving technological innovation and industrial advancement. During the event, a series of technical forums will also be held to highlight global industry trends and future technology directions.
The Shenzhen International Electronics Show is a premier domestic exhibition for the electronics and embedded systems sectors, widely recognized as a primary platform for hardware and embedded developers, procurement managers, and decision-makers to learn about new technologies, explore innovative products, and make informed component selections. By attending ELEXCON, participants can not only engage directly with large-scale engineers and developers but also establish valuable connections with emerging market segments and ecosystem partners, including smart hardware, home appliances, power tools, mobility and electric vehicles, robotics, power supplies, new energy, intelligent manufacturing, and data centers.
This major domestic electronics expo encompasses three core segments: electronic components, embedded systems, and semiconductors. The Shenzhen International Electronics Show (ELEXCON) brings together over 600 global premium suppliers and more than 60,000 buyers and professional visitors, leveraging its base in Shenzhen to connect exhibitors with the global electronics value chain.
If you are a supplier of electronic components, edge AI and embedded systems, chips, storage, power and power management solutions, connectors, PCBs, modules, test and measurement equipment, or other related products, technologies, and solutions, don’t miss this annual super‑professional event—your one-stop gateway to promoting your offerings and connecting with domestic and international ecosystems and industry resources!
Shenzhen International Electronics Show & Embedded Systems Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.
Partial exhibitor directory and exhibitor list for Shenzhen International Electronics Show & Embedded Systems Exhibition: 保定飞凌嵌入式技术有限公司, 深圳扬兴科技有限公司, 北京大华无线电仪器有限责任公司, 宁波地博电气有限公司, 深圳市浦洛电子科技有限公司, 上海先楫半导体科技有限公司, and others. The 2027 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.
Shenzhen International Electronics Exhibition (ELEXCON)
South China’s flagship platform for electronics and embedded technologies: As a leading specialized exhibition in China’s electronics and embedded technology fields, after more than two decades of development, it has become a pivotal event in Shenzhen and South China, concentrating on cutting-edge electronic and embedded solutions. The 2025 edition brought together 375 global industry leaders and attracted 28,225 professional visitors, 73% of whom held decision-making roles in procurement, technology, or R&D. Attendees spanned seven major application areas, including consumer electronics, automotive, communications, industrial control, and IoT.
One-stop coverage of the entire value chain: Exhibits comprehensively covered core segments such as chips, storage, embedded and edge AI, power and power semiconductors, automotive electronics, electronic components, modules, and system-level solutions. From GPU/MCU/RISC-V processors and embedded AI algorithms to power devices, SiC/GaN, connectors, passive components, advanced semiconductor packaging, and testing & measurement equipment, the show provided engineers and technical decision-makers with a one-stop platform for learning and selecting—from individual components to complete systems, from design to manufacturing.
A global resource linkage hub: The exhibition drew overseas visitors from 52 countries and regions worldwide, with Russia, India, Indonesia, Malaysia, and Japan ranking among the top five source markets. In 2026, it will be co-hosted with CIOE China Optics Expo and IICIE International Integrated Circuit Innovation Expo, creating a super-sized exhibition cluster spanning 340,000 square meters, bringing together over 5,000 exhibitors and attracting more than 240,000 professional visitors, including over 7,000 international attendees from 97 countries and regions.
A vanguard for AI and green technologies: With the theme “All for AI, All for GREEN,” the show focused on cutting-edge areas such as embedded AI and edge computing, AI computing power, embodied intelligence, new-energy vehicle three-electric technologies, intelligent cockpits, SiP, and advanced packaging. The AI zone—featuring AI glasses, AI robots, and AI toys—remained highly popular, while the embodied robotics section showcased innovative solutions in bionic sensing, motion control, and cognitive decision-making, fully demonstrating the latest achievements resulting from the deep integration of AI and electronics.
More than 20 high-profile forums delivering authoritative insights: Concurrent with the exhibition, the 7th China Embedded Technology Conference, the 9th China System-Level Packaging Conference, the New-Energy Vehicle Electronics Innovation Forum, the AI Computing Power Full-Stack Technology Forum, and the China Tour of AI Glasses, among more than 20 specialized conferences, were held. Over 100 speakers engaged in in-depth discussions on hot topics such as edge AI, embodied intelligence, storage technologies, automotive electronics, and machine vision, providing attendees with vertical opportunities for learning and networking.
Effective precision matching between supply and demand: The exhibition specially collaborated with OE Automotive to organize the “Automotive Electronics Supply-Demand Matching Meeting,” inviting numerous vehicle manufacturers and Tier-1 suppliers to engage in targeted negotiations with chip, module, and system vendors, effectively facilitating upstream-downstream alignment. The Kaifa Gala Greater Bay Area Developer/Engineer Carnival adopted an interactive format, enabling participants to delve into technical details and build professional networks.
Range
- Chip and processor brands: Infineon, Renesas Electronics, GigaDevice, National Technology, Unisoc, Zhongwei Semiconductor, Eastchip Semiconductor, Jihai Semiconductor, Lingdong Microelectronics, Huichun Technology, Xinchip Technology, Jiefa Technology, Silergy, Yateli, Zhongke Benyuan, Anlu Technology, Gaoyun Semiconductor, HuaDa Electronics, Juxin Technology
- Storage technology and solution brands: Yangtze Memory, Jiangbo Long, Hikvision Storage, Demingli, Langke, Kangying Semiconductor, Puran, Shichuangyi, Huaxinxing, YuZhan, Kingston, Chituo Technology, Liji Storage, Kangxinwei
- Power devices and discrete component brands: Yangjie Technology, Jiejie Microelectronics, Silergy, Shanghai Bailing, Weizhao Semiconductor, Zhenmaojia, Sarei Micro, Xin’an Semiconductor, Fujie Electronics, Jiangzhi Technology, Xinyan Semiconductor, Jian’er Semiconductor
- Passive components and connector brands: Sunlord Electronics, Yuyang Technology, Fenghua High-Tech, Weirong Technology, Sanhuan Group, Keda Jia, Cenke, Maijie Technology, Mingji High-Tech, Changjiang Connectors, Conisheng
- Advanced manufacturing and packaging brands: Peidun Technology, YueMo Advanced, Huatian Technology, Yicheng Technology, Otes, Siemens EDA, Xindong Technology, Hongkuai, YinTai, Mitsui Metals, Heraeus, Delong Laser, Zhengju Intelligent, Taikesite, Huaxin Intelligent, Guangze Technology
- Testing, measurement, and instrument brands: Keysight Technologies, Tektronix, Puyuan Precision Electric, Tonghui Electronics, Dingyang Technology, Zhiyuan Electronics
- Robotics technology and core component brands: Leisai Intelligent, Buko, Feixi Robotics, Yuejiang Technology, Dahuan Robotics, Xinjingcheng, Pasini Sensing Technology, Yihai Original Recognition, Hualichuang Science, Gaochuang Transmission
- Electronic component distribution platforms: Zhongdian Port, Mouser Electronics, DigiKey, Huaqiang Group, Jingbeitongyu, Yonghui Commerce, Pairui Electronics, Mengxiang Number
- Automotive electronics and solution brands: BYD Semiconductor, Huichuan Technology, Bosch, United Electronics, Desay SV, Junsheng Electronics, Huayang Group, Luchang Technology
- Operating system and software brands: RT-Thread, Wind River OpenThings, SYSGO, Advantech, Chuanglong Technology, Tianqian, Ruixun Technology, Yihui Information, PuHua Software
- AI and edge computing brands: Alibaba DAMO Academy, Qualcomm, Arm Holdings, Imagination, Rockchip, Allwinner Technology, Jingchen Semiconductor, Yizhi Electronics, Neng, Kuixin Microelectronics
Review
The 2025 Shenzhen International Electronics Show and Embedded Systems Exhibition concluded successfully, empowering industrial innovation through precise matchmaking, with AIoT and embodied intelligence emerging as the clear focal points.
The 2025 Shenzhen International Electronics Show and Embedded Systems Exhibition was recently held at the Shenzhen Convention & Exhibition Center. This edition of the event precisely targeted cutting-edge industry trends, attracting an exhibition space exceeding 30,000 square meters and a vast audience of professionals. Over 73% of attendees held purchasing or technical decision-making authority, underscoring the show’s high quality and influence as a premier platform for trade and technological exchange within China’s electronics sector. The visitor profile was dominated by key decision-makers across the supply chain, with R&D/design engineers, manufacturers, and suppliers forming the core audience. Their primary objectives were clear: to stay abreast of industry trends, identify new suppliers, and discover innovative products—factors that directly facilitated efficient, targeted business connections between exhibitors and buyers.
AIoT and automotive electronics led the way, while embodied intelligence made a strong emergence: among the sectors represented, home appliances, new energy, and smart hardware ranked first, second, and third in the consumer electronics segment. Meanwhile, the embedded systems and AIoT segments—key indicators of future technology adoption—clearly highlighted the mainstream tracks for practical implementation: industrial automation, AIoT solutions, and automotive electronics occupied the top three positions in terms of demand. Notably, “embodied intelligent robotics,” as an emerging focus area, has risen rapidly to become one of the most sought-after application domains, alongside smart homes and intelligent healthcare, collectively painting a comprehensive picture of the future landscape of smart devices.
Molun Technology showcases groundbreaking innovations: exhibiting companies such as Molun Technology prominently featured their latest tactile sensing technologies, core sensors, and the “MARA + Embodied Intelligence” low-power solution, successfully drawing significant attention from both professional visitors and potential partners. These efforts not only enhanced brand visibility but also resulted in numerous expressions of intent for collaboration across robotics, new energy, and healthcare sectors.
ELEXCON 2027 Venue Map
ELEXCON Exhibitior List
Shenzhen International Electronics Show & Embedded Systems Exhibition Range
Is my product suitable?Electronic Components
Embedded Systems
Power and Energy Electronics
Booth Sales
Mr. WuGold-Medal PM
3 Years Booth Sales
2027 Shenzhen Electronics Ticket Sales
Mr. HanGold-Medal PM
3 Years Booth Sales
Ms. LiuGold-Medal PM
3 Years Booth Sales
Shenzhen Electronics Venue
Shenzhen Electronics Booth Price
Process
- 1.Submit the business license of the company
- 2.Submit product picture and name
- 3.Receive exhibition presentation documents and booth drawings
- 4.Submit booth application form/Sign booth contract
- 5.Pay the contract booth deposit
- 6.Prepare for exhibition