Shenzhen International Electronics Exhibition & Embedded Systems Exhibition

Shenzhen International Electronics Exhibition (ELEXCON) serves as a key domestic platform for electronic components and embedded technologies. With the theme “AI for All, AI for Green,” it will provide end-to-end technological solutions and supply-chain support for the rapidly advancing fields of artificial intelligence and carbon neutrality.

Shenzhen International Electronics Exhibition (ELEXCON) will showcase cutting-edge products, technologies, and solutions across areas such as AI and computing chips, storage, embedded AI, power and energy electronics, high-performance electronic components, and the Chiplet heterogeneous integration ecosystem. It offers extensive resources for technology development and component selection to more than 20 fast-growing industries—including AI hardware, home appliances, power tools, mobility and electric vehicles, new energy, industrial automation, rail transit, and the Internet of Things—thereby driving technological innovation and industry growth. During the event, a series of technical forums will also be held to highlight global industry trends and future technology directions.

The Shenzhen International Electronics Exhibition is a premier domestic trade show for the electronics and embedded systems sectors, widely recognized as a leading platform for hardware and embedded developers, procurement managers, and decision-makers to learn about new technologies, explore innovative products, and make informed component selections. By attending ELEXCON, exhibitors can not only engage directly with a large community of engineers and developers but also establish valuable connections with emerging market segments and ecosystem partners, including smart hardware, home appliances, power tools, mobility and electric vehicles, robotics, power supplies, new energy, smart manufacturing, data centers, and more.

This major domestic electronics exhibition encompasses three core segments: electronic components, embedded systems, and semiconductors. Shenzhen International Electronics Exhibition (ELEXCON) brings together over 600 globally renowned suppliers and attracts more than 60,000 buyers and professional visitors from both China and abroad, leveraging its strategic location in Shenzhen to connect participants with the global electronics value chain.

If you are a supplier of electronic components, edge AI and embedded systems, chips, storage, power and power management solutions, connectors, PCBs, modules, or test-and-measurement equipment, don’t miss this annual flagship trade show—a one-stop platform for promoting your offerings and forging strategic partnerships with domestic and international ecosystems and industry stakeholders!

Shenzhen International Electronics Exhibition & Embedded Systems Exhibition tickets are e-tickets. Mainland China visitors must complete online pre-registration with real-name ID verification; overseas visitors must use passport verification; Hong Kong, Macao, and Taiwan visitors must use their travel permit. On site, verify entry with your ID card or by scanning the e-ticket QR code.

Partial exhibitor directory and exhibitor list for Shenzhen International Electronics Exhibition & Embedded Systems Exhibition: 深圳华芯星半导体有限公司, 深圳市联特佳精密科技有限公司, 苏州慧捷自动化科技有限公司, 深圳市熙源微电子有限公司, 广州市九芯电子科技有限公司, and others. The 2026 edition is expected to feature 500+ exhibiting companies. To obtain the full exhibitor directory (including booth numbers and contact details), please visit the official exhibition website or contact Jufair.

Shenzhen International Electronics Exhibition (ELEXCON)

The Flagship Platform for Electronics and Embedded Technologies in South China: As a premier trade show dedicated to the electronics and embedded technologies sectors in China, ELEXCON has grown over more than twenty editions into a key event in Shenzhen and throughout South China, focusing on cutting-edge electronic and embedded solutions. In 2025, the exhibition will bring together 375 leading global companies and attract 28,225 professional visitors, with 73% holding decision-making authority in procurement, technology, or R&D. Attendees span seven major application domains, including consumer electronics, automotive, communications, industrial control, and the Internet of Things.

End-to-End Coverage Across the Entire Industry Chain: The exhibit lineup comprehensively covers core segments such as chips, storage, embedded systems and edge AI, power supplies and power semiconductors, automotive electronics, electronic components, modules, and system-level solutions. From GPUs, MCUs, and RISC‑V processors to embedded AI algorithms, power devices, SiC/GaN, connectors, and passive components—alongside advanced semiconductor packaging and test & measurement equipment—the show provides engineers and technical decision-makers with a one-stop platform for learning and sourcing, spanning everything from discrete parts to complete systems and from design to manufacturing.

A Global Hub for Connecting Resources: The exhibition draws international visitors from 52 countries and regions, with Russia, India, Indonesia, Malaysia, and Japan ranking among the top five source markets. In 2026, ELEXCON will be held concurrently with CIOE China Optics Expo and IICIE International Integrated Circuit Innovation Expo, creating a super-sized exhibition cluster spanning 340,000 square meters. Together, these three events will host over 5,000 exhibitors and attract more than 240,000 professional visitors, including over 7,000 international attendees from 97 countries and regions.

A Vanguard for AI and Green Technologies: Centered around the theme “All for AI, All for GREEN,” the show highlights前沿 areas such as embedded AI and edge computing, AI computing power, embodied intelligence, new‑energy vehicle “three‑electric” technologies, intelligent cockpits, and SiP and advanced packaging. The AI Zone—featuring AI glasses, robots, and toys—remains highly popular, while the Embodied Robotics Zone showcases innovative solutions in bionic sensing, motion control, and cognitive decision‑making, offering a comprehensive showcase of the latest advancements at the intersection of AI and electronics.

More Than 20 High‑Level Forums Empowering Industry Leaders: Concurrent with the exhibition, the seventh China Embedded Technology Conference, the ninth China System‑Level Packaging Conference, the New‑Energy Vehicle Electronics Innovation Forum, the AI Computing Power Full‑Stack Technology Forum, and the China Tour of AI Glasses, among others, will convene over 20 specialized conferences. More than 100 speakers will engage in in-depth discussions on hot topics such as edge AI, embodied intelligence, storage technologies, automotive electronics, and machine vision, providing attendees with focused opportunities for learning and networking.

Precision‑Driven Sourcing and Supply‑Chain Matching Ensured: The exhibition has partnered with OE Automotive to host the “Automotive Electronics Sourcing and Supply‑Chain Matchmaking Event,” inviting numerous OEMs and Tier‑1 suppliers to participate. Through targeted negotiations with chip, module, and system providers, the event effectively facilitates alignment between upstream and downstream players. Meanwhile, the Kaifa Gala Greater Bay Area Developer/Engineer Carnival adopts an interactive format, enabling participants to delve into technical details and forge valuable professional connections.

Notable exhibitors

• Chip and Processor Brands: Infineon, Renesas Electronics, GigaDevice, National Technology, UNISOC, Zhongwei Semiconductor, Dongxin Semiconductor, Jihai Semiconductor, Lingdong Microelectronics, Huichun Technology, CoreX Technology, Jiefa Technology, Silergy, Atermiter, Zhongke Benyuan, Anlu Technology, Gaoyun Semiconductor, HuaDa Electronics,炬芯科技
• Storage Technologies and Solutions Brands: Yangtze Memory, Jiangbo Long, Hikvision Storage, Demingli, Langke, Kangying Semiconductor, Puran, Shichuangyi, Huaxinxing, Apacer, Kingston, Chitop Technology, Liji Storage, Kangxinwei
• Power Devices and Discrete Components Brands: Yangjie Technology, Jetech Microelectronics, Silergy, Shanghai Belling, Weizhao Semiconductor, Zhenmaojia, Saree Micro, Xin’an Semiconductor, Fujie Electronics, Jiangzhi Technology, Xinyan Semiconductor, Jiaen Semiconductor
• Passive Components and Connectors Brands: Sunlord Electronics, Yuyang Technology, Fenghua High-Tech, Weirong Technology, Sanhuan Group, Keda Jia, Cenke, Majie Technology, Mingji High-Tech, Changjiang Connectors, Conisheng
• Advanced Manufacturing and Packaging & Testing Brands: Paiton Technology, Yuemo Advanced, Huatian Technology, Yicheng Technology, AT&S, Siemens EDA, Xindong Technology, Hongkuai, Indium Tech, Mitsui Metals, Heraeus, Delong Laser, Zhengju Intelligence, Taikesite, Huaxin Intelligence, Guangze Technology
• Test, Measurement, and Instrumentation Brands: Keysight Technologies, Tektronix, Rigol, Tonghui Electronics, Dingyang Technology, Zhiyuan Electronics
• Robotics Technologies and Core Components: Leisai Intelligence, Buko, Feixi Robotics, Yuejiang Technology, Dahuan Robotics, Xinjingcheng, Pasini Sensing Technology, Yihai Yuanshi, Hualichuang Science, Gaochuang Transmission
• Electronic Components Distribution Platforms: China Electronics Port, Mouser Electronics, Digi-Key, Huaqiang Group, Jingbeitongyu, Yonghui Commerce, Pairui Electronics, Mengxiang Hao
• Automotive Electronics and Solutions Brands: BYD Semiconductor, Inovance Technology, Bosch, United Electronics, Desay SV, Junsheng Electronics, Huayang Group, Luchang Technology
• Operating Systems and Software Brands: RT-Thread, Wind River, SYSGO, Advantech, Chuanglong Technology, Tianqin, Ruixun Technology, Yihui Information, Puhua Software
• AI and Edge Computing Brands: Alibaba DAMO Academy, Qualcomm, Arm Holdings, Imagination, Rockchip, Allwinner Technology, Amlogic Semiconductor, Yizhi Electronics, Nenergy, CoolCore Microelectronics