Shenzhen International Electronic Circuit Exhibition

The 2025 International Electronic Circuit (Shenzhen) Exhibition (HKPCA Show) was successfully held from December 3 to 5 at Halls 5–8 of the Shenzhen International Convention and Exhibition Center (Bao’an). Hosted by the Hong Kong Printed Circuit Board Association, the event was themed “Quality Life · AI—PCB Business Opportunities Shine,” and stood as the most significant annual platform for technological exchange and business matchmaking in the global PCB and electronic assembly industries.

In terms of exhibition scale, this edition covered an exhibition area of 80,000 square meters, featuring 3,656 booths across nine major thematic zones. These zones encompassed circuit board manufacturers, equipment suppliers, raw material providers, electronic assembly, smart manufacturing, environmental protection and clean technologies, packaging and testing technologies, precision components and parts, as well as dedicated sections for Japan and South Korea, fully showcasing the entire industry value chain—from materials to final packaging and testing. The show attracted a total of 77,508 professional visitors, reaching over 70 countries and regions worldwide. Concurrently, 38 specialized conferences were held, drawing 3,390 attendees.

The exhibitor lineup exhibited internationalization and a concentration on leading players. This year’s event brought together more than 600 world-class enterprises, including renowned brands such as Zhizhuo Feigao, Shenzhen Printronix Circuit, Jinfubao, Tiancheng Industrial & Trading, YingSu, Texin, Zhisheng, Tianjun, Yuanzhuo Micronano, Global, Bangzheng, Dongwei, Baode, Beijia, Kaima, Dacheng Energy Saving, Dongfang Yuzhiguang, Jinlong, Jiuchuan, Yuzhou, Mude, Jiejun, Yingyan, Guanghua Technology, Amet, Zhengtianwei, Hafu, Wangping Precision, Lixuan, WKK, Asia Electroplating, Jiantao, Xundede, Weijia, Qunyi, Xinqi Micro‑Assembly, Haochuangsheng, Baofengtang, Sijie, Mingda, Yinghua, XACT, Carl Zeiss, Amiba, YueNiu, Jinjing Electronics, and many others. In addition, over 100 emerging companies—including Dingtai High‑Tech and Rixiang—made their debut, underscoring the sector’s vibrant spirit of innovation.

Exhibits showcased remarkable highlights, with AI and high‑frequency/high‑speed technologies as central themes. Driven by the explosive growth of AI computing power and surging downstream demand from sectors such as new energy vehicles and data centers, this year’s HKPCA Show focused on two key pillars—AI and high‑frequency/high‑speed technologies—highlighting groundbreaking innovations spanning the entire value chain, from upstream materials and core equipment to downstream applications. In the smart manufacturing zone, Dongwei Technology unveiled a cutting‑edge PCB etching machine equipped with an intelligent spot‑spray compensation system, paired with a proprietary super‑vacuum suction blade and dual‑fluid etching technology, achieving etching uniformity exceeding 96%. A prototype has already been delivered to a leading customer in Taiwan, with real‑world performance demonstrating uniformity above 97%. Meanwhile, in the environmental protection and clean technologies section, Longde Xingye Technology introduced a “micro‑etchant online circulation and copper recovery system,” enabling the recovery of copper resources from spent micro‑etchants while allowing the regenerated etchant to be recycled back into the production line, thus achieving both resource recovery and waste reduction.

The packaging and testing technologies zone made its debut, becoming one of the exhibition’s standout features. Aligned with industry trends, the HKPCA Show launched two new specialized zones—the Packaging and Testing Technologies Zone and the Precision Components and Parts Zone. The former showcases advanced packaging and testing equipment, critical materials, and innovative processes, aiming to break down technical barriers between PCB fabrication and final packaging/testing stages; the latter covers connectors, precision molds, and other complementary products, enhancing upstream–downstream coordination throughout the supply chain. These initiatives effectively support technological upgrades and collaborative development across the industry’s supporting segments.

Concurrent conference activities gathered top-tier industry expertise. Nearly 40 high‑profile technical conferences were held during the event. International technical sessions featured distinguished experts and senior executives from Prismark, five institutes under the Ministry of Industry and Information Technology, ZTE, TTM, Austar, Bomine Electronics, and other leading organizations, who shared multi‑dimensional insights on market trends, cutting‑edge technologies, and other前沿 topics. The “Smart PCB: AI Trends and Innovative Technologies” conference, in particular, addressed hot issues such as AI, advanced packaging, IC substrates, high‑speed interconnects, and smart manufacturing, providing valuable decision‑making guidance for the industry’s transformation and upgrading. The exhibition also organized VIP tours, guided visits for professional buyers, and tailored business‑matching programs, ensuring precise alignment between supply and demand.